Pretreatment method and pretreatment system for diamond wire saw core wire

A diamond wire saw and pretreatment technology, which is applied in the direction of metal sawing equipment, tool trimming of sawing machine devices, metal processing equipment, etc., can solve the problem of not being able to effectively increase the adhesion of resin adhesives on the core wire, etc., to achieve The effect of reducing broken wires, reducing waste, and ensuring cutting accuracy

Active Publication Date: 2014-10-29
苏州科弗曼机械有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the pretreatment of the core wire before the production of the diamond wire saw is only a simple degreasing treatment, which cannot effectively increase the adhesion of the resin adhesive on the core wire

Method used

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  • Pretreatment method and pretreatment system for diamond wire saw core wire
  • Pretreatment method and pretreatment system for diamond wire saw core wire
  • Pretreatment method and pretreatment system for diamond wire saw core wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] refer to figure 1 , figure 1 It is a schematic flowchart of a diamond wire saw core wire pretreatment method provided by an embodiment of the present invention, and the method includes steps:

[0044] Step S1: Roughening the surface of the core wire.

[0045] There are two ways to roughen the surface of the core wire: one is to use a grinding roller to grind the surface of the core wire; the other is to use an acid solution to corrode the surface of the core wire.

[0046] For the first case, you can wrap sandpaper on the surface of the grinding roller (the model is, for example, No. 1000), and make the core wire enter between the two grinding rollers along a specific guide wheel, and the two grinding rollers rotate in opposite directions. Moreover, the rotational speed of the grinding roller should be lower than the speed at which the core wire is transmitted along the guide wheel. Specifically, the relative speed of the two can be set to 0.05m / s. After the core wir...

Embodiment 2

[0054] The pretreatment method for roughening the surface of the diamond wire saw core wire is described in detail in the first embodiment. On the basis of the first embodiment, this embodiment combines degreasing and activation treatment for the pretreatment method of the diamond wire saw core wire Describe in detail.

[0055]refer to figure 2 , figure 2 It is a schematic flow chart of another diamond wire saw core wire pretreatment method provided by the embodiment of the present invention. The method includes the following steps:

[0056] Step S11: Roughening the surface of the core wire.

[0057] The surface of the core wire is roughened as described in step S1 in the first embodiment. It should be noted that if the surface of the core wire is roughened by acid, after this step, the surface of the core wire needs to be ultrasonically cleaned with pure water to remove the acid on the surface of the core wire, and then proceed to the next step.

[0058] Step S12: Ultra...

Embodiment 3

[0089] The pretreatment method of the diamond wire saw core wire provided by the present invention has been described in detail above, and the pretreatment system of the diamond wire saw core wire provided by the present invention will be described in detail below.

[0090] refer to image 3 , image 3 It is a schematic structural diagram of a pretreatment system for a diamond wire saw core wire provided by the present invention. The pretreatment system includes: a roughening device 101 for roughening the surface of the core wire; for removing metal residues on the surface of the core wire or a degreasing device 102 for grease; a cleaning device 103 for performing pure water ultrasonic cleaning on the roughened core wire; a drying device 104 for drying the cleaned core wire; An activation device 105 for activating the wire surface.

[0091] Wherein, the roughening device 101 can be a grinding roller or an acid corrosion device; the drying device 104 can be a hot air blower; ...

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Abstract

The embodiment of the invention discloses a pre-treatment method and a pre-treatment system for a core wire of a diamond wire saw. The pre-treatment method comprises the following steps of: 1) performing roughening treatment on the surface of the core wire; 2) performing ultrasonic cleaning on the core wire in pure water; and 3) performing drying treatment on the wire core. According to the method and the system, the surface roughening treatment is performed on the core wire of the diamond wire saw before the diamond wire saw is produced, so that the surface area of the core wire of the diamond wire saw is increased, and the roughness of the core wire of the diamond wire saw can be improved; and therefore, the adhesion force of a resin adhesive on the core wire of the diamond wire saw can be enhanced, the occurrence probability of the block-form falling-off phenomenon of diamond particles due to the insufficient adhesion force of the resin adhesive is decreased, and the occurrence probability of the wire breakage phenomenon of the diamond wire saw during a cutting process due to an insufficient cutting force is decreased, thus guaranteeing the cutting accuracy and the cutting efficiency of the diamond wire saw, prolonging the service life of the diamond wire saw, and avoiding the waste of cut materials.

Description

technical field [0001] The invention relates to the technical field of diamond wire saw cutting, and more specifically, to a pretreatment method and a pretreatment system for a diamond wire saw core wire. Background technique [0002] In today's world, due to the increasingly prominent energy crisis, the continuous development of the solar industry has been promoted. Silicon wafers are the carrier of solar cells. The quality of silicon wafers directly determines the conversion efficiency of solar cells. If the cutting thickness of the silicon wafer is not accurate and the incision is not ideal, it will not only cause waste of raw material crystal silicon, but also affect the quality of the silicon wafer. [0003] With the continuous development of science and technology, people have higher and higher requirements for the cutting quality of silicon wafers, and then require cutting tools not only to have less pollution and less material consumption during the cutting process, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23D63/00
Inventor 刘伟何建霞鲁战锋
Owner 苏州科弗曼机械有限公司
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