Method for preparing self-healing silicon carbide ceramic-based composite material
A technology of composite materials and silicon carbide, which is applied in the field of preparation of silicon carbide ceramic matrix composite materials, can solve the problems of weakening the self-healing and anti-oxidation ability of ceramic matrix composite materials, and it is difficult to ensure uniform dispersion of active powder fillers, etc. The effect of strong healing and anti-oxidation ability, short preparation cycle and low preparation cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Example Embodiment
[0020] The present invention will be described in further detail below. A preparation method of a self-healing silicon carbide ceramic matrix composite material is characterized in that the preparation steps are as follows:
[0021] 1. Preparation of silicon carbide fiber preform: using continuous silicon carbide fiber as raw material to prepare silicon carbide fiber preform, its structure is: 2-dimensional fiber layup, 2.5-dimensional fiber weaving, 3-dimensional fiber weaving or 3-dimensional fiber needle punching felt;
[0022] 2. Preparing the precursor dipping solution: use polycarbosilane and trimethylaminoborane polymer as the solute and xylene as the solvent to prepare the precursor dipping solution. The weight percentage of the solute in the precursor dipping solution is 45%-60%. The weight percentage of polycarbosilane in the solute is 60%-85%;
[0023] 3. Preparation of silicon carbide fiber preform interface layer: Place the silicon carbide fiber preform in a chemical v...
Example Embodiment
[0034] Example 1
[0035] 1. Preparation of silicon carbide fiber preform: a 3-dimensional fiber woven silicon carbide fiber preform is prepared using continuous silicon carbide fibers as raw materials.
[0036] 2. Preparation of precursor dipping solution: use polycarbosilane and trimethylaminoborane polymer as the solute, and xylene as the solvent to prepare the precursor dipping solution. The weight percentage of the solute in the precursor dipping solution is 60%, polycarbosilane The weight percentage of the solute is 55%;
[0037] 3. Preparation of silicon carbide fiber preform interface layer: Place the silicon carbide fiber preform in a chemical vapor deposition furnace and use propane as the gas source to prepare the pyrolysis carbon interface layer of the silicon carbide fiber preform. The process conditions for chemical vapor deposition are as follows: : Propane flow rate 2L / min; N 2 Flow rate 2L / min; furnace pressure≤2KPa; temperature 1000℃; deposition time 10h;
[0038] 4...
Example Embodiment
[0048] Example 2
[0049] 1. Preparation of silicon carbide fiber preform: a 3-dimensional fiber woven silicon carbide fiber preform is prepared using continuous silicon carbide fibers as raw materials.
[0050] 2. Preparation of precursor dipping solution: use polycarbosilane and trimethylaminoborane polymer as the solute, and xylene as the solvent to prepare the precursor dipping solution. The weight percentage of the solute in the precursor dipping solution is 60%, polycarbosilane The weight percentage of the solute is 66.7%;
[0051] 3. Preparation of silicon carbide fiber preform interface layer: Place the silicon carbide fiber preform in a chemical vapor deposition furnace and use propane as the gas source to prepare the pyrolysis carbon interface layer of the silicon carbide fiber preform. The process conditions for chemical vapor deposition are as follows: : Propane flow rate 2L / min; N 2 Flow rate 2L / min; furnace pressure 2KPa; temperature 1000℃; deposition time 5h;
[0052] ...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap