Colloidal nickel activation solution for non-metallic surface activation and preparation method thereof

Abstract

The invention discloses colloid nickel activation solution used for non-metal-based surface activation, comprising the following components: 10-30g / L of NiCl2.6H2O, 10-20g / L of gelatine, 20-150g / L of hydrazine hydrate, 0.5-2g / L of OP-10 and the balance of deionized water. Colloid nickel is selected for substituting precious metals such as colloid palladium and colloid silver, and non-toxic hydrazine hydrate is selected as a reducing agent, so that the product cost is greatly reduced. The prepared colloid nickel particles are small, the activity is higher compared with the condition that a colloid copper activation solution is used when chemical copper deposition is carried out on an activation layer, and sodium hypophosphite is used as the reducing agent, so that safety and health hidden troubles caused by formaldehyde used in the traditional copper deposition process can be avoided; and a binding force between a non-metal base material which is subjected to activation with the activation solution and the chemical copper deposition and a coating is more than 1.2kg / cm and is obviously superior to that of the currently-used colloid copper activation solution. The activation solution disclosed by the invention is universally applicable to activation of non-metal base materials such as ceramic, plastic, piezoelectric ceramic and PCB (printed circuit board) through holes before the chemical copper deposition or copper plating.

Description

technical field [0001] The invention relates to an activation liquid for non-metallic surface activation, in particular to a colloidal nickel activation liquid for non-metallic surface activation and a preparation method thereof, which is suitable for non-metallic substrates such as ceramics, plastics, piezoelectric ceramics, and PCB through holes. Electroless copper or activation prior to copper plating. Background technique [0002] Most non-metallic materials are non-conductors, and a conductive film must be prepared before electroplating. The commonly used method is electroless plating. Before electroless plating, the surface of the non-metallic substrate must be pretreated, that is, activation is required, so that a certain amount of activation centers are adsorbed on the surface of the non-metallic substrate to induce subsequent electroless plating. So far, the activation process on the surface of non-metallic substrates has entered the third generation activation pro...

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Problems solved by technology

[0003] At present, when the third-generation activation process is used to activate the non-metallic surface before chemical plating (generally electroless copper deposition), the activation solution used basically uses colloidal palladium, colloidal silver and other precious metal colloids to activate the non-metallic surface, and then Electroless copper or electroplated metal, but because palladium and silver are rare precious metals, the application of sustainable development is limited

In order to save precious metals, colloidal copper activation solution is currently used to activate non-metallic surfaces before electroless copper deposition or metal plating, but studies have shown that the activity of colloidal copper activation solution and the adhesion of colloidal particles on the surface of non-metallic substrates are not ideal enough.

At the same time, when using the colloidal activation solution of the above metals (such as palladium, silver and copper), formaldehyde must be used as a reducing agent in the subsequent chemical copper precipitation process, and formaldehyde is volatile, which not only pollutes the environment, but also Bodily injury to operator

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