High-strength high-toughness epoxy resin adhesive and preparation method thereof

A tough epoxy resin and epoxy resin technology, which is applied in the field of epoxy adhesive preparation, can solve the problem that the technical requirements of wind turbine blades cannot be met, the technical requirements of wind turbine blades cannot be met, and the material strength and modulus decrease, etc. problem, to achieve the effect of good toughness, high strength and excellent adhesion

Active Publication Date: 2013-02-13
JIANGSU NEW UNITED HEAVY IND SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] "A Wind Power Grade Two-Component Epoxy Adhesive and Its Preparation Method" (publication number: CN101550325A, publication date: October 7, 2009) and "an improved wind power blade structural adhesive" disclosed in Chinese patent documents Permanent Epoxy Resin and Preparation Method” (publication number: CN101525439A, publication date: September 9, 2009), they all introduce flexible segments into epoxy resin molecules (CN101550325A introduces acrylic chains, CN101525439A introduces Polyurethane chain) to improve the flexibility of the epoxy resin adhesive, but this will lead to a decrease in the strength and modulus of the material, which cannot meet the technical requirements of wind turbine blades above the megawatt level
CN101851481A, published on October 6, 2010, adjusts the strength and modulus of the adhesive through the introduction of fibrous fillers, but its comprehensive performance can only meet the technical requirements of low-power blades, and cannot meet the technical requirements of wind turbine blades above 3MW. Require

Method used

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  • High-strength high-toughness epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A high-strength and high-toughness epoxy resin adhesive, the adhesive is composed of two components A and B, wherein, in parts by weight,

[0024] Component A is composed of the following substances: bisphenol A epoxy resin: 90 parts; bisphenol F epoxy resin: 12 parts; ethylene glycol glycidyl ether: 10 parts; KH560: 2.5 parts; glass fiber: 9 parts; White carbon black: 12 parts; Nano zinc borate: 3 parts;

[0025] Component B is composed of the following materials: linear polyetheramine D230: 8 parts; linear polyetheramine D400: 2 parts; T-type polyetheramine T403: 25 parts; T-type polyetheramine T5000: 3 parts; DDS: 1 part; KH550: 2.3 parts; DMP-30: 2.5 parts; glass fiber: 8 parts; fumed silica: 5 parts; yellow pigment: 0.02 parts;

[0026] Mix the two components A and B according to the mass ratio of 100:40, apply it on the bonding part, cure at 80°C for 2 hours, and cure at 120°C for 2 hours.

Embodiment 2

[0028] A high-strength and high-toughness epoxy resin adhesive, the adhesive is composed of two components A and B, wherein, in parts by weight,

[0029] Component A is composed of the following materials: bisphenol A epoxy resin: 75 parts; bisphenol F epoxy resin 25 parts; polypropylene glycol glycidyl ether: 13 parts; KH560: 2 parts; glass fiber: 11 parts; fumed white carbon Black: 15 parts; Nano calcium carbonate 1 part; Green pigment: 0.01 part;

[0030] Component B is composed of the following materials: linear polyetheramine D230: 6 parts; linear polyetheramine D400: 2 parts; T-type polyetheramine T403: 21 parts; T-type polyetheramine T5000: 4 parts; IPDA: 7 parts; DDM: 1 part; KH550: 2.1 parts; DMP-30: 2 parts; glass fiber: 7 parts; fumed silica: 6 parts; blue pigment: 0.02 parts;

[0031] Mix the two components of A and B according to the mass ratio of 100:42, apply it on the bonding part, and cure it at 80°C for 2 hours, and at 120°C for 2 hours.

Embodiment 3

[0033] A high-strength and high-toughness epoxy resin adhesive, the adhesive is composed of two components A and B, wherein, in parts by weight,

[0034] Component A consists of the following substances: bisphenol A epoxy resin: 100 parts; hydrogenated bisphenol A epoxy resin: 3 parts; polypropylene glycol glycidyl ether: 8 parts; o-cresyl glycidyl ether: 5 parts; KH560: 3 parts; carbon fiber: 5 parts; fumed silica: 8 parts; silica fume: 2 parts; alumina: 1 part; red pigment: 0.03 parts;

[0035] Component B is composed of the following materials: linear polyetheramine D230: 6 parts; linear polyetheramine D400: 1 part; T-type polyetheramine T403: 20 parts; T-type polyetheramine T5000: 5 parts; IPDA: 5 parts; DDM: 1 part; KH550: 2 parts; 2-methylimidazole: 1.5 parts; carbon fiber: 3 parts; fumed silica: 3 parts; yellow pigment: 0.01 parts;

[0036] Mix the two components of A and B according to the mass ratio of 100:43, apply it on the bonding part, cure at 80°C for 2 hours, a...

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Abstract

The invention relates to the technical field of preparation of epoxy adhesives, particularly a high-strength high-toughness epoxy resin adhesive and a preparation method thereof. The epoxy resin adhesive comprises epoxy resin, diluter, coupling agent, fiber, filler, flame retardant, pigment, polyetheramine, fatty amine, aromatic amine curing agent, coupling agent and accelerator. Compared with the prior art, the high-strength high-toughness epoxy adhesive provided by the invention has the advantages of excellent adhesiveness, excellent thixotropy and excellent flowing resistance, and has high strength and favorable toughness after curing. The preparation method is simple to operate and suitable for industrial production. The epoxy adhesive can be used under harsh technological conditions, and has favorable effect on binding large-size components and devices.

Description

technical field [0001] The invention relates to the technical field of preparation of epoxy adhesives, in particular to a high-strength and high-toughness epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin adhesives are widely used in automobiles, national defense, aerospace, Wind power, solar energy and other fields. [0003] Some large device components, such as: automobile doors, fan blades, space shuttle doors, mechanical arms and pressure vessels, artificial satellite solar panels, structural stealth materials, etc., these products mainly reflect high strength, high toughness and Good temperature resistance, most of the components of this type of device are bonded with bisphenol A epoxy and multi-functionality (TDE85, AG80, etc.), and rubber materials are used for toughening and fillers are used for reinforcement. Meet the use requirements. Due to the high viscosity of multifunctional epoxy, it is difficult to produce and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J171/00C09J11/04C09J11/06
Inventor 徐建东张晓霞王二平
Owner JIANGSU NEW UNITED HEAVY IND SCI & TECH
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