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A preparation method of high bonding strength and high precision copper-molybdenum-copper laminated composite material

A technology of combining strength and composite materials, applied in the direction of manufacturing tools, welding equipment, metal rolling, etc., can solve problems such as small bonding area ratio, difficult to meet, copper surface oxidation, etc., to achieve good parallelism and bonding area ratio The effect of increasing and enhancing the binding strength

Inactive Publication Date: 2015-10-21
CENT SOUTH UNIV
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  • Application Information

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Problems solved by technology

However, this method has many production processes, the surface quality of the copper plate after melting and cooling and the thickness of each layer after rolling are not easy to control, and the electrolytic copper plate used is prone to hydrogen embrittlement in a hydrogen atmosphere, and it is difficult to meet the requirements of high-purity materials in the electronics industry.
Another patent with the publication number CN1850436A adopts five steps of surface treatment, electroplating or spraying, annealing, cold rolling, and post-treatment to obtain copper-molybdenum-copper materials with special layer thickness ratios, but the copper layer is made by electroplating or spraying. It is difficult to thicken, and defects such as detachment layer, star dust, and electroplating bubbles will appear on the bonding surface of the electroplating layer, while spraying will make the cost too high
There is also a patent with a publication number of CN1843691A, which adopts six steps of surface treatment, cladding, hot rolling, annealing, cold rolling, and subsequent treatment to obtain copper-molybdenum-copper electronic packaging composite materials, but the hot rolling process is still easy to make copper The surface is oxidized, and the interfacial bonding strength of copper and molybdenum is low
This related patent also has US4950554, US4988392 and US4957823 in the United States, all of which adopt high-temperature rolling process. The process is relatively complicated, and the requirements for rolling equipment are greatly improved, and the bonding strength between laminations is not high.
The inventor has also published a method of composite lamination by diffusion welding, such as the patent with the publication number CN102126112A. In view of the poor plasticity of the core material molybdenum, it is not suitable for plastic deformation processing. After directly obtaining the molybdenum sheet with the required thickness, Multi-layer composites are produced by only diffusion welding them; therefore, the bonded area ratio between the laminates is relatively small, resulting in low diffusion-welded composite strength

Method used

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  • A preparation method of high bonding strength and high precision copper-molybdenum-copper laminated composite material
  • A preparation method of high bonding strength and high precision copper-molybdenum-copper laminated composite material

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Effect test

Embodiment 1

[0020] Select two TU1 oxygen-free copper plates with a size of 2.0×50×70㎜, and a pure molybdenum plate with a mass fraction of 99.95% with a size of 3.6×50×70㎜; first, select 2000 metallographic sandpaper for one side of the two oxygen-free copper plates After grinding, use a polishing cloth to brighten the polished surface to make the surface roughness reach Ra0.05, and choose 240, 600, 800, 1200, 1500, 2000 metallographic sandpaper for the upper and lower surfaces of the pure molybdenum plate in turn. After grinding, the polishing cloth is brightened to make the surface roughness reach Ra0.1; the treated oxygen-free copper and pure molybdenum plates are stacked in the order of copper, molybdenum, and copper, and the brightened The surfaces are in contact with each other, and placed in a hydrogen-protected diffusion welding furnace for diffusion welding. The welding process is: 8MPa diffusion welding pressure, 1000°C diffusion welding temperature, and 20 minutes of holding tim...

Embodiment 2

[0022] Select two T1 copper plates with a size of 0.5×50×70㎜, and a pure molybdenum plate with a size of 2.5×50×70㎜ with a molybdenum mass fraction of 99.9%. First, select 2000 metallographic sandpaper for one surface of the two copper plates. Grinding is treated with a flannelette polishing machine to make the surface roughness reach Ra0.05. For the pure molybdenum plate, select a two-roll cold rolling mill with bright rolls for 5% cold rolling treatment to make the surface roughness reach Ra1. 6. Finally, use acid and alkali degreasing, degreasing and oxide removal on the surface after rolling; stack the treated red copper and pure molybdenum plate in the order of copper, molybdenum and copper, and contact the brightened surface to spread The welding process is: placed in an argon-protected diffusion welding furnace, a diffusion welding pressure of 20MPa, a diffusion welding temperature of 900°C, and a holding time of 10 minutes; the copper-molybdenum-copper laminate composit...

Embodiment 3

[0024] Select two TUP deoxidized copper plates with a size of 2.0×50×70㎜, and one pure molybdenum plate with a size of 2.0×50×70㎜ with a molybdenum mass fraction of 99.98%; 5% reduction rate cold rolling treatment to make the surface roughness reach Ra0.8, and then use acid and alkali to degrease, degrease and oxide the surface after rolling, and select 240, 600, 240, 600, After grinding with 800 and 1200 metallographic sandpaper, the polishing cloth is brightened to make the surface roughness reach Ra0.8; the treated electrolytic copper and pure molybdenum plate are stacked in the order of copper, molybdenum and copper, and In contact with the brightened surface, the diffusion welding process is: placed in a vacuum of 6.0×10 -3 In the diffusion welding furnace of Pa, with the diffusion welding pressure of 15MPa, the diffusion welding temperature of 800°C, and the holding time of 30 minutes; %, 30%, 20% cold rolling thinning, and the thickness of the laminated composite sheet...

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Abstract

The invention discloses a preparation method of a high-bonding-strength and high-precision copper-molybdenum-copper laminated composite, which belongs to the technical field of composite preparation. The method comprises the steps of conducting diffusion welding on three component materials, namely copper, molybdenum and copper, to allow relatively tight surface constraint to be formed among laminates to constrain the flowing of metal in subsequent plastic deformation and allow deformation of each element laminate to be equal to the total deformation of a composite laminate, cold-rolling the copper-molybdenum-copper laminated composite laminate, and applying plastic deformation to increase the gluing rate of atoms between the molybdenum laminate and the copper laminate and then achieve the purpose of further improving the bonding strength. Compared with the prior art, the method has the advantages of high laminate bonding strength, precise laminate dimension, flexible component adjustment, low defect rate, short process and the like, and is suitable for industrialized application.

Description

technical field [0001] The invention relates to a method for preparing a copper-molybdenum-copper laminated composite material, in particular to a method for preparing a copper-molybdenum-copper laminated composite material with high bonding strength and high precision. The invention belongs to the technical field of composite material preparation. Background technique [0002] Copper-molybdenum-copper laminated composite material, with metal molybdenum as the core material, covered with oxygen-free copper plates on both sides. It not only has the low expansion of molybdenum, but also has the high electrical and thermal conductivity of copper. The thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the thickness of molybdenum and copper, and it can be combined with BeO and Al 2 o 3 Ceramic matching, relatively low processing cost, has become the preferred packaging material for high-power electronic components. [0003] Because molybdenum a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00B23K20/00B21B1/38
Inventor 王德志杨益航林高用王小鹰陈点点董小嘉
Owner CENT SOUTH UNIV
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