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Moisture-proof lead-free soldering nylon 46 composite material and preparation method thereof

A lead-free soldering and composite material technology, applied in the field of polymer materials, can solve the problems of great influence on soldering resistance and unsatisfactory heat resistance, and achieve excellent moisture resistance and lead-free soldering performance and high temperature resistance. Good performance and mechanical properties, the effect of reducing water absorption

Inactive Publication Date: 2013-02-27
惠州市华聚塑化科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The new type of solder is tin-copper-silver solder with a melting point of 215°C, which is more than 30°C higher than the melting point of the previous lead-tin solder (183°C). 66. The heat resistance of PBT and other materials cannot meet the requirements, and is gradually replaced by PPS, PA46, PA6T, and PPA
However, nylon has high water absorption due to the amide bond in the molecule, and PA46 is the one with the most amide groups in the nylon family, which greatly affects its soldering resistance

Method used

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  • Moisture-proof lead-free soldering nylon 46 composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] This embodiment is composed of the following components by weight percentage: 89.2% of PA46 resin, 9.9% of PPO resin, 0.2% of each of antioxidants 1010 and 168, and 0.5% of lubricant.

[0035] Composite materials were prepared by the following methods:

[0036] a. Weigh various raw materials according to the above-mentioned weight fractions, and dry each component; wherein PA46 resin is dried at 100°C for 12 hours;

[0037] b. Add the dried PA46 resin, PPO resin and other raw materials into the high-speed mixer and mix evenly;

[0038] c. Add the uniformly mixed material to a twin-screw extruder to extrude and granulate; The temperature of each section is set as follows: the temperature in the first zone is 280°C, the temperature in the second zone is 285°C, the temperature in the third zone is 295°C, the temperature in the fourth zone is 295°C, the temperature in the fifth zone is 300°C, the temperature in the sixth zone is 295°C, the temperature in the seventh zone i...

Embodiment 2~4

[0040] The components of Examples 2 to 4 are expressed by weight percentage, as shown in Table 1.

[0041] Composite materials were prepared by the following methods:

[0042] a. Weigh various raw materials according to the above weight fractions, and dry each component, wherein PA46 resin is dried at 110°C for 8 hours;

[0043] b. Add the dried PA46 resin, PPO resin and other raw materials into the high-speed mixer and mix evenly;

[0044] c. Add the uniformly mixed material to the twin-screw extruder for extrusion and granulation, and the alkali-free long fiber is added from the middle section; the process conditions of the twin-screw extruder are: the screw length-to-diameter ratio is 40, and the screw speed is 240r / min; the temperature of each section of the twin-screw extruder is set as follows: the temperature of the first zone is 280°C, the temperature of the second zone is 290°C, the temperature of the third zone is 290°C, the temperature of the fourth zone is 295°C,...

Embodiment 5~8

[0046] The components of Examples 5 to 8 are expressed by weight percentage, as shown in Table 1.

[0047] Composite materials were prepared by the following methods:

[0048] a. Weigh various raw materials according to the above weight fractions, and dry each component, wherein PA46 resin is dried at 105°C for 10 hours;

[0049] b. Add the dried PA46 resin, PPO resin and other raw materials into the high-speed mixer and mix evenly;

[0050]c. Add the uniformly mixed material to the twin-screw extruder to extrude and granulate, and the alkali-free long fiber is added from the middle section; the process conditions of the twin-screw extruder are: the screw length-to-diameter ratio is 40, and the screw speed is 260r / min; the temperature of each section of the twin-screw extruder is set as follows: the temperature of the first zone is 280°C, the temperature of the second zone is 290°C, the temperature of the third zone is 295°C, the temperature of the fourth zone is 295°C, the...

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Abstract

The invention relates to a moisture-proof lead-free soldering nylon 46 composite material and a preparation method thereof. The nylon 46 composite material comprises the following components by weight: 40.4-89.2% of PA46 resin, 5-15% of PPO resin, 0-5% of a compatibilizer, 0-45% of glass fiber and 1-2% of other assistants. The preparation method of the composite material is as follows: weighing each component according to the above weight, and drying the components; adding the dried PA46 resin, PPO resin, compatibilizer and assistants into a high-speed mixer for mixing; and adding the mixed materials into a double-screw extruder, adding glass fiber for reinforcement, and extruding for granulation. The composite material provided by the invention has excellent wet proof lead-free soldering performance and good mechanical properties, and can be applied to the preparation of connector of electronic and electrical products requiring lead-free soldering and preparation of high-temperature resistant automotive plastic parts, etc.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a nylon 46 composite material resistant to wet-state lead-free soldering and a preparation method thereof. Background technique [0002] With the development of science and technology, the performance of products is getting better and better. At the same time, the performance requirements for product components are also getting higher and higher. Now in the manufacture of electronics, electrical appliances, and information products, Surface Mount Technology (SMT) is widely used. The adoption of SMT technology requires each electrical component and circuit board to be heated in an infrared heating device at the same time, which puts forward higher requirements for the reflow resistance and dimensional stability of the materials made of each component and circuit board. Moreover, in order to reduce environmental pollution, a new lead-free solder is used. The new type of solder is...

Claims

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Application Information

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IPC IPC(8): C08L77/06C08L71/12C08L51/00C08K7/14B29B9/06
Inventor 冉进成刘典典林晓丹曾幸荣官炳桂官炳荣
Owner 惠州市华聚塑化科技有限公司