Electromagnetic shielding method and product

Abstract

The invention provides an electromagnetic shielding method comprising the steps that: a substrate is provided; a vacuum plating method is adopted, wherein an aluminum-silicon alloy target is adopted as a target material, oxygen is adopted as a reaction gas, and an insulation layer is formed on the substrate, wherein the insulation layer is an aluminum-silicon-oxygen layer; and a vacuum plating method is adopted, wherein a nickel-copper alloy target is adopted as a target material, and a conductive layer is formed on the insulation layer, wherein the conductive layer is a nickel-copper alloy layer. The invention also provides a product obtained with the provided electromagnetic shielding method.

Description

technical field [0001] The invention relates to an electromagnetic shielding method and its products. Background technique [0002] In the prior art, metal outer covers, plastic composite shields deposited with metal layers or combined with metal sheets, or metal fiber composite shields are usually used to control electromagnetic interference. However, the above-mentioned shielding covers all have the following disadvantages: large space occupation, high production cost, and difficulty in achieving seamless installation between the shielding cover and the printed circuit board (PCB) or flexible circuit board (FPC) during installation, which leads to poor shielding efficiency. Low, the heat generated by the electronic components on the PCB or FPC board is difficult to dissipate, and make the electronic components unstable, or even damage the electronic components. [0003] Electromagnetic shielding can be achieved by directly depositing a resin insulating layer on a PCB or F...

AI Technical Summary

Problems solved by technology

However, the above-mentioned shielding covers all have the following disadvantages: large space occupation, high production cost, and difficulty in achieving seamless installation between the shielding cover and the printed circuit board (PCB) or flexible circuit board (FPC) during installation, which leads to poor shielding efficiency. Low, the heat generated by the electronic components on the PCB board or FPC board is difficult to dissipate, and make the electronic components unstable, or even damage the electronic components

However, in order to ensure a good bonding force between the resin insulating layer and the PCB board or FPC board, and avoid peeling or cracking of the insulating layer, there are strict restrictions on the viscosity of the resin used.

The resins that can meet the above viscosity requirements are limited to some special organic resins, which have many components, complex structures, and are difficult to manufacture.

In addition, the thickness of the insulating layer is relatively large (difficult to control at the nanometer level), which has an adverse effect on the heat dissipation of electronic components

In addition, the electroplating or chemical plating metal layer has a greater pollution to the environment.

Images