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Modified phenol formaldehyde resin preparation method

A phenolic resin and modification technology, applied in the field of organic polymer compounds, can solve the problems of reduced polarity, unsatisfactory bonding effect between substrates, poor adhesion, etc., to alleviate molecular steric hindrance, save the addition amount, Increase the effect of high temperature and weather resistance

Active Publication Date: 2013-03-06
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The Chinese Patent Publication No. is CN101805435A "A Preparation Method for Boron-Modified Phenolic Resin". Although the modified phenolic resin obtained by this method has greatly improved heat resistance and ablation resistance, most of the phenolic hydroxyl groups are Destruction leads to a decrease in polarity, poor adhesion when the resin is combined with the substrate, and unsatisfactory bonding effect between the substrates

Method used

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  • Modified phenol formaldehyde resin preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Add 10 parts by weight of phenol and 1 part of xylene into the flask, add 1 part of boric acid, adjust the pH to 7.0 with 30wt% sodium hydroxide, heat up to 110 ° C, stir for 2 hours, and then pass the solvent reflux method The water was removed until the reaction was stopped when no more water separated. Here, water is generated while reacting, and the water is continuously removed with reflux, and the reaction ends when no more water is produced. Cool down to room temperature naturally. Add 1 part of cardanol to the above material, 16 parts of 37% formaldehyde aqueous solution (mass content), adjust the pH to weakly alkaline 7.0 with sodium carbonate, raise the temperature to 50°C, and react for 2 hours, then vacuum dehydrate until the obtained product is The viscosity is 2000Mpa.s, and the material is released to obtain the product.

Embodiment 2

[0033] Put 10 parts of phenol and 10 parts of xylene into the flask, add 2.3 parts of boric anhydride, adjust the pH to 8.0 with 60% calcium oxide and raise the temperature to 125°C, react for 5 hours, and then remove the water by solvent reflux until no longer Stop the reaction when water separates out, and let it cool down to room temperature naturally. Then add 12 parts of cardanol and 30 parts of formaldehyde solution with a concentration of 37% to the obtained material, adjust the pH to weakly alkaline 8.0 with sodium carbonate, raise the temperature to 90°C, react for 5 hours, vacuum dehydrate to a viscosity of 3000Mpa.s and discharge.

Embodiment 3

[0035] Put 10 parts of phenol and 5 parts of xylene into the flask, add 0.2 parts of boric acid, adjust the pH to 7.2 with 45% sodium hydroxide, raise the temperature to 120 ° C, react for 3 hours, and then remove the water by solvent reflux until no more Stop the reaction when water separates out, and let it cool down to room temperature naturally. Then add 2 parts of cardanol and 25 parts of formaldehyde solution with a concentration of 37% to the obtained material, adjust the pH to weakly alkaline 7.2 with sodium carbonate, heat up to 70°C, react for 3 hours, vacuum dehydrate to a viscosity of 2400Mpa.s, release Materials, products.

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Abstract

The present invention provides a modified phenol formaldehyde resin preparation method, which comprises the following steps: a, mixing 10 parts by weight of phenol and 1-10 parts by weight of a solvent, adding 0.2-2.3 parts by weight of a boron modifier under stirring, adjusting the pH value to 7.0-8.0, and carrying out a reaction for 2-5 hours at a temperature of 110-125 DEG C; b, removing moisture, and cooling to a room temperature; and c, adding 1-12 parts by weight of cardanol and 16-30 parts by weight of formaldehyde to the material from the step b, controlling a temperature to 50-90 DEG C, and carrying out a reaction for 2-5 hours. According to the modified phenol formaldehyde resin preparation method, the boron element is introduced; high temperature resistance and weathering resistance of the resin are increased; the suitable solvent is adopted so as to solve the problem of low viscosity of the previous boron modified formaldehyde resin in the prior art; and the solvent water carrying method is adopted to remove the water, such that the solvent can be recycled, cost is saved, operation is simple, and inconvenience caused by vacuum distillation is reduced.

Description

technical field [0001] The invention belongs to the field of organic macromolecular compounds, and in particular relates to a method for preparing phenolic resin with unsaturated compounds. Background technique [0002] The resins obtained from phenolic compounds and aldehyde compounds are all phenolic resins. The synthesis of phenolic resin is convenient, the raw material is easy to obtain, and the resin can meet many practical requirements after curing, so it is widely used in industry. However, phenolic resins also have disadvantages such as high curing temperature, high brittleness, and poor electrical properties. Therefore, various modified phenolic resins have emerged as the times require. [0003] Boron modified phenolic resin is currently the most successful modified phenolic resin. Boron-modified phenolic resin is to introduce boron element into the structure of phenolic resin, so that the hydrogen in the phenolic hydroxyl group is replaced by boron element, formi...

Claims

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Application Information

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IPC IPC(8): C08G8/28
Inventor 唐地源刘顶王恩华
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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