Manufacture method of reversible bonding micro-fluidic chip with high strength

Abstract

The invention discloses a manufacture method of a reversible bonding micro-fluidic chip with high strength. The manufacture method includes using a sacrificial layer mold to manufacture and integrating a polydimethylsiloxane (PDMS) membrane of a micro pipeline structure firstly, aligning and attaching a structure face of the PDMS membrane to a pre-punched rigid substrate, then attaching the other rigid substrate with PDMS pre-polymer and curing agent mixed liquor coated in spin mode in advance to the back of the PDMS membrane, then solidifying to obtain a completely seamless attached substrate-PDMS-substrate sandwich type micro-fluidic chip, and finally, clamping two rigid substrates of the sandwich type micro fluidic chip from the upper and lower faces by using a clamp, and therefore the ability of tolerating applied pressure intensity of the micro pipeline structure of the sandwich type micro-fluidic chip is enhanced. The sandwich type micro-fluidic chip of a combination clamp simultaneously has superiorities of assembling reversibly and resisting high pressure, broadens the applied range of the reversible bonding micro-fluidic chip greatly, and reduces application cost of the micro-fluidic chip.

Description

technical field [0001] The invention relates to a manufacturing method of a high-strength reversible bonding microfluidic chip, which can be applied to microfluidic systems and labs on a chip. Background technique [0002] Microfluidic chips have received more and more attention and popularity in recent years because of their advantages such as less sample consumption, fast analysis speed, good controllability, and easy integration. Generally speaking, the microfluidic chip is actually a new technology platform based on micro-electromechanical processing technology, characterized by a micro-pipeline network, and with various reagent fluids as its main application objects. Generally, the fabrication of microfluidic chips includes two main steps: the first step is to fabricate a microchannel network on the substrate, and fabrication methods include wet etching, dry etching, impression molding, injection molding, laser ablation, etc. The second step is to bond the substrate an...

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Problems solved by technology

Therefore, the yield of sandwich microfluidic chips made based on this method is often low.

In addition, since the van der Waals force plays a major role in the bonding of microfluidic chips with a glass-PDMS-glass sandwich structure, this force is related to the contact area of ​​PDMS-cover glass, so it is not suitable for microchannels or cavities with high density. In terms of the chip design of the structure, because the contact area between PDMS and the cover glass is small, the bonding strength is low, that is, the existing simple sandwich microfluidic chip still has a lot of problems in the microfluidic design and application of complex structures. big limitations

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