Positive photosensitive composition

A technology of photosensitive composition and photosensitive resin, applied in the directions of optics, optomechanical equipment, and photosensitive materials for optomechanical equipment, etc., can solve the problem of insufficient heat resistance, peeling, and easy penetration between the pattern and the substrate and other problems, to achieve the effect of high solvent resistance, low dielectric constant, and high heat resistance

Inactive Publication Date: 2013-05-01
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Developed a polysiloxane compound containing a carboxyl group and a photosensitive diazoquinone compound as an interlayer insulating film material that is excellent in insulation, heat resistance, solvent resistance, dry etching resistance, etc., and can form fine patterns positive-type photosensitive resin composition (refer to Patent Documents 3 and 4), but since the development margin (the width of the time when the development time reaches the optimum) in the development process is small, if the development time becomes slightly excessive , the developer will easily penetrate between the pattern and the substrate to cause peeling, so the development time needs to be strictly controlled, and there is a problem in the yield of the product
In addition, in the production of polysiloxane compounds having carboxyl groups described in Patent Documents 3 and 4, since side reactions of the reaction of introducing carboxyl groups into polysiloxane are likely to occur, compounds in which carboxyl groups are covered with protective groups As a raw material, therefore, the process of removing the protecting group is required afterwards, and there is also a problem that the process is complicated
[0004] On the other hand, a chemically amplified positive-type photosensitive resin composition containing a polysiloxane compound having an acid-dissociative dissolution-inhibiting group and a photoacid generator is also known (see Patent Document 5), but as a TFT-type liquid crystal Composition for forming an interlayer insulating film of a display element, having insufficient heat resistance

Method used

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Examples

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manufacture example 1

[0159] Production Example 1: Intermediate a1

[0160] Into a glass reaction vessel equipped with a thermometer and a stirring device, 300 g of toluene as a solvent and 240 g of 2,4,6,8-tetramethylcyclotetrasiloxane (1 mole ), 64.1 g (0.5 moles) of tert-butyl acrylate as a compound represented by general formula (1m), 352 g (2 moles) of 4-tert-butoxystyrene as a compound represented by general formula (1n), and as a catalyst 0.05 g of platinum-divinyltetramethyldisiloxane complex (Karstedt catalyst) was reacted at 60° C. for 10 hours while stirring, and the solvent was distilled off to obtain intermediate al. Intermediate al is equivalent to the compound of general formula (1b) (R 1 = methyl, R 2 =R 3 = Ethylene, X 1 =X 2 = tert-butyl, m=0.5, n=2, p=1.5).

manufacture example 2

[0161] Production Example 2: Intermediate a2

[0162] In Production Example 1, as in Production Example 1, except that 102 g (0.5 moles) of tert-butyl 4-vinylbenzoate was used instead of 64.1 g (0.5 moles) of tert-butyl acrylate as the compound represented by the general formula (1m). The same operation gives intermediate a2. Intermediate a2 is equivalent to the compound of general formula (1b) (R 1 = methyl, R 2 =2-phenylethane-1,4'-diyl, R 3 = Ethylene, X 1 =X 2 = tert-butyl, m=0.5, n=2, p=1.5).

manufacture example 3

[0163] Production Example 3: Intermediate a3

[0164] Except in Production Example 1, as the compound represented by the general formula (1m), 204 g (1 mole) of tert-butyl 4-vinylbenzoate was used instead of 64.1 g (0.5 mole) of tert-butyl acrylate, and 4-tert-butyl Except that the amount of oxystyrene used was changed from 352 g (2 mol) to 264 (1.5 mol), the same operation as in Production Example 1 was carried out to obtain intermediate a3. Intermediate a3 is equivalent to the compound of general formula (1b) (R 1 = methyl, R 2 =2-phenylethane-1,4'-diyl, R 3 = Ethylene, X 1 =X 2 = tert-butyl, m=1, n=1.5, p=1.5).

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Abstract

The present invention provides a positive photosensitive composition which is suitable for forming an interlayer insulating film that has the following advantages: high heat resistance, high solvent resistance, high transmissivity and low dielectric constant. Furthermore the positive photosensitive composition has large developing tolerance that an excellent pattern shape can be formed after optimal developing time in a developing process. Particularly, the positive photosensitive composition comprises the following components: a polysiloxane compound which is obtained through hydrolysis condensation reaction between a compound (1) and a compound (2), a photoacid generator and an organic solvent. In the chemical formula, R1 represents C1-4 alkyl or C6-10 aryl group; R2 represents C2-10 divalent alkyl; R3 represents C2-10 divalent saturated aliphatic alkyl; X1 and X2 represent acid separation dissolving restraining group; X3 represents the radial represented by the formula (3) or (4) (the detail is described in the description); m is 0-5; n is 0-5; p is 1-5; and a relationship m+n+p=3-6 is satisfied; R4 represents C6-10 aryl group; R5 and R6 represent C1-4 alkyl; and a is 2 or 3.

Description

technical field [0001] The present invention relates to an alkali-developable positive photosensitive resin composition and a positive permanent resist using the positive photosensitive resin composition. Background technique [0002] In electronic components such as thin-film transistor (hereinafter referred to as "TFT") liquid crystal display elements, magnetic head elements, integrated circuit elements, and solid-state imaging elements, an interlayer insulating film is generally provided to insulate interconnections arranged in layers. As a material for forming an interlayer insulating film, a material having a small number of steps for obtaining a desired pattern shape and having sufficient flatness is preferable, so radiation-sensitive resin compositions are widely used (see Patent Document 1). Among the above-mentioned electronic components, for example, TFT-type liquid crystal display elements are produced through the process of forming a transparent electrode film on...

Claims

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Application Information

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IPC IPC(8): G03F7/075
CPCG03F7/004G03F7/0043G03F7/0045G03F7/028G03F7/039G03F7/0392
Inventor 竹之内宏美尾见仁一斋藤诚一
Owner ADEKA CORP
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