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AlN whisker/Al2O3 ceramic matrix composite plate substrate and preparation process thereof

A composite material and ceramic-based technology, which is applied to the field of ceramic substrates containing whiskers and the preparation process thereof, can solve the problems of low thermal conductivity and high cost of AlN-based ceramic substrates, reduce sintering temperature, avoid high-temperature oxidation weaknesses, increase The effect of the thermal path

Active Publication Date: 2014-04-02
SHANTOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is aimed at Al 2 o 3 The thermal conductivity of ceramics is relatively low and the cost of AlN-based ceramic substrates is high. Through the bridging of AlN whiskers, the thermal conductivity can be greatly improved. 2 o 3 The thermal conductivity of the / AlN whisker ceramic composite substrate enables the low-cost composite ceramic substrate to meet the high thermal conductivity requirements of high-power LEDs and high-integration high-power module circuits

Method used

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  • AlN whisker/Al2O3 ceramic matrix composite plate substrate and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] See figure 1 Flow chart. Take Al with an average particle size of 1μm 2 O 3 400g powder, 400g AlN whiskers with a diameter of 1μm and an aspect ratio of 10-12, and a glass sintering aid CaO-B with a particle size of 0.5μm 2 O 3 -SiO 2 200g, add 830g of absolute ethanol solvent, 40g of triolein dispersant, 125g of polyvinyl butyral PVB binder, and 83g of polyethylene glycol plasticizer, and perform ball milling and mixing for 24 hours to prepare a casting slurry material.

[0029] The ball-milled casting slurry is vacuum degassed using a vacuum pump (vacuum degree -0.1MPa) to eliminate the air mixed into the slurry in the ball mill, and the slurry degassed by vacuum is passed through a 200-mesh screen. The casting slurry that has been vacuum degassed and sieved is allowed to stand for 30 minutes and then molded on a casting machine to form a 1mm thick ceramic green tape. The ceramic green tape is demolded from the casting machine and passed through 180℃ Of hot air for dry...

Embodiment 2

[0032] Take Al with an average particle size of 0.8μm 2 O 3 400g powder, 350g AlN whisker with a whisker diameter of 1μm and an aspect ratio of 10-12, a glass sintering aid CaO-B with a grain size of 0.5μm 2 O 3 -SiO 2 250g of glass, add 850g of absolute ethanol solvent, 40g of trioleate dispersant, 125g of polyvinyl butyral PVB binder, and 83g of polyethylene glycol plasticizer, ball mill and mix for 20 hours to prepare a cast Slurry. The ball-milled casting slurry is vacuum degassed using a vacuum pump (vacuum degree -0.1MPa) to eliminate the air mixed into the slurry in the ball mill, and the slurry degassed by vacuum is passed through a 200-mesh screen. The casting slurry that has been vacuum degassed and sieved is allowed to stand for 40 minutes, and then molded on a casting machine to form a 1mm thick ceramic green tape. The ceramic green tape is demolded from the casting machine and passed through 150℃ Of hot air for drying. The dried ceramic green tape is sliced ​​and ...

Embodiment 3

[0034] Take Al with a particle size of 0.75μm 2 O 3 500g powder, 250g AlN whisker with a whisker diameter of 1.5μm and an aspect ratio of 10-15, a low-temperature glass sintering aid CaO-B with a grain size of 0.5μm 2 O 3 -SiO 2 200g glass, 50g yttrium oxide with a particle size of 0.5μm, add 820g absolute ethanol solvent, 45g trioleate dispersant, 145g polyvinyl butyral PVB binder, and 80g polyethylene glycol plasticizer. Ball mill mixing for 15 hours to prepare casting slurry. The ball-milled casting slurry is vacuum degassed using a vacuum pump (vacuum degree -0.1MPa) to eliminate the air mixed into the slurry in the ball mill, and the slurry degassed by vacuum is passed through a 200-mesh screen. After the casting slurry that has been vacuum degassed and sieved is allowed to stand for a period of time, it is molded on a casting machine to form a ceramic green tape with a thickness of 0.75 mm. The ceramic green tape is demolded from the casting machine and passed through 150 ...

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Abstract

The invention provides an AlN whisker / Al2O3 ceramic matrix composite plate substrate which comprises 40-50 parts of Al2O3 powder, 20-40 parts of AlN whisker and 20-30 parts of low-temperature glass sintering aid and is prepared by sintering the materials at the temperature of 1000-1300 DEG C. The invention also provides a process for preparing the substrate. The process comprises the following steps of: 1) mixing the Al2O3 powder, AlN whisker and glass sintering aid; 2) adding a solvent, a dispersing agent, an adhesive and a plasticizer, and mixing to obtain slurry; 3) standing the slurry, forming to form a green ceramic strip with the thickness of 0.5-1mm, demolding and drying; 4) removing glue to obtain the ceramic blank; and 5) sintering the ceramic blank for 2-6 hours. The low-price Al2O3 powder serves as a main raw material, and the AlN whisker with high heat-conducting property is added and penetrates through the ceramic matrix, so that the heat transmission resistance of the material is reduced, and the thermal conductivity of the substrate is greatly improved.

Description

Technical field [0001] The invention belongs to the field of LED ceramic substrates, and is specifically a ceramic substrate containing whiskers and a preparation process thereof. Background technique [0002] Ceramic materials have stable chemical properties, good electrical insulation, and linear expansion coefficients are very similar to those of electronic components, and are one of the commonly used substrate materials in electronic components. Where Al 2 O 3 The substrate is cheap, with high strength, hardness, chemical stability and thermal shock resistance, good insulation and adhesion to metals. It is currently the most comprehensive ceramic material in the electronics industry and the most mature application, accounting for the total ceramic substrate material 90% of it. But Al 2 O 3 The thermal conductivity of ceramics is relatively low, and it is difficult to meet the heat dissipation requirements of high-power integrated circuits or high-power LEDs. [0003] Aluminum...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/81C04B35/10C04B35/622
Inventor 王双喜刘高山晏建宇叶家星
Owner SHANTOU UNIV
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