Brazing filler alloy powder and preparation method thereof

A technology of alloy powder and solder, which is applied in the field of preparation of ultrafine Mo-Ru-B solder alloy powder by jet mill crushing, which can solve the problem of increased temperature difference between solid and liquidus of solder and poor brazing processability , Uneven solder composition and other problems, to achieve the effect of improving the performance of the process, improving the brazing characteristics, and improving the welding performance

Active Publication Date: 2013-06-26
GRIMAT ENG INST CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

Both patents use the chemical co-precipitation method, because the Mo-Ru alloy solder has a high melting point, and the conventional smelting-mechanical crushing method is difficult to prepare, and the solder obtained by the conventional method has uneven composition and large particles, which cannot It meets the process requirements, but the solder powder prepared by the chemical coprecipitation method contains a certain proportion of Mo and Ru simple substances (>10wt%), which will increase the temperature difference between the solid and liquid phase lines of the solder and deteriorate the brazing process

Method used

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  • Brazing filler alloy powder and preparation method thereof
  • Brazing filler alloy powder and preparation method thereof
  • Brazing filler alloy powder and preparation method thereof

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Effect test

Embodiment 1

[0026] A solder alloy powder, the composition (mass fraction) is as follows: 55%Mo-43%Ru-2%B.

[0027] The main steps of the above-mentioned solder alloy powder preparation method are as follows:

[0028] First, the high-purity and ultrafine Mo powder, Ru powder, and B powder are subjected to hydrogen burning and impurity removal treatment, weighed according to the above-mentioned solder composition ratio, powder mixed, and granulated. The solder preform is made by cold isostatic pressing, and after dewaxing under the protection of hydrogen atmosphere, it is sintered at 1200°C (hydrogen atmosphere); the sintered solder preform needs to be electron beam vacuum smelted to remove impurities (gas and high temperature) Vapor pressure impurities, etc.), vacuum requirements: the vacuum of the furnace body is better than 5×10 -3 Pa, electron gun vacuum is better than 5×10 -4 Pa; the solder alloy ingot (Φ30mm alloy rod) obtained by electron beam smelting is pulverized (coarse powder)...

Embodiment 2

[0031] A solder alloy powder, the composition (mass fraction) is as follows: 55.5%Mo-42%Ru-2.5%B.

[0032] The main steps of the above-mentioned solder alloy powder preparation method are as follows:

[0033] First, the high-purity and ultrafine Mo powder, Ru powder, and B powder are subjected to hydrogen burning and impurity removal treatment, weighed according to the above-mentioned solder composition ratio, powder mixed, and granulated. The solder preform is made by cold isostatic pressing, and after dewaxing under the protection of hydrogen atmosphere, it is sintered at 1350°C (hydrogen atmosphere); the sintered solder preform needs to be electron beam vacuum smelted to remove impurities (gas and high temperature) Vapor pressure impurities, etc.), vacuum requirements: the vacuum of the furnace body is better than 5×10 -3 Pa, electron gun vacuum is better than 5×10 -4 Pa; The solder alloy ingot (Φ30mm alloy rod) obtained by electron beam smelting is pulverized (coarse pow...

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Abstract

The invention discloses brazing filler alloy powder and belongs to the technical field of cathode high-temperature brazing filler powder and a preparation method of the brazing filler alloy powder. The brazing filler alloy powder comprises, by mass, 49.0%-56.0% of molybdenum, 39.0%-46.0% of ruthenium and 2.0%-5.0% of boron. The preparation method of the brazing filler alloy powder comprises the following steps: conducting hydrogen burning and impurity processing on the high-purity and hyperfine molybdenum powder, ruthenium powder and boron powder and conducting dosing, powder mixing and granulating in proportion; manufacturing a preformed bar through cold isostatic pressing, and dewaxing and sintering under the condition of hydrogen atmosphere protection; purifying the sintered preformed bar by means of electron beam melting; and processing powder through a plasma rotating electrode atomization process under the condition of high-purity inert gas protection, smashing coarse powder and achieving refining of the powder. The brazing filler alloy powder prepared through the preparation method has the advantages of being small in particle and uniform in particle size, and therefore the problems that the existing brazing filler is high in welding temperature, uneven in composition, large in solid-liquid phase line temperature difference, poor in using manufacturability and the like are solved.

Description

technical field [0001] The invention belongs to the technical field of cathode high-temperature solder powder, and relates to a solder powder of Mo-Ru-B alloy composition and a manufacturing method thereof, in particular to a new solder component and electron beam smelting purification-plasma rotating electrode atomization system The preparation process of ultrafine Mo-Ru-B solder alloy powder produced by powder-jet milling method. Background technique [0002] Cathode is known as the heart of vacuum electronic devices. It is mainly divided into cold cathode and hot cathode. The working temperature of hot cathode is generally above 1100°C. Moreover, during the working process of the hot cathode, most of the heat of the heater is conducted to the electron emission component (W-based sponge) through the Mo support tube, so the welding between the W-based sponge of the hot cathode and the Mo support tube is the cathode key process in manufacturing. At present, there are three...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/32B22F1/00C22C27/04C22C30/00B22F9/14B22F3/16C22C1/02
Inventor 李锴张小勇陆艳杰李新成
Owner GRIMAT ENG INST CO LTD
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