Molybdenum-tungsten alloy sputtering target material for flat panel display and preparation method thereof

A flat-panel display, molybdenum-tungsten alloy technology, applied in the directions of metal rolling, metal rolling, sputtering coating, etc., can solve the problem of inability to obtain, achieve lower sintering temperature, uniform sputtering coating layer, improve sputtering coating effect of speed

Inactive Publication Date: 2013-08-21
LUOYANG SIFON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As far as the existing technology is concerned, molybdenum-tungsten alloy sputtering targets suitable for the production of sputtering coatings for flat-panel displays, ...

Method used

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  • Molybdenum-tungsten alloy sputtering target material for flat panel display and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 1) Material preparation: The powder used is molybdenum powder and tungsten powder. The physical properties of the powder are: the Mo content of the molybdenum powder is ≥99.95%, and the particle size is 3 μm; the W content of the tungsten powder is ≥99.95%, and the particle size is 3 μm.

[0042] 2) Powder blending: Weigh the molybdenum powder and tungsten powder according to the following mass percentage ratio, the content of molybdenum powder is 80%, and the content of tungsten powder is 20%, and mix the two evenly.

[0043] 3) Mechanical alloying: Mechanical alloying is the use of high-energy ball milling, crushing, cold welding and low-temperature solid-state reaction under the action of mechanical force to synthesize nano-scale molybdenum-tungsten alloy powder. Mix molybdenum powder and tungsten powder in proportion, and ball mill in a planetary high-energy ball mill. The ball milling is carried out in a vacuum environment. The ball-to-material ratio is 1:1, and th...

Embodiment 2

[0069] 1) Material preparation: The powder used is molybdenum powder and tungsten powder. The physical properties of the powder are: the Mo content of the molybdenum powder is ≥99.95%, and the particle size is 5 μm; the W content of the tungsten powder is ≥99.95%, and the particle size is 5 μm.

[0070] 2) Powder blending: Weigh molybdenum powder and tungsten powder according to the following mass percentage ratio, the content of molybdenum powder is 96.5%, and the content of tungsten powder is 3.5%, and mix them evenly.

[0071] 3) Mechanical alloying: Mechanical alloying is the use of high-energy ball milling, crushing, cold welding and low-temperature solid-state reaction under the action of mechanical force to synthesize nano-scale molybdenum-tungsten alloy powder. Mix molybdenum powder and tungsten powder in proportion, and ball mill in a planetary high-energy ball mill. The ball milling is carried out in a vacuum environment. The ball-material ratio is 1:1.5, and the bal...

Embodiment 3

[0097] 1) Material preparation: The powder used is molybdenum powder and tungsten powder. The physical properties of the powder are: the Mo content of the molybdenum powder is ≥99.95%, and the particle size is 3.4 μm; the W content of the tungsten powder is ≥99.95%, and the particle size is 3.2 μm.

[0098] 2) Powder blending: Weigh molybdenum powder and tungsten powder according to the following mass percentage ratio, the content of molybdenum powder is 90%, and the content of tungsten powder is 10%, mix the two evenly.

[0099] 3) Mechanical alloying: Mechanical alloying is the use of high-energy ball milling, crushing, cold welding and low-temperature solid-state reaction under the action of mechanical force to synthesize nano-scale molybdenum-tungsten alloy powder. Mix molybdenum powder and tungsten powder in proportion, and ball mill in a planetary high-energy ball mill. The ball milling is carried out in a vacuum environment. The ball-to-material ratio is 1:1, and the ba...

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Abstract

The invention relates to a molybdenum-tungsten alloy plane sputtering target material, and in particular relates to a molybdenum-tungsten alloy sputtering target material for a flat panel display and a preparation method thereof. The target material is prepared from 80-96.5% of molybdenum powder and 3.5-20% of tungsten powder. The preparation method comprises the steps of material preparation, powder blending, mechanical alloying, die filling, isostatic cool pressing, sintering, hot rolling, vacuum annealing and mechanical processing. According to the molybdenum-tungsten alloy sputtering target material and the preparation method thereof provided by the invention, the preparation technology is simple, the requirements for equipment are not high, the investment cost is lower, the prepared target material has good density, and the relative density exceeds 99%; meanwhile, through the technology provided by the invention, the molybdenum-tungsten alloy grain is refined, and the grain structure is optimized; and when the product is used for coating, the uniformity and quality of the film are greatly improved, and the requirements of a flat panel display coating production line for the sputtering target material are met.

Description

technical field [0001] The invention relates to a molybdenum-tungsten alloy planar sputtering target, in particular to a molybdenum-tungsten alloy sputtering target for a planar display and a preparation method thereof. Background technique [0002] Molybdenum-tungsten alloy materials can be used at higher temperatures than molybdenum or molybdenum alloys can withstand. Both molybdenum and tungsten are rare refractory metal materials with similar lattice constants and properties. Mo-W system is a continuous solid solution, and the lattice constant and density of alloys are linear functions of their chemical changes. Molybdenum-tungsten alloy has better conductivity, oxidation resistance and lower coating stress than molybdenum, which can better meet the requirements of flat panel display coating production line for sputtering targets. Especially the molybdenum-tungsten alloy containing 3.5%-25% tungsten is more suitable for high-quality flat-panel displays. As far as the e...

Claims

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Application Information

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IPC IPC(8): C23C14/34B22F1/00C22C27/04B21B37/16B21B37/74
Inventor 赵文普高建杰
Owner LUOYANG SIFON ELECTRONICS
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