Sealing microcrystalline glass, and sealing method and application thereof

A technology of glass-ceramics and glass, which is applied in the field of sealing metal shells of electronic components and sealing glass-ceramics, can solve problems such as less research or technology, and achieve simple process, excellent sealing performance, and dielectric loss electric shock The effect of high breakdown voltage
CN103265176AActive Publication Date: 2013-08-28天津北旭新材料有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
天津北旭新材料有限公司
Publication Date
2013-08-28

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Abstract

The invention relates to sealing microcrystalline glass which comprises the following raw materials: SiO2, ZnO, Al2O3, B2O3, Na2CO3, K2CO3, ZrO2, TiO2, Li2CO3 and P2O5. The invention also relates to a sealing method of the microcrystalline glass and application of the microcrystalline glass in sealing of a metal shell of an electronic component. For the sealing microcrystalline glass provided by the invention, the components and consumptions thereof of the common microcrystalline glass are changed; the microcrystalline glass having excellent sealing performance is obtained by using new complex nucleator; after sealing, the microcrystalline glass has favorable thermal expansion compatibility, realize compact air-tight seal, is high in dielectric loss electric breakdown voltage and can meet the requirements of higher standards. The sealing method provided by the invention is simple in process, can realize automatic crystallization without subsequent nucleation and crystallization process, ensures the strength of the glass and has wide application prospects.
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Description

technical field

[0001] The invention relates to the field of glass-ceramics, in particular to a sealing glass-ceramics, a sealing method using the glass-ceramics and its use in sealing metal casings of electronic components. Background technique

[0002] The electrical properties of electronic components such as relays are extremely sensitive to the surrounding environment. Once they are damp, corroded or leaked, the performance indicators such as insulation resistance, leakage current or breakdown voltage of the device will be degraded, affecting normal use. For harsh environments such as high temperature , high pressure or strong mechanical vibration, the probability of failure is even greater. At present, the sealing of electronic components is mostly realized by glass seams, such as domestic DM305, DM308 borosilicate systems, etc. But this kind of glass powder still exists with 4j29 (Fe-29Ni-18Co, the thermal expansion coefficient is (4.7~5.2)×10 -7 ℃ -1 ) Iron-cobalt...

Claims

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