Preparation method for producing diamond cutting line through steel wire magnetization

Abstract

The invention discloses a preparation method for producing a diamond cutting line through steel wire magnetization. The method comprises the following steps: carrying out chemical nickel-plating treatment on diamond micro-powder so as to metalize the surface of the diamond micro-powder; removing a brass layer of a copper wire the surface of which is plated by brass in an alkali solution; preplating copper in a cyanide-free alkali copper plating solution; magnetizing the steel wire with pre-plated copper by magnetizing with a sintered neodymium iron boron strong magnet; in the process of sanding and electric-plating, attaching the diamond micro-powder which is dispersed in the solution and the surface is metalized to the surface of the steel wire under a magnetic field and the stirring function, and compositely depositing on the surface of the steel wire together with the copper plated layer; and plating the outermost layer of the steel wire with nickel. The electric-plated diamond cutting line is subjected to thermal treatment so as to demagnetize and eliminate the hydrogen embrittlement. The copper plated layer is adopted in pre-plating, sanding and electric-plating, so that the cost of the plated layer is lowered, the time needed for plating plated layers of the same thickness is also reduced, the production efficiency is improved, and meanwhile the uniform distribution of the diamond micro-powder on the surface of the steel wire is realized in sanding and electric-plating.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, in particular to a method for preparing a diamond cutting wire. Background technique [0002] With the country's emphasis on the development of clean energy, the photovoltaic industry has developed rapidly. Silicon wafer is the substrate for manufacturing photovoltaic cells. Silicon wafer cutting is a key link in the manufacturing process of solar photovoltaic cells. The cutting line required for silicon wafer cutting is one of the important raw materials in photovoltaic industry processing. The traditional cutting wire is a bare high-strength steel wire. During the wire sawing process, under the lubrication of oily cutting fluid, the high-strength steel wire drives the free abrasive to produce cutting action between the silicon rod being cut. Because silicon cutting powder, oily cutting fluid, and abrasives are mixed together and it is difficult to separate, the traditional wire saw ...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of uneven sanding, high material cost, and long sanding and electroplating time when preparing diamond cutting wires by electroplating, the present invention proposes a preparation of diamond cutting wires produced by magnetization of steel wires with high production efficiency, simple process and low cost The method uses the steel wire as a soft magnetic material to magnetize it under a strong magnetic field, and the metallized diamond powder is attracted to the surface of the steel wire under the action of the magnetic field to achieve the purpose of sanding. At the same time, the cyanide-free alkaline copper plating solution is used Direct copper plating on the surface of steel wire, and use acidic copper sulfate solution at high current density (greater than 3A / dm 2 ) for sand electroplating to better ensure the bonding force and coverage uniformity of diamond and steel wire