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Ingan/gan multi-quantum well grown on strontium aluminate tantalum lanthanum substrate and its preparation method

A technology of strontium tantalum lanthanum aluminate and multiple quantum wells, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as reducing material carrier mobility, film and substrate cracking, affecting device performance, etc. Improve radiation recombination efficiency, inhibit interfacial reaction, unique effect of growth process

Active Publication Date: 2015-09-16
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the luminous efficiency of LED has surpassed that of fluorescent lamps and incandescent lamps, the luminous efficiency of commercial LEDs is still lower than that of sodium lamps (150lm / W), and the price per lumen / watt is relatively high.
At present, the luminous efficiency of LED chips is not high enough, one of the main reasons is that the sapphire substrate causes
Since the lattice mismatch between sapphire and GaN is as high as 17%, a high dislocation density is formed during the epitaxial GaN film process, which reduces the carrier mobility of the material and shortens the carrier lifetime, which in turn affects the GaN substrate. Device performance
Secondly, due to the thermal expansion coefficient of sapphire at room temperature (6.63×10 -6 K -1 ) compared with the thermal expansion coefficient of GaN (5.6×10 -6 K -1 ) is large, and the thermal mismatch between the two is about -18.4%. When the epitaxial layer growth is completed, the device will generate a large compressive stress during the process of cooling the device from the high temperature of the epitaxial growth to room temperature, which will easily lead to the torsion of the film and the substrate. crack
Third, due to the low thermal conductivity of sapphire (25W / m.K at 100°C), it is difficult to discharge the heat generated in the chip in time, resulting in heat accumulation, which reduces the internal quantum efficiency of the device and ultimately affects the performance of the device

Method used

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  • Ingan/gan multi-quantum well grown on strontium aluminate tantalum lanthanum substrate and its preparation method
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  • Ingan/gan multi-quantum well grown on strontium aluminate tantalum lanthanum substrate and its preparation method

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Embodiment 1

[0034] A method for preparing an InGaN / GaN multiple quantum well grown on a strontium aluminate tantalum lanthanum substrate, comprising the following steps:

[0035] (1) Selection of the substrate and its crystal orientation: La 0.3 Sr 1.7 AlTaO 6 The substrate, with the (111) plane offset from the (100) direction by 0.5° as the epitaxial plane, the crystal epitaxial orientation relationship is: the (0001) plane of GaN is parallel to the La 0.3 Sr 1.7 AlTaO 6 The (111) plane of GaN(0001) / / La 0.3 Sr 1.7 AlTaO 6 (111);

[0036] (2) Substrate surface polishing, cleaning and annealing treatment:

[0037] The surface polishing of the substrate is specifically: firstly La 0.3 Sr 1.7 AlTaO 6 The surface of the substrate is polished with diamond slurry, and the surface of the substrate is observed with an optical microscope until there are no scratches, and then polished by chemical mechanical polishing;

[0038] The cleaning is specifically: La 0.3 Sr 1.7 AlTaO 6 The ...

Embodiment 2

[0047] A method for preparing an InGaN / GaN multiple quantum well grown on a strontium aluminate tantalum lanthanum substrate, comprising the following steps:

[0048] (1) Selection of the substrate and its crystal orientation: La 0.3 Sr 1.7 AlTaO 6 The substrate, with the (111) plane offset from the (100) direction by 1° as the epitaxial plane, the crystal epitaxial orientation relationship is: the (0001) plane of GaN is parallel to the La 0.3 Sr 1.7 AlTaO 6 The (111) plane of GaN(0001) / / La 0.3 Sr 1.7 AlTaO 6 (111);

[0049] (2) Substrate surface polishing, cleaning and annealing treatment:

[0050] The surface polishing of the substrate is specifically: firstly La 0.3 Sr 1.7 AlTaO 6 The surface of the substrate is polished with diamond slurry, and the surface of the substrate is observed with an optical microscope until there are no scratches, and then polished by chemical mechanical polishing;

[0051] The cleaning is specifically: La 0.3 Sr 1.7 AlTaO 6 The su...

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Abstract

The invention discloses an InGaN / GaN multiple quantum well growing on a La0.3Sr1.7AlTaO6 substrate. The InGaN / GaN multiple quantum well comprises a GaN buffer layer growing on an La0.3Sr1.7AlTaO6 substrate, an undoped GaN layer growing on the GaN buffer layer, and the InGaN / GaN multiple quantum well growing on the undoped GaN layer. The InGaN / GaN multiple quantum well with the photoluminescence peak position of 441nm and the half-peak breadth of 24.3nm has good optical performance. The invention further discloses a manufacturing method of the InGaN / GaN multiple quantum well. Compared with the prior art, the InGaN / GaN multiple quantum well growing on the La0.3Sr1.7AlTaO6 substrate and the manufacturing method of the InGaN / GaN multiple quantum well have the advantages of simple growing process and low manufacturing cost. Meanwhile, the InGaN / GaN multiple quantum well has good crystallization quality and optical performance.

Description

technical field [0001] The present invention relates to InGaN / GaN multiple quantum wells and a preparation method thereof, in particular to growing on strontium aluminate tantalum lanthanum (La 0.3 Sr 1.7 AlTaO 6 , referred to as LSAT) InGaN / GaN multiple quantum wells on a substrate and its preparation method. Background technique [0002] Light-emitting diode (LED), as a new type of solid-state lighting source and green light source, has outstanding features such as small size, low power consumption, environmental protection, long service life, high brightness, low heat and colorful, and is widely used in outdoor lighting, commercial lighting and decoration Engineering and other fields have a wide range of applications. At present, under the background of the increasingly serious problem of global warming, saving energy and reducing greenhouse gas emissions has become an important issue faced by the whole world. A low-carbon economy based on low energy consumption, low ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/02H01L33/06
Inventor 李国强王文樑杨为家刘作莲林云昊
Owner SOUTH CHINA UNIV OF TECH
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