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Heat dissipation coating used for LED lights and preparation method thereof

A heat-dissipating coating and LED lamp technology, applied in the direction of coating, etc., can solve the problems of not meeting the development status and requirements of LED lamps, the decline of LED service life, and the aging of lamp housings, so as to increase the aesthetics, improve the adhesion, and ensure smooth effect

Active Publication Date: 2013-10-16
TIANCHANG JINLING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the general LED lamp does not adopt special heat dissipation measures, and uses the natural heat dissipation of the lamp housing. This method causes the lamp housing to age after the LED lamp has been used for a period of time. Due to the long-term high temperature of the lamp housing, the service life of the LED is reduced; it cannot meet Development Status and Requirements of LED Lamps

Method used

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Examples

Experimental program
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Embodiment Construction

[0014] A heat-dissipating coating for LED lamps, made of the following raw materials in parts by weight (kg):

[0015] Methylene bicyclohexane amine 2, nano diatomite powder 15, phenolic resin 18, hydroquinone 1, silane coupling agent KH550 5, crosslinking agent TAC2, silicone resin 23, amino silicone resin 8, nitriding Aluminum 34, ferric oxide 5, ethyl acetate 26, methyl ethyl ketone 10, propylene glycol 5, zinc naphthenate 2, stearic acid 1, butadiene 4, butyl tin mercaptide 2, film former 3;

[0016] Described film-forming agent is made from the raw material of following parts by weight (kg):

[0017] Composition of raw materials Vanadium boride 4, Crosslinker TAC2 , ditetradecyl alcohol ester 5, cyclohexanone peroxide 1, styrene 4, acrylonitrile 2, xylene 10, propylene glycol 13; the preparation method is: crosslinking agent TAC , ditetradecyl alcohol ester mixed, added to xylene, stirred for 10-20 minutes, added cyclohexanone peroxide, stirred and reacted for 30-40 m...

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Abstract

The invention provides a heat dissipation coating used for LED lights and a preparation method thereof. The coating is characterized by comprising the following raw materials by weight parts: 2-3 parts of methylene bi-cyclohexane amine, 12-15 parts of nano diatomite powder, 15-18 parts of phenolic resin, 1-2 parts of hydroquinone, 4-5 parts of a silane coupling agent KH 550, 1-2 parts of a cross-linking agent TAC, 20-23 parts of organic silicone resin, 8-10 parts of amino silicone resin, 30-34 parts of aluminium nitride, 5-8 parts of ferriferrous oxide, 24-26 parts of ethyl acetate, 10-12 parts of ethyl methyl ketone, 3-5 parts of propylene glycol, 1-2 parts of zinc naphthenate, 1-2 parts of stearic acid, 4-6 parts of butadiene, 1-2 parts of butyl mercaptan tin, and 3-4 parts of a film forming agent. The coating is quick-drying. Meanwhile, through a crosslinking effect of the silane coupling agent KH 550 and the cross-linking agent TAC, a density of the coating is improved, thereby guaranteeing a smooth surface of the coating, increasing beauty, and greatly improving adhesion stress at the same time.

Description

Technical field [0001] The present invention is a coating technology field, which involves a heat dissipation coating. More specifically, it is a cooling coating and preparation method for LED lights. Background technique [0002] With the rapid expansion of LED lights, extending the service life of LED lights has also become an urgent problem.At present, the general LED lights do not use special heat dissipation measures, and the shells of the shell are naturally dissipated naturally. This method makes the LED lights use it for a period of time. Due to the high temperature of the lamp shell for a long time, the LED service life is reduced; it cannot be satisfiedLED light development status and requirements. Invention content [0003] The purpose of the present invention is to provide a heat dissipation coating and preparation method for LED lights. The coatings of the present invention have the advantages of large adhesion, aging resistance, and large heat dissipation factor. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/00C09D161/06C09D183/08C09D7/12
Inventor 茆文斌
Owner TIANCHANG JINLING ELECTRONICS
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