A silver-copper-phosphorus vacuum solder

Abstract

The invention relates to a silver, copper and phosphorus system vacuum brazing filler, which is mainly suitable for brazing materials, such as copper and copper alloy. The vacuum brazing filler contains silver, copper and phosphorus. The vacuum brazing filler is characterized in that trace elements are added, and consist of at least one of lanthanum, cerium, zirconium, tin and titanium, and the silver, copper and phosphorus system vacuum brazing filler comprises the following components in percentage by weight: 46% to 54% of silver, 1.0% to 4.0% of phosphorus, 0.001% to 0.1% of trace elements, and the balance copper. The vacuum brazing filler has the advantages that the melting temperature is lower, and the plasticity is good; the wettability and the flowability of brazing are good; the cleanliness and the spattering performance of the brazing filler are equivalent to the cleanliness and the spattering performance of BAg72Cu; and one part of BAg72Cu brazing filler can be replaced, so the cost is reduced.

Description

technical field [0001] The invention relates to a silver-copper-phosphorus vacuum brazing filler metal, which is mainly suitable for brazing of materials such as copper and copper alloys, and belongs to the field of brazing materials. Background technique [0002] Vacuum electronic devices are composed of various materials connected by welding methods to form components with complex structures, which require high dimensional accuracy. Commonly used brazing materials include silver-based, gold-based, copper-based, etc. Among them, silver-based solder is the most widely used and oldest type of solder, which has a suitable melting point, good electrical conductivity, high strength and plasticity, good processability, and corrosion resistance in various media It is also better, and the price is cheap. It is widely used in the production of electric vacuum devices. The solder in the range of 600-1100 ° C is mainly silver-based. Among them, silver-copper eutectic (BAg72Cu) is th...

AI Technical Summary

Problems solved by technology

[0003] Chinese Patent No. 02151008 discloses a patent titled "Rare Earth Silver Brazing Material and Its Manufacturing Method". It adds mixed rare earths mainly composed of cerium and lanthanum to the conventional silver copper phosphorus solder, and melts it into an ingot in a melting furnace. , and then peeled, sawed, pickled, hot-pressed and extruded into filaments, and finally stretched multiple times, but the patent did not mention the content of other components except mixed rare earths, and did not reflect that the content of precious metals can be reduced. It is only mentioned that there are few impurities, good plasticity, and good spreadability on the metal surface, but the above-mentioned defects in the prior art are not overcome

[0004] Chinese Patent No. 201010588473 discloses a patent titled "A Low-Silver Electric Vacuum Solder for Electronic Device Sealing and Soldering". It adds tin, indium and nickel to the conventional silver-copper solder to reduce the silver content. And lower the melting point, can replace Ag72Cu solder, but the addition of tin, indium and nickel is relatively high

[0005] Chinese Patent No. 200610161439 discloses a patent titled "a copper-phosphorus-silver solder containing gallium, indium and cerium", which adds gallium, indium and cerium to the conventional silver-copper-phosphorus solder to reduce the silver content. And the melting point is lowered, among which the rare earth element cerium can refine the grains of silver-copper-phosphorus solder and improve the plasticity, but the addition of gallium, indium and cerium is relatively high, and the proportion of phosphorus is also high