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Non-cyanide alkaline copper electroplating process and formula

An electroplating process and alkali copper technology, applied in the field of cyanide-free alkali copper electroplating process and formula, to achieve the effect of high impurity tolerance, small porosity, and fine crystallization

Inactive Publication Date: 2013-11-13
HUBEI DE MEI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the components of electroplating solutions produced by various manufacturers vary widely, there is no cyanide-free alkali copper electroplating process with low cost and a wide range of raw material choices.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 1. First add half the amount of water to the plating tank, then add copper chloride 15g / L, copper oxide 15g / L, ammonium chloride 250g / L, nitrilotriacetic acid 38g / L, sodium acetate 200g / L, polyethylene Diol 1.3g / L, thiourea 1.3g / L, Tween 0.2g / L, add water to the working volume, stir to dissolve;

[0019] Two, adjust the pH value of the plating solution to 13 with potassium hydroxide and tartaric acid;

[0020] 3. Heating the plating tank, raising the temperature of the plating solution to 45°C, and feeding the current with a current density of 3A / dm 3 , keep for more than 3 minutes;

[0021] 4. Carry out polishing, polishing, hanging, degreasing, degreasing, water washing, pickling activation pretreatment on the material to be plated;

[0022] 5. According to the ratio of electrolytic copper and stainless steel plate is 1:1, electroplating is carried out, and the plating solution is continuously filtered.

Embodiment 2

[0024] 1. First add half the amount of water to the plating tank, then add copper chloride 18g / L, copper oxide 12g / L, ammonium chloride 280g / L, nitrilotriacetic acid 40g / L, sodium acetate 230g / L, polyethylene Diol 1.5g / L, thiourea 1.5g / L, Tween 0.3g / L, add water to the working volume, stir to dissolve;

[0025] Two, adjust the pH value of the plating solution to 13 with potassium hydroxide and tartaric acid;

[0026] 3. Heating the plating tank, raising the temperature of the plating solution to 45°C, and feeding the current with a current density of 2.6A / dm 3 , keep for more than 3 minutes;

[0027] 4. Carry out polishing, polishing, hanging, degreasing, degreasing, water washing, pickling activation pretreatment on the material to be plated;

[0028] 5. According to the ratio of electrolytic copper and stainless steel plate is 1:1, electroplating is carried out, and the plating solution is continuously filtered.

[0029] For the plated parts subjected to cyanide-free alka...

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PUM

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Abstract

The invention relates to an electroplating process and a special formula for non-cyanide alkaline copper. The electroplating process comprises the following steps of: preparing a cylinder opening agent; adjusting the pH value; heating a plating solution; pretreating; electroplating a bottom layer, wherein the cylinder opening condition are as follows: the temperature is 30-50 DEG C, the current density is 2.6-3A / dm<3>, the pH value is adjusted to 12-14, the cylinder opening time is more than 3 minutes, the anode ratio of electrolytic copper to a stainless steel plate is 1:1, and air inflating is not needed. By adopting the formula of the cylinder opening agent to perform bottom layer electroplating of copper, a coating is bright and smooth, the crystallization is exquisite, the porosity is small, the cost is low, and the impurity tolerance is high.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a cyanide-free alkali copper electroplating process and formula. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent Corrosion, improve wear resistance, electrical conductivity, reflective properties and improve appearance. During electroplating, the plated metal or other insoluble materials are used as the anode, and the workpiece to be plated is used as the cathode, and the cations of the plated metal are reduced on the surface of the workpiece to be plated to form a coating. In order to eliminate the interference of other cations and make the coating uniform and firm, it is necessary to use a solution containing metal cations ...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 瞿德勤
Owner HUBEI DE MEI TECH
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