Preparation method of W-Cu-Ni alloy material with low W-W connectivity

An alloy material, w-cu-ni technology, applied in the field of metallurgy, can solve the problem that the bonding strength of the W-Cu interface has not been improved, and achieve the effect of high bonding strength, good tensile properties, and high density

Inactive Publication Date: 2013-12-04
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, Chinese patent ZL201010607044.2 provides a preparation method of copper-coated tungsten composite powder. The tungsten alloy prepared by sintering the copper-coated tungsten powder prepared by this method avoids the direct contact of W-W, but the bonding strength of the W-Cu interface remains the same. not improved

Method used

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  • Preparation method of W-Cu-Ni alloy material with low W-W connectivity
  • Preparation method of W-Cu-Ni alloy material with low W-W connectivity
  • Preparation method of W-Cu-Ni alloy material with low W-W connectivity

Examples

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Effect test

Embodiment 1

[0024] A tungsten-copper-nickel alloy material, alloy composition and content (mass percentage): 80%W-15%Cu-5%Ni, and its preparation method includes the following steps:

[0025] Step 1: Select 20g of tungsten powder with an average particle size of 6μm, first use 60mL / L HCl to roughen for 12h, and then use 30g / LSnCl 2 and 50mL / LHCl for sensitization, sensitization using ultrasound and stirring at the same time, the time is 5min, and finally using 0.5g / LPdCl 2 Activate with 10mL / L HCl, and activate with ultrasound and stirring at the same time, and the time is 100min;

[0026] Step 2: Weigh nickel sulfate hexahydrate according to the weight ratio of tungsten to nickel at 16:1, and prepare the plating solution as nickel sulfate hexahydrate 40g / L, sodium hypophosphite 30g / L, ammonium chloride 30g / L, sodium bicitrate 7g / L, sodium pyrophosphate 60g / L, triethanolamine 90g / L, the pH value of the plating solution is 8, the temperature is 35°C, the tungsten powder is uniformly disp...

Embodiment 2

[0032] A tungsten-copper-nickel alloy material, alloy composition and content (mass percentage): 75%W-20%Cu-5%Ni, and its preparation method includes the following steps:

[0033] Step 1: Select 20g of tungsten powder with an average particle size of 6μm, first use 60mL / L HCl to roughen for 12h, and then use 30g / LSnCl 2 and 50mL / LHCl for sensitization, sensitization using ultrasound and stirring at the same time, the time is 5min, and finally using 0.5g / LPdCl 2 Activate with 10mL / L HCl, and activate with ultrasound and stirring at the same time, and the time is 100min;

[0034] Step 2: Weigh nickel sulfate hexahydrate according to the weight ratio of tungsten to nickel at 15:1, and prepare the plating solution as nickel sulfate hexahydrate 40g / L, sodium hypophosphite 30g / L, ammonium chloride 30g / L, sodium bicitrate 7g / L, sodium pyrophosphate 60g / L, triethanolamine 90g / L, the pH value of the plating solution is 8, the temperature is 35°C, the tungsten powder is uniformly disp...

Embodiment 3

[0040] A tungsten-copper-nickel alloy material, alloy composition and content (mass percentage): 70%W-25%Cu-5%Ni, and its preparation method includes the following steps:

[0041] Step 1: Select 20g of tungsten powder with an average particle size of 5μm, first use 60mL / L HCl to roughen for 12h, and then use 30g / LSnCl 2 and 50mL / LHCl for sensitization, sensitization using ultrasound and stirring at the same time, the time is 5min, and finally using 0.5g / LPdCl 2 Activate with 10mL / L HCl, and activate with ultrasound and stirring at the same time, and the time is 100min;

[0042] Step 2: Weigh nickel sulfate hexahydrate according to the weight ratio of tungsten to nickel at 14:1, and prepare the plating solution as nickel sulfate hexahydrate 30g / L, sodium hypophosphite 40g / L, ammonium chloride 30g / L, sodium bicitrate 10g / L, sodium pyrophosphate 50g / L, triethanolamine 120g / L, the pH value of the plating solution is 9, the temperature is 40°C, the tungsten powder is uniformly di...

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Abstract

The invention discloses a preparation method of a W-Cu-Ni alloy material with low W-W connectivity. The specific process includes the steps that a nickel coating layer is arranged on the surface of micro order tungsten powder in a plating mode through a chemical plating method, the tungsten powder with the surface coated with the nickel layer and copper powder are dispensed and mixed, then spark plasma sintering is conducted on the evenly-mixed powder, and the W-Cu-Ni alloy material with the high density and low W-W connectivity can be prepared. The preparation method of the W-Cu-Ni alloy material with the low W-W connectivity has the advantages that first, the nickel coating layer can improve the interface bonding strength of a tungsten phase and a copper phase, the activated sintering function is further achieved, sintering temperatures are lowered, and meanwhile the density of the material can be better improved; second, by means of the preparation method, the W-Cu-Ni alloy material with the density being larger than 97.5% and the low W-W connectivity being smaller than 30% can be prepared, and the material has excellent tensile mechanical performance. The W-Cu-Ni alloy material has excellent mechanical performance, and is suitable for the fields of aviation and weapons.

Description

technical field [0001] The invention belongs to the technical field of metallurgy, and relates to a preparation process of refractory metals, in particular to a preparation method of a W-Cu-Ni alloy with a low W-W connection degree. Background technique [0002] Tungsten copper alloy material not only has the characteristics of high strength, high hardness and low expansion coefficient of tungsten, but also has high electrical conductivity, thermal conductivity and good plasticity of copper, so it is widely used in aerospace, EDM and electronic packaging materials, etc. field. With the development of science and technology, tungsten-copper alloys also show good application potential as warhead materials, but at the same time, higher requirements are placed on the mechanical properties of tungsten-copper alloys, especially the tensile mechanical properties of materials. [0003] For tungsten-copper alloys, its failure methods include cracking at the W-W interface, cracking a...

Claims

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Application Information

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IPC IPC(8): B22F1/02B22F3/14
Inventor刘金旭张鸿雁王迎春李树奎郭文启赵紫盈
OwnerBEIJING INSTITUTE OF TECHNOLOGYGY