A kind of modified phenolic foam for wall insulation and preparation method thereof

Abstract

The invention relates to modified phenolic foam for heat preservation of a wall body and a preparation method thereof. The modified phenolic foam comprises the following raw materials in parts by weight: 100 parts of phenolic resin, 0.1-18 parts of inorganic modifying agents, 3-7 parts of coupling agents, 3-15 parts of organic modifying agents, 6-18 parts of foaming agents and 6-20 parts of solidifying agents. According to the invention, the phenolic resin can react with a polyhydroxy modified compound and can be effectively combined with an inorganic material through a grafting functional group interspersed compound process, so that the structure and property of a phenolic foam heat-preserving material are changed, and the phenolic resin has the advantages of expandability, viscosity, high strength, high and low temperature resistance and good heat-preserving fire-proof property. Compared with the traditional phenolic foam, the modified phenolic foam disclosed by the invention is greatly enhanced in flexibility, mechanical strength and fire-proof flame-retardant property.

Description

technical field [0001] The invention belongs to the field of thermal insulation materials for building walls, and relates to a modified phenolic composite thermal insulation material for thermal insulation of walls and a preparation method thereof, in particular to a modified phenolic foam for thermal insulation of walls and a preparation method thereof. Background technique [0002] At present, about 80% of building insulation materials are organic combustible materials. Looking at the market, the existing organic insulation materials are difficult to meet the national requirements for fire performance, while inorganic materials cannot meet the requirements of the country due to their high water absorption and easy "condensation". Therefore, with the gradual promulgation and implementation of national policies, research and development of products with both thermal insulation and fire protection functions is an irreversible development trend of the external wall insulation m...

AI Technical Summary

Problems solved by technology

[0003] The existing phenolic foam boards on the market have the problems of easy pulverization, high brittleness and low mechanical strength. Organic and inorganic modifiers can be added in the production process of phenolic foam to improve the defect of easy pulverization of phenolic foam and increase the flexibility of the material properties, improve its compressive strength, bond strength and combustion performance

There are many patent documents about phenolic foam material and preparation method thereof, wherein, the publication number is CN1428372A in the patent document, only used organic modifier polybutadiene liquid rubber, furfural, polyether, amine ether etc. The foam has been modified to improve the compressive strength and bending strength performance, but the thermal conductivity is relatively high; the patent document with the publication number CN1065077A records a preparation method of a modified phenolic foam, which uses HO-CH 2 -R, HO-CH 2 -R-CH 2 -HO and urea, mixed phenol, phenol residue, bisphenol A residue and perlite powder, pumice powder, aluminum silicate and phosphorylated flue dust to modify phenolic foam, the organic and inorganic modification used Additive agent can only improve material strength to a limited extent, and the shortcoming of phenolic foam falling powder has not been obviously improved, has limited the application of phenolic foam material in the high-end market; Publication number is that urea, aluminum hydroxide, expanded perlite, Bentonite and talcum powder are used as modifiers to improve the combustion performance, but the water absorption rate is not significantly reduced

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