Improved rotary target spraying system

Abstract

The invention discloses an improved rotary target spraying system. A fixed spraying gun (4) is arranged on a base (1), an air pipe (5) and a powder feeding pipe (6) are arranged on the fixed spraying gun (4), a target back pipe (3) is vertically arranged on the base (1) in front of a spraying direction of the fixed spraying gun (4), meanwhile, a closed spraying bin (2) is arranged outside the target back pipe (3) on the base (1), moreover, the fixed spraying gun (4) is fixedly arranged on the base (1), and the target back pipe (3) linearly moves on the fixed spraying gun (4) and rotates around the central axis of the target back pipe (3) at a constant speed. By adopting a closed spraying bin structure in which inert gases are introduced, and fixing the position of the spraying gun, a target liner pipe and the target back pipe make a horizontal rotary movement, thus powder loss during feeding is reduced and avoided, the spraying deposition efficiency can be increased, the content of gases in a target material is more effectively controlled, the yield of products is increased, the production cost is reduced, the yield of the products is increased, and the yield and quality of rotary target materials are favorably improved.

Description

technical field [0001] The invention relates to the general coating device technology of the international patent classification C23C sputtering method, which belongs to the equipment for producing rotating targets by spraying technology, especially an improved rotating target spraying system. Background technique [0002] Rotating target (rotating target / rotary target) is the target of magnetron. The target is made into a cylindrical shape with a stationary magnet inside, which rotates at a slow speed. Its advantage is that the utilization rate is as high as 70%, and its disadvantage is that the cost is high. Used in solar cells, architectural glass, automotive glass, semiconductors, flat-panel TVs, etc. [0003] Electron cyclotron resonance (ECR) microwave plasma sputtering is commonly used at present. Magnetron sputtering coating is a new type of physical vapor coating method. Compared with the earlier evaporation coating method, its advantages in many aspects are qu...

AI Technical Summary

Problems solved by technology

[0006]This kind of spraying system will produce more spraying powder and needs to be equipped with a high-power powder pumping system. At the same time, it is difficult to control the target because the spraying working environment is exposed to the atmosphere. The gases in the material coating, especially nitrogen and oxygen, and due to the existence of a high-power exhaust system, part of the spray powder may be sucked away by the exhaust system, and cannot be deposited on the surface of the back tube, which affects the deposition efficiency

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