Heat radiation device with pulsating flow and leaf vein type micro channel

Abstract

The invention discloses a heat radiation device with a pulsating flow and a leaf vein type micro channel. The heat radiation device is used in cooperation with an electronic element, and comprises a heat radiator, a pulsating flow generation system and a solenoid valve controller. The heat radiator comprises a micro channel heat radiation substrate or a micro channel heat radiation plate with the leaf vein type micro channel, and a cover board. The pulsating flow generation system comprises a motor, a piston type hydraulic cylinder, two liquid inlet solenoid valves and two liquid outlet solenoid valves, wherein a pair of liquid inlets and a pair of liquid outlets are formed in the front end and the rear end of a cylinder body of the piston type hydraulic cylinder respectively, the two liquid inlet solenoid valves are correspondingly connected with the two liquid inlets of the hydraulic cylinder, and the two liquid outlet solenoid valves are correspondingly connected with the two liquid outlets of the hydraulic cylinder. The solenoid valve controller comprises a signal emitter and a signal receiver. The forward travel and the back travel of the piston type hydraulic cylinder can both provide a continuous pulsating cooling medium flow for the heat radiator, the continuous and effective heat radiation time of a heat radiation cooling plate is prolonged, the mutual disturbance and mixing of a cooling medium in the micro channel are obviously strengthened, and a heat boundary layer is damaged. Therefore, the heat radiation device with the pulsating flow and the leaf vein type micro channel has the advantages of being good in heat radiation effect, high in heat radiation efficiency, good in temperature uniformity in a heat radiation area, high in reliability and stability of work of elements and the like.

Description

technical field [0001] The invention relates to a cooling device for supporting electronic components, in particular to a pulsating cooling liquid flow generated by a pulsating flow generation system to provide to the blade-type micro-channel heat sink cold plate, so as to provide high power consumption (high heat flux density) electronic components Heat dissipation treatment is carried out during work to ensure the reliable operation of electronic components and extend their service life. Background technique [0002] When electronic components work, due to power loss, the temperature of the device itself rises. When the temperature cannot be conducted or convected in time, it will cause the internal temperature of the device itself to rise and affect its performance, reducing its working stability and reliability. The higher the power consumption of electronic components, the higher the heat generated, and the high-density packaging distributes the heat on a smaller surfac...

AI Technical Summary

Problems solved by technology

[0005] ⑴The heat sink cold plate simply connects the micro-channels in parallel, and the fluid entering each channel will cause a large pressure loss, which not only loses power, but also leads to different flow rates entering each channel, and the heat dissipation effect is not ideal; There may even be partial reflux ( figure 1 The phenomenon indicated by the arrow in 9-1.3) leads to poor heat dissipation in local areas, and in severe cases, it will cause damage to components;

[0006] (2) The heat sink cold plate simply uses a micropump to transport fluid into the flow channel. The heat transfer effect of the fluid is poor, and it can only dissipate heat passively. This type of heat sink cold plate generally has a maximum temperature area of ​​43°C and a minimum temperature area of ​​36°C. The temperature difference between the high and low temperature areas is about 7°C, and there is an obvious heat concentration effect at the edge

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