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A heat-conducting insulation and adhesive technology, applied in the direction of adhesives, adhesive additives, epoxy resin glue, etc., can solve the problems of high viscosity of epoxy resin, poor heat dissipation, inconvenient process operation, etc., and achieve good thermal conductivity, matching than reasonable effect
Inactive Publication Date: 2014-01-08
KUNSHAN FENFA INSULATING MATERIALS
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Summary
Abstract
Description
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Problems solved by technology
[0004] Simple epoxy resin has high viscosity and poor heat dissipation, which brings some inconvenience to the process op
Method used
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Examples
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Effect test
Embodiment 1
[0017] Example 1: Dilute 5 parts of silane coupling agent with 1 part of ethanol diluent, add it to aluminum nitride, stir for 4 hours, put it in an oven, and dry it at 100°C for later use; add 2 parts of diluent to 60 parts of epoxy resin, Stir and dilute, add 8 parts of a mixture of dibutyl phthalate, tributyl phosphate, trichloroethyl phosphate and polyester, polyether, 2 parts of flame retardant, stir and heat in an oven to 160°C , then put in 9 parts of treated aluminum nitride after cooling at room temperature, add 5 parts of triethanolamine curing agent, stir evenly, put it in an oven, and fix it at 60°C for 4h.
Embodiment 2
[0018] Example 2: Dilute 5.5 parts of silane coupling agent with 1.2 parts of ethanol diluent and add it to aluminum nitride, stir for 4 hours, put it in an oven, and dry it at 100°C for later use; add 1.8 parts of diluent to 55 parts of epoxy resin, Stir and dilute, add 7 parts of a mixture of dibutyl phthalate, tributyl phosphate, trichloroethyl phosphate and polyester, polyether, 2 parts of flame retardant, heat in an oven to 160 ° C, and then After cooling at room temperature, put 10 parts of treated aluminum nitride, add 5 parts of triethanolamine curing agent, stir evenly, put it in an oven, and solidify at 60°C for 3.5 hours.
[0019] The invention discloses a heat-conducting and insulating adhesive, which has a reasonable proportion and has good thermal conductivity, electric strength and bonding strength. The adhesive also has multiple functions and can be used as heat-conducting grease, adhesive, coating and Potting compound is used.
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PUM
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Abstract
The invention discloses a heat-conducting insulated adhesive, comprising the following components in parts by weight: 50-60 parts of epoxy resin, 5-8 parts of curing agent, 6-9 parts of plasticizer, 3-5 parts of diluent, 9-12 parts of aluminium nitride, 5-6 parts of coupling agent, and 2-3 parts of fire retardant. The heat-conducting insulated adhesive is prepared by the following steps: weighing the epoxy resin; adding the diluent; evenly stirring and heating to 160-180 DEG C; cooling at room temperature, adding aluminium nitride and the curing agent, which are processed by the coupling agent; evenly stirring and curing for 4-5 hours at 60-80 DEG C. In the manner, the heat-conducting insulated adhesive disclosed by the invention is reasonable in proportion, has excellent heat-conducting coefficient, electric strength and bonding strength, also has a plurality of functions, and can be used as heat-conducting resin, an adhesive, a coating and a potting compound.
Description
technical field [0001] The invention relates to the field of insulating materials, in particular to a heat-conducting and insulating adhesive. Background technique [0002] In the adhesive industry, with the development of thinner and lighter electronic components and electronic equipment, the demand for thermally conductive adhesives, especially thermally conductive and insulating adhesives, used as packaging and thermal interface materials is increasing. [0003] Epoxy adhesives are mainly composed of epoxy resin and curing agent. In order to improve certain properties, auxiliary materials such as tougheners, diluents, accelerators, and coupling agents can also be added to meet different purposes. Due to its high bonding strength and strong versatility, epoxy adhesives were once known as "universal glue" and "vigorous glue". widely used in fields such as [0004] Simple epoxy resin has high viscosity and poor heat dissipation, which brings some inconvenience to the proc...
Claims
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Application Information
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