Heat-conducting insulated adhesive

Abstract

The invention discloses a heat-conducting insulated adhesive, comprising the following components in parts by weight: 50-60 parts of epoxy resin, 5-8 parts of curing agent, 6-9 parts of plasticizer, 3-5 parts of diluent, 9-12 parts of aluminium nitride, 5-6 parts of coupling agent, and 2-3 parts of fire retardant. The heat-conducting insulated adhesive is prepared by the following steps: weighing the epoxy resin; adding the diluent; evenly stirring and heating to 160-180 DEG C; cooling at room temperature, adding aluminium nitride and the curing agent, which are processed by the coupling agent; evenly stirring and curing for 4-5 hours at 60-80 DEG C. In the manner, the heat-conducting insulated adhesive disclosed by the invention is reasonable in proportion, has excellent heat-conducting coefficient, electric strength and bonding strength, also has a plurality of functions, and can be used as heat-conducting resin, an adhesive, a coating and a potting compound.

Description

technical field

[0001] The invention relates to the field of insulating materials, in particular to a heat-conducting and insulating adhesive. Background technique

[0002] In the adhesive industry, with the development of thinner and lighter electronic components and electronic equipment, the demand for thermally conductive adhesives, especially thermally conductive and insulating adhesives, used as packaging and thermal interface materials is increasing.

[0003] Epoxy adhesives are mainly composed of epoxy resin and curing agent. In order to improve certain properties, auxiliary materials such as tougheners, diluents, accelerators, and coupling agents can also be added to meet different purposes. Due to its high bonding strength and strong versatility, epoxy adhesives were once known as "universal glue" and "vigorous glue". widely used in fields such as

[0004] Simple epoxy resin has high viscosity and poor heat dissipation, which brings some inconvenience to the proc...