Heat dissipation dope for meter housings and preparation method of heat dissipation dope

A heat-dissipating coating and instrument case technology, applied in coatings and other directions, can solve problems such as poor heat dissipation, failure to meet the requirements of production and life, and easy damage, and achieve excellent thermal oxidation stability, excellent UV shielding, and high thermal conductivity. Effect

Inactive Publication Date: 2014-02-19
ANHUI AUTOMATION INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the advancement of science and technology, various instruments have emerged as the times require. Generally, the heat emitted by the instrument will not be very fast, but because the instrument will work for a long time, it will accumulate a lot of heat. If the heat is not released in time, it will cause the instrument to overheat and affect the normal operation. work, also easily destroyed
At present, there are relatively few coatings designed for the wo...

Method used

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Examples

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Embodiment Construction

[0010] A heat-dissipating coating for an instrument case is characterized in that it is made of the following raw materials in parts by weight (kg): silicone resin 42, butyl acetate 19, ethyl acetate 15, nano-titanium dioxide 2, tributyl trichloride Tin 2, tetraethylenepentamine TEPA5, nanographite 1, graphene 2, aluminum nitride powder 17, mica powder 2, allyl heptanoate 1, 4-methylguaiacol 1, ethylene glycol 5, synthetic Membrane aid 4;

[0011] The film-forming aid is prepared from the following raw materials in parts by weight (kg): nano jade powder 3, crosslinking agent TAC2, alcohol ester dodeca 4, silane coupling agent KH550 1, styrene 3, ricinoleic acid 1 , maleic anhydride 2, morpholine 2, tert-butyl peroxyvaleric acid 0.3, isophorone 1, xylene 4, ethyl acetate 12; the preparation method is: nano jade powder, morpholine, benzene Mix ethylene and ricinoleic acid, add to the mixed solvent of ethyl acetate and xylene, stir for 8 minutes, heat to 65°C, stir for 20 min...

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Abstract

The invention discloses a heat dissipation dope for meter housings and a preparation method of the heat dissipation dope. The heat dissipation dope is prepared from the following materials in parts by weight: 45-50 parts of organic silicon resin, 18-22 parts of n-butyl acetate, 14-16 parts of ethyl acetate, 2-3 parts of nanometer titania, 2-3 parts of tributyl tin trichloride, 4-6 parts of tetraethylenepentamine TEPA, 1-2 parts of nano-graphite, 2-3 parts of graphene, 16-19 parts of aluminum nitride powder, 2-3 parts of mica powder, 1-2 parts of allyl heptanoate, 1-2 parts of 4-methyl guaiacol, 5-6 parts of ethanediol and 4-5 parts of film forming assistant. By adding aluminum nitride powder, the dope has high heat conduction rate and good heat dissipation effect; by adding nanometer titania, so that the dope has excellent function of shielding ultraviolet ray, is good for health and is not easily aged; by adding nano-graphite, the dope has good lubricity and is easily applied; organic silicon resin is used as a base material of the dope, so that the dope has good insulation property and excellent thermal oxidation stability.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat-dissipating coating, more specifically, a cooling coating used for an instrument case and a preparation method thereof. Background technique [0002] With the advancement of science and technology, various instruments have emerged as the times require. Generally, the heat emitted by the instrument will not be very fast, but because the instrument will work for a long time, it will accumulate a lot of heat. If the heat is not released in time, it will cause the instrument to overheat and affect the normal operation. Work, also easily destroyed. At present, there are relatively few coatings designed for the working characteristics of the instrument, which cannot meet the requirements of production and life, and the problem of heat dissipation has been paid more and more attention. The materials used in the current instrument heat dissipation coatings have technical problems ...

Claims

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Application Information

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IPC IPC(8): C09D4/06C09D7/12C08F212/08C08F222/06
Inventor 柯有玺邬岳平刘丽丽
Owner ANHUI AUTOMATION INSTR
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