Organically soluble photosensitive resin after being cured and preparation method and dissolving method thereof

A photosensitive resin, organic technology, applied in the field of organic soluble photosensitive resin after curing, preparation and dissolution, can solve the problems of electroplating, electroforming, soluble photocurable resin not resistant to aqueous solution, etc., to increase photosensitivity and improve resin resolution The effect of increasing the rate and improving the resin binding force

Active Publication Date: 2014-03-05
GOLD ARRAY TECH BEIJING LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the defects that the existing soluble photocurable resin is not resistant to aqueous solution, cannot be subjected to processes such as electroplating and electroforming, and cannot be used in the manufacture of three-dimensional circuits, the purpose of the present invention is to provide a cured organic soluble photosensitive resin and a preparation method And the dissolution method, the resin can play the role of supporting layer and sacrificial layer in the three-dimensional circuit manufacturing process, is the key material to realize the three-dimensional circuit, has the functions and effects that the existing general soluble light-curable resin does not have

Method used

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  • Organically soluble photosensitive resin after being cured and preparation method and dissolving method thereof
  • Organically soluble photosensitive resin after being cured and preparation method and dissolving method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] 1. Add 10 grams of (2,4,6-trimethylbenzoyl) diphenylphosphine oxide, 100 grams of N,N′-methylenebisacrylamide, hydroxyethyl methacrylate into a 1000 ml plastic beaker 75 grams of esters, 40 grams of methacrylic anhydride.

[0031] 2. Stir and mix the above substances until it becomes a transparent light yellow homogeneous liquid mixture.

[0032] 3. Add 25 grams of polyvinylpyrrolidone to the mixture, put the working head of the homogeneous mixer into the beaker, and stir homogeneously for 10 minutes to obtain a light yellow uniform liquid with a viscosity of 20 cp, which is the photosensitive resin of the present invention .

[0033] 4. The photosensitive resin was irradiated by a 405 nm wavelength visible light curing box with a power of 500 milliwatts for 10 minutes, and the liquid resin was cured into a solid state. Use CNC milling machine to carry out machining experiments on the cured resin. After curing, the resin can be used for high-precision CNC milling with...

Embodiment 2

[0038] 1. Add 10 grams of (2,4,6-trimethylbenzoyl) diphenylphosphine oxide, 250 grams of N,N′-methylene bisacrylamide, hydroxyethyl methacrylate in a 1000 ml plastic beaker 100 grams of ester, 100 grams of methacrylic anhydride.

[0039] 2. Stir and mix the above substances until it becomes a transparent light yellow homogeneous liquid mixture.

[0040] 3. Add 40 grams of polyvinylpyrrolidone to the mixture, put the working head of the homogeneous mixer into the beaker, and stir homogeneously for 10 minutes to obtain a light yellow uniform liquid with a viscosity of 10 cp, which is the photosensitive resin of the present invention .

[0041] 4. The photosensitive resin was irradiated by a 405 nm wavelength visible light curing box with a power of 500 milliwatts for 10 minutes, and the liquid resin was cured into a solid state. Use CNC milling machine to carry out machining experiments on the cured resin. After curing, the resin can be used for high-precision CNC milling with...

Embodiment 3

[0046] 1. Add 10 grams of phenylbis(2,4,6-trimethylbenzoyl) phosphine oxide, 600 grams of N,N′-methylene bisacrylamide, hydroxyethyl methacrylate into a 1000 ml plastic beaker 100 grams of ester, 200 grams of methacrylic anhydride.

[0047] 2. Stir and mix the above substances until it becomes a transparent light yellow homogeneous liquid mixture.

[0048] 3. Add 90 grams of polyvinylpyrrolidone to the mixture, put the working head of the homogeneous mixer into the beaker, and stir homogeneously for 10 minutes to obtain a light yellow uniform liquid with a viscosity of 10 cp, which is the photosensitive resin of the present invention .

[0049] 4. The photosensitive resin was irradiated by a 405 nm wavelength visible light curing box with a power of 500 milliwatts for 10 minutes, and the liquid resin was cured into a solid state. Use CNC milling machine to carry out machining experiments on the cured resin. After curing, the resin can be used for high-precision CNC milling w...

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Abstract

The invention discloses organically soluble photosensitive resin after being cured, and a preparation method and a dissolving method thereof, which belong to the technical field of high molecular materials. Based on that the total mass of the resin is 100%, the resin comprises the following components in percentage by mass: 40-60% of N,N'-methylene bisacrylamide monomer, 10-30% acrylate monomer, 5-10% of polyethylene pyrrolidone thickening agent, 10-20% of methyl acrylic anhydride cross-linking agent and 1-4% of free radical type photopolymerization initiator. The preparation method comprises the following steps: firstly, mixing the free radical type photopolymerization initiator, the N,N'-methylene bisacrylamide monomer, the acrylate monomer and the methyl acrylic anhydride cross-linking agent, and further adding polyethylene pyrrolidone. The cured resin can be dissolved when being immersed into a mixture solution of N,N-dimethylformamide and butyl amine. The resin functions as a support layer and a sacrificial layer in three-dimensional circuit manufacturing procedures, and is a critical material for realizing three-dimensional circuits.

Description

technical field [0001] The present invention relates to an organic soluble photosensitive resin after curing, a preparation method and a dissolution method, in particular to a photosensitive resin that can be polymerized by visible light (wavelength 405nm) and is organic soluble after photocuring, a preparation method and a dissolution method , specifically a cured organic-soluble photosensitive resin used for visible light microlithographic molding of three-dimensional circuits, a preparation method and a dissolution method, belonging to the technical field of polymer materials. Background technique [0002] With the continuous promotion of photo-curing molding technology, photo-curing molding has been widely used in rapid casting, rapid mold and other industries because of its ability to form arbitrary complex structures and high-precision parts, so the requirements for various properties of photosensitive resins are also constantly increasing. Most of the light-curing mol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027C08F222/38C08F220/28C08F220/06C08F2/48
Inventor 李厚民
Owner GOLD ARRAY TECH BEIJING LLC
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