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LED (light-emitting diode) organosilicon pouring sealant and application thereof

A silicone potting glue, organic technology, applied in adhesives, electrical components, circuits, etc., can solve the problems of poor selectivity of tackifier, low amount of tackifier, transparency, etc., and achieve light aging resistance, dielectric properties, excellent Effects of dielectric properties and excellent decompression capability

Active Publication Date: 2015-06-17
GUANGDONG HENGDA NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, because the addition-type silicone has poor adhesion to substrates such as plastics, metals, and glass during the curing process, the colloid is prone to contact with PC (Polycarbonate polycarbonate) lenses or LED lamp holders, especially when subjected to cold and heat shocks. produce disengagement
Therefore, in order to maintain good adhesion, it is necessary to pre-treat the surface of the substrate with a surface treatment agent that promotes adhesion. The disadvantage of this method is that it will not only affect the transparency of the PC lens, but also affect the production of LED lights. Detrimental impact on process, productivity and cost
This method can save the surface pretreatment process of the base material, but the disadvantage of this method is: the selectivity of the tackifier is poor, most of the tackifier and the glue are prone to compatibility problems, and the transparency of the cured colloid changes. Poor, which affects the light transmittance of LED lights; in addition, the adhesion strength of this type often cannot meet the requirements, and in order to avoid more negative effects on the glue after the addition of tackifiers, the amount of tackifiers must be as low as possible
[0005] Patent EP686 671 once mentioned adding a compound containing -SiH and a large number of aromatic rings as a tackifier to improve the adhesion of the colloid to plastics and other substrates, but it is prone to poor compatibility and even separation during storage; Patent CN1304959 also proposed adding a kind of -SiH and epoxy group as a tackifier, but there are also compatibility problems. Although the impact on transparency can be reduced by heating and curing, when it is cured at room temperature, the transparency is also affected

Method used

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  • LED (light-emitting diode) organosilicon pouring sealant and application thereof
  • LED (light-emitting diode) organosilicon pouring sealant and application thereof
  • LED (light-emitting diode) organosilicon pouring sealant and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Table 1: Ingredients and Proportions

[0030]

[0031] The appearance of component A is clear and transparent, and its viscosity is 500mm 2 / s, the appearance of component B is clear and transparent.

[0032] Method for preparing LED components:

[0033] 1. Bake and dry the LED lamp holder and PC lens (Guangdong Hongleida) soldered with chips (Puri 45mil chips) and gold wires.

[0034] 2. Cover the PC lens with the LED lamp holder and press it tightly.

[0035] 3. Mix components A and B evenly to obtain a glue solution of LED silicone potting glue.

[0036] 4. Vacuum the glue solution for defoaming.

[0037] 5. Pour the defoamed glue into the syringe and defoam again.

[0038] 6. Inject the glue into the LED lamp beads.

[0039] 7. Place the LED lamp beads injected with glue at a room temperature of 10-30°C to cure naturally for 24 hours or place them at 50-60°C for 4 hours. In this embodiment, curing is carried out at 25° C. for 24 hours. An LED lamp is prod...

Embodiment 2

[0043] Table 2: Ingredients and Proportions

[0044]

[0045] A: The appearance of the component is clear and transparent, and its viscosity is 600mm 2 / s B: The appearance of the component is clear and transparent.

[0046] The LED lamp beads injected with the glue solution were placed at room temperature at 30° C. to cure naturally for 24 hours, and other steps were the same as in Example 1 to prepare LED components. The prepared LED lamp was baked at 120°C for 30 minutes and then frozen at -30°C for 30 minutes for a cycle test, and compared after 20 cycles. There is no interlayer between the packaging material and the LED lamp bead bracket, and no interlayer between the PC lens. At a wavelength of 450nm, the light transmittance is 99%, and the dielectric strength is 20kv / mm.

Embodiment 3

[0048] Table 3: Ingredients and Proportions

[0049]

[0050] The appearance of component A is clear and transparent, and its viscosity is 1000mm 2 / s, the appearance of component B is clear and transparent. Put the glue-injected LED beads at 50-60°C and bake for 4 hours, and other steps are the same as in Example 1 to prepare LED components. In this embodiment, bake at 55° C. for 4 hours. The prepared LED lamp was baked at 120°C for 30 minutes and then frozen at -30°C for 30 minutes for a cycle test, and compared after 20 cycles. There is no interlayer between the packaging material and the LED lamp bead bracket, and no interlayer between the PC lens. At a wavelength of 450nm, the light transmittance is 99%, and the dielectric strength is 20kv / mm.

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Abstract

The invention provides an LED (light-emitting diode) organosilicon pouring sealant. The LED organosilicon pouring sealant is composed of a component A and a component B, wherein the component A and the component B respectively comprise the following components that the component A is organopolysiloxane with a structural unit containing a -SiCH=CH2 group and a hydrogen silicide platinum family polysiloxane catalyst; the component B is organopolysiloxane with a structural unit containing a -SiCH=CH2 group, organopolysiloxane with a structural unit containing -SiH and at least one alkoxy, and alkynol or polyvinyl siloxane. When the pouring sealant provided by the invention is used for LED elements, the mixture is clear and transparent, and the compatibility is good; the pouring sealant has a good adhesive force on materials such as PPA (phenyl-propanolamine), PC (polycarbonate), zinc-plated aluminum and fluorescent powder in the LED elements after being cured at 50-60 DEG.C or room temperature, and the interlayer phenomenon is avoided; the organosilicon pouring sealant is high in transparency, cold and hot impact resistant, high temperature aging resistant and light aging resistant and has an excellent dielectric property.

Description

technical field [0001] The invention belongs to the field of organic compound compositions, in particular to an organic composition containing polysiloxane and its application. Background technique [0002] LEDs (Light Emitting Diodes) are packaged in various components that emit light of a specific color. In order to enhance and guide the luminous flux and protect the LEDs from dust, moisture and mechanical damage, LED devices must be potted. [0003] The existing addition-type liquid silicone rubber potting materials have the advantages of no low-molecular by-products, small stress, deep vulcanization, no corrosion, easy control of cross-linking structure, and small shrinkage of vulcanized products; the colloid can be vulcanized at room temperature, It can also be vulcanized by heating; after curing, the colloid has excellent properties such as thermal shock resistance, high temperature aging resistance and ultraviolet radiation resistance; in addition, it also has the ad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05H01L33/56
Inventor 陈坚锐周为民
Owner GUANGDONG HENGDA NEW MATERIALS TECH
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