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Silicon wafer cutting solution

A technology of silicon wafer cutting fluid and surfactant, applied in the direction of lubricating composition, etc., can solve the problems of reduced cutting ability, reduced silicon wafer quality, and difficult cleaning, etc. effect of cleaning

Inactive Publication Date: 2014-04-02
ZHENJIANG GANGNAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitations of the recycling process and technology, as well as the wear of the edges and corners of the recycled sand, the recycled sand will contain a small amount of metal ions and silicon particles in addition to the reduced cutting ability.
For the existing cutting fluid, for the existing recycled sand, it is difficult to solve the problems of the quality reduction of silicon wafers caused by the presence of metal ions and silicon powder, it is not easy to clean, and the conductivity conversion is low.

Method used

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  • Silicon wafer cutting solution
  • Silicon wafer cutting solution
  • Silicon wafer cutting solution

Examples

Experimental program
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Effect test

example 1

[0026] A kind of silicon chip cutting liquid, preferably, its composition is counted as by weight fraction:

[0027]

[0028] Wherein, the dispersant is formed by mixing 5 parts by weight of acrylic acid, 5 parts by weight of ethylacrylic acid, 1.5 parts by weight of maleic anhydride, and 3.5 parts by weight of acrylamidosulfonic acid;

[0029] The surfactant is composed of anionic surfactant and cationic surfactant in a weight ratio of 1:1, and the anionic surfactant is composed of 1 weight part of N,N-dimethyl-1-tetradecylamine oxide, lauryl 1 part by weight of sarcosine sodium and 1 part by weight of dodecyl diphenyl ether disulfonic acid are mixed. The cationic surfactant consists of 1 part by weight of stearyl dimethyl benzyl ammonium chloride, 1 part by weight of tetraethyl 2 parts by weight of ammonium hydroxide and 1 part by weight of tetrabutylammonium hydroxide are mixed;

[0030] The defoamer is composed of 1 part by weight of polymethylsiloxane and 2 parts by w...

example 2

[0034] A kind of silicon chip cutting liquid, preferably, its composition is counted as by weight fraction:

[0035]

[0036]

[0037] Wherein, the dispersant is formed by mixing 6 parts by weight of acrylic acid, 6 parts by weight of ethacrylic acid, 1.8 parts by weight of maleic anhydride, and 4.2 parts by weight of acrylamidosulfonic acid;

[0038] The surfactant is composed of anionic surfactant and cationic surfactant in a weight ratio of 1:1, and the anionic surfactant is composed of 1 weight part of N,N-dimethyl-1-tetradecylamine oxide, lauryl 1 part by weight of sarcosine sodium and 1 part by weight of dodecyl diphenyl ether disulfonic acid are mixed. The cationic surfactant consists of 1 part by weight of stearyl dimethyl benzyl ammonium chloride, 1 part by weight of tetraethyl 2 parts by weight of ammonium hydroxide and 1 part by weight of tetrabutylammonium hydroxide are mixed;

[0039] The defoamer is composed of 1 part by weight of polymethylsiloxane and 2 ...

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Abstract

The invention relates to a silicon wafer cutting solution which comprises the following components in parts by weight: 65-85 parts of diethylene glycol, 70-85 parts of polyethylene glycol, 8-22 parts of a dispersant, 1-12 parts of a surfactant, 1-3 parts of a defoamer, 1-8 parts of a chelator and 65-120 parts of de-ionized water. The components are added into a stirring device and stirred at 35-55 DEG C for 30 minutes, so that the stability of silicon carbide can be improved, the redispersion capability is very good, the cutting yield can be increased, and the cutting cost is greatly reduced.

Description

technical field [0001] The invention relates to a silicon chip cutting fluid. Background technique [0002] Solar silicon wafer cutting generally uses silicon carbide micropowder with high hardness, small particle size and concentrated particle size distribution as the main cutting medium. Usually, carbonized micropowder should be added to the cutting fluid in a certain proportion, and fully dispersed, and then configured into a uniform and stable cutting mortar, which can then be used for silicon wafer cutting. Using silicon carbide micropowder as the medium in the wire cutting process of solar silicon wafers, the whole mechanism is to make the silicon carbide micropowder particles continuously and rapidly impact the surface of the silicon rod, and use the hard characteristics and sharp corners of the silicon carbide particles to gradually cut off the silicon rod. This process will Accompanied by the large frictional heat release, at the same time, the broken silicon carbi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02
Inventor 聂金根
Owner ZHENJIANG GANGNAN ELECTRIC