Self-sharpening diamond abrasive material and preparation method thereof

A diamond and self-sharpening technology, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of poor self-sharpening and achieve good self-sharpening effect

Active Publication Date: 2014-04-09
河南鑫泓研磨材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems in the prior art, the present invention provides a self-sharpening diamond abrasive and a preparation method thereof. The production efficiency of the method is high, and the prepared self-sharpening diamond abrasive not only has high strength and hardness, but also can overcome Traditional diamond abrasives have the disadvantages of poor self-sharpening and easy scratches. They are especially suitable for ultra-precision grinding and polishing of sapphire wafers in the magnetic head, hard disk, optical glass and LED industries.

Method used

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Examples

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preparation example Construction

[0023] A kind of preparation method of described self-sharpening diamond abrasive, concrete preparation method is as follows:

[0024] (1) Ingredients: Weigh the self-sharpening diamond abrasive raw material according to the following weight ratio: diamond abrasive raw material: 75-85%, metal powder raw material: 13-20%, binder raw material: 2-5%;

[0025] (2) mixing: the raw materials taken by step (1) are mixed uniformly;

[0026] (3) Sintering: put the material obtained in step (2) into a crucible, put it into a tube furnace together with the crucible, and evacuate to 10 -3 Pa; then heated to 505 ~ 645 ° C under the condition of 1 ~ 8 hours, after the end of the heat preservation, cooled to room temperature.

[0027] (4) Purification treatment: the material that step (3) is obtained immediately removes the non-diamond carbon on the surface of the product particles obtained with an oxidative acid. Promptly obtain the self-sharpening diamond abrasive of the present invention...

Embodiment 1

[0034] (1) Ingredients: The median particle size of the diamond abrasive is 7 microns as the raw material. The raw material of the self-sharpening diamond abrasive is weighed according to the following weight ratio: the raw material of the diamond abrasive is: 75%, the raw material of the metal powder is: 20%, Binder raw material: 5%;

[0035] (2) Mixing: the raw materials taken by step (1) are mixed evenly;

[0036] (3) Sintering: put the material obtained in step (2) into a crucible, put it into a tube furnace together with the crucible, and evacuate to 10 -3 Pa; then heated to 505 ° C for 1 hour, and cooled to room temperature after the end of the heat preservation.

[0037] (4) Purification treatment: the material that step (3) is obtained immediately removes the non-diamond carbon on the surface of the product particles obtained with an oxidative acid. Promptly obtain the self-sharpening diamond abrasive of the present invention;

[0038] The median particle size of th...

Embodiment 2

[0040] (1) Ingredients: The median particle size of the diamond abrasive is 15 microns as the raw material. The raw material of the self-sharpening diamond abrasive is weighed according to the following weight ratio: the raw material of the diamond abrasive is: 85%, the raw material of the metal powder is: 13%, Binder raw material: 2%;

[0041] (2) Mixing: the raw materials taken by step (1) are mixed evenly;

[0042] (3) Sintering: put the material obtained in step (2) into a crucible, put it into a tube furnace together with the crucible, and evacuate to 10 -3 Pa; then heated to 530°C for 2.5 hours, and cooled to room temperature after the end of the heat preservation.

[0043] (4) Purification treatment: the material that step (3) is obtained immediately removes the non-diamond carbon on the surface of the product particles obtained with an oxidative acid. Promptly obtain the self-sharpening diamond abrasive of the present invention;

[0044] The median particle size of t...

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PUM

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Abstract

The invention discloses a self-sharpening diamond abrasive material. The self-sharpening diamond abrasive material comprises the following raw materials by weight: 75-85% of a diamond abrasive materail, 13-20% of metal powder and 2-5% of a binding agent. The particle size of the diamond abrasive material is 0.5 [mu]m-100 [mu]m; the metal powder comprises iron, cobalt, manganese, or a mixture thereof, or an alloy; and the binding agent comprises diethylenetriamine, 1,3-cyclohexanebis(methylamine), trimethylhexamethylenediamine, or a mixture thereof or one of the above. The self-sharpening diamond abrasive material is rough in surface and has more grinding surface angles. When particles are suffering from stress, frangibility causes the particles broken, so that novel sharp cutting edge is generated and the self-sharpening property is better. The self-sharpening diamond abrasive material is particularly suitable for ultrafine grinding and polishing of magnetic heads, hard disks, optical glasses and sapphire wafers.

Description

technical field [0001] The invention relates to a diamond abrasive, in particular to a self-sharpening diamond abrasive and a preparation method thereof. Background technique [0002] Diamond micropowder is a fine superabrasive. Usually submillimeter-sized diamond single crystal is used as raw material, and after crushing, shaping and a series of physical and chemical treatments, abrasives with regular particle shape and a certain particle size distribution are produced. It is the most advanced and precise superabrasive in the world, widely used in various fields such as machinery, electronics, metallurgy, construction and national defense. It is often used for processing hard and brittle materials and workpieces requiring high precision. For example: ball raceways of bearings, tungsten carbide and diamond wire drawing dies, various ceramic parts, precision molds, silicon wafers, optical lenses, chips, various magnetic material components, rubies, sapphires, emeralds, emer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14
Inventor 祝世连
Owner 河南鑫泓研磨材料有限公司
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