A Comprehensive Test Method for Optical Properties of Deep Ultraviolet Optical Components

Abstract

The invention provides a comprehensive testing method of the optical performance of a deep ultraviolet optical element. According to the comprehensive testing method, the absorption loss absolute value of the deep ultraviolet optical element is measured based on the laser heat measurement technology; the fluorescence spectrum of the deep ultraviolet optical element is measured based on the laser-induced fluorescence spectrum technology when the deep ultraviolet optical element is irradiated by a deep ultraviolet laser; the defect level, the contents of doping components and the content of impurities of a material of the deep ultraviolet optical element are measured based on the Raman spectra technology. Through measurement of the absorption loss feature, the fluorescence spectrum feature and the Raman spectral feature of the deep ultraviolet optical element at the deep ultraviolet laser wavelength, the comprehensive optical performance of the deep ultraviolet optical element is estimated. By measuring the real-time change of the absorption loss, the fluorescence spectrum and the Raman spectrum of the deep ultraviolet optical element in the process of deep ultraviolet laser irradiation, the stability of the performance of the deep ultraviolet optical element is monitored. By the adoption of the same device, the optical feature parameters of the deep ultraviolet optical element are measured and the change of the optical feature of the deep ultraviolet optical element in the process of deep ultraviolet laser irradiation is monitored in real time.

Description

technical field [0001] The invention relates to a method and device for measuring parameters of an optical element, in particular to a comprehensive test method for the optical performance of a deep ultraviolet optical element, which can test the optical performance and stability of the deep ultraviolet optical element. Background technique [0002] In VLSI manufacturing process, excimer laser lithography is one of the most important processes. At present, the main laser light source used in semiconductor integrated circuit lithography equipment is argon fluoride (ArF) excimer laser with an output wavelength of 193nm. In lithography equipment, deep ultraviolet optical elements are widely used, including reflective optical elements, transmission optical elements, attenuation optical elements, etc., for shaping, transmission and control of 193nm laser beams. The optical materials used to prepare these deep ultraviolet optical components are mainly ultraviolet-grade fused sili...

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Problems solved by technology

Chinese patent application "A comprehensive test method for the stability of deep ultraviolet optical components" (patent application number 201010623885.2, application publication date 2010.09.07) proposes a comprehensive test integrating laser calorimetry technology, photothermal technology and laser-induced fluorescence spectroscopy technology The technology comprehensively measures the stability of deep ultraviolet optical elements. Although it can simultaneously determine the real-time changes of the absorption characteristics and fluorescence spectral characteristics of deep ultraviolet optical elements under deep ultraviolet laser irradiation, it cannot simultaneously measure the H2 in deep ultraviolet optical elements. Changes in content

Although W.Triebel et al. proposed an integrated measurement device for laser-induced fluorescence spectroscopy and Raman spectroscopy of deep ultraviolet optical elements (W.Triebel, S.Bark-Zollmann, C.Muehlig, et al; "EvaluationoffusedsilicaforDUVlaserapplicationsbyshorttimediagnostics", Proc. .SPIE4103(2000)), but the device uses two lasers with different wavelengths to excite fluorescence and Raman scattered light respectively, which cannot realize the simultaneous and in-situ measurement of fluorescence spectrum and Raman spectrum

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