Thermosetting resin composition and applications thereof

A resin composition, thermosetting technology, applied in applications, other household appliances, synthetic resin layered products, etc., can solve the problems of poor thermal stability and heat and humidity resistance, poor processability, poor dielectric properties, etc., to achieve curing Effect of short temperature, good toughness, good thermal stability and heat and humidity resistance

Active Publication Date: 2014-04-30
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the first aspect of the embodiment of the present invention provides a thermosetting resin composition to solve the problem of poor dielectric properties, poor th

Method used

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  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0098] Example 1

[0099] Add 3000g of water and 30g of sodium hydroxide into a four-necked flask, add 95g of diallyl bisphenol A after the temperature drops to room temperature, place this solution in an ice salt bath, wait until the temperature drops below 20℃, and start adding bromine dropwise 150g of ethane, control the temperature to be lower than 20°C, react at low temperature for 30min after the dropping, raise the temperature to 50°C for 2h, stop the reaction, cool down, separate the phases, and wash with water to obtain ethyl etherified diallyl bisphenol A .

[0100] Take 1 mol of ethyl etherified diallyl bisphenol A and 1 mol of diphenylmethane bismaleimide synthesized above into the flask, heat to 145°C, stir for 30 minutes, pour out and cool to obtain ethyl ether Diallyl bisphenol A and diphenylmethane bismaleimide prepolymer.

[0101] figure 1 It is the infrared spectrum of the prepolymer of ethyl etherified diallyl bisphenol A and diphenylmethane bismaleimide synthes...

Example Embodiment

[0104] Example 2

[0105] Take 1 mol of ethyl etherified diallyl bisphenol A synthesized in Example 1 and 0.5 mol of diphenyl sulfone bismaleimide into a flask, heat to 140°C, stir for 90 minutes, pour out and cool to obtain ethyl A prepolymer of diallyl bisphenol A and diphenyl sulfone bismaleimide.

[0106] Take 30 parts of prepolymer of ethyl etherified diallyl bisphenol A and diphenyl sulfone bismaleimide synthesized above, and 30 parts of polyphenylene ether resin (SA9000) with unsaturated double bond at molecular end , 16 parts of bisphenol A cyanate ester, 12 parts of decabromodiphenylethane, 25 parts of fused silica powder, 2 parts of 2,5-bis(2-ethylhexanoylperoxy)-2,5-dimethyl Base 3-hexyne, use toluene to dissolve the above compound and prepare a glue of suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in a 135℃ oven to obtain a B-stage prepreg sample with a resin content of 54%.

[0107] Eight pieces of the above-prepare...

Example Embodiment

[0108] Example 3

[0109] Take 1 mol of ethyl etherified diallyl bisphenol A synthesized in Example 1 and 0.5 mol of diphenyl sulfone bismaleimide into a flask, heat to 140°C, stir for 90 minutes, pour out and cool to obtain ethyl A prepolymer of diallyl bisphenol A and diphenyl sulfone bismaleimide.

[0110] Take 30 parts of the prepolymer of ethyl etherified diallyl bisphenol A and diphenyl sulfone bismaleimide synthesized above, polyphenylene ether resin (SA9000) 30 with unsaturated double bond at the molecular end, 12 parts of decabromodiphenylethane, 25 parts of fused silica powder, 2 parts of 2,5-bis(2-ethylhexanoylperoxy)-2,5-dimethyl-3-hexyne, use toluene to The compound is dissolved and prepared into a glue of suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in a 135℃ oven to obtain a B-stage prepreg sample with a resin content of 54%.

[0111] The eight pieces of prepreg and two half-ounce pieces of electrolytic copper fo...

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Abstract

The invention provides a thermosetting resin composition comprising a prepolymer of a diallyl compound and a maleimide compound, wherein the structural formula of the diallyl compound is shown as a formula (1) described in the specification; R1 is -C (CH3)2, -C (CF3)2, -SO2, -CH (CH3), -CH2 or an oxygen atom; R2 and R3 are same or different aliphatic hydrocarbon with the carbon number below 10 or aromatic hydrocarbon with the carbon number below 30; the R2 and the R3 contain no allyl group. The thermosetting resin composition has the advantages of good heat stability and heat and humidity resistance, low dielectric constant and dielectric loss angle tangent and excellent process machinability. The embodiment of the invention further provides applications of the thermosetting resin composition to resin sheets, resin composite metal foils, prepregs, laminated boards, metal foil clad laminates and printed circuit boards.

Description

technical field [0001] The present invention relates to a resin composition, in particular to a thermosetting resin composition and its application in resin sheets, resin composite metal foils, prepregs, laminates, metal foil-clad laminates and printed circuit boards . Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend requirements of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires the substrate material not only to have good dielectric properties (low dielectric constant and low dielectric loss tangent) to meet the needs of high-frequency signal transmission, but also requires It has goo...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L71/12C08G73/12C08G73/10C08K5/03C08K5/14B32B15/08B32B15/20B32B27/04H05K1/03
CPCC08L79/085B32B15/08B32B27/04B32B2260/046B32B2307/306B32B2379/08B32B2457/08C08G73/124C08L47/00C08L71/12C08L2201/08C08L2203/20H05K1/0366
Inventor 苏民社
Owner HONOR DEVICE CO LTD
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