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Thermosetting resin composition and applications thereof

A resin composition, thermosetting technology, applied in applications, other household appliances, synthetic resin layered products, etc., can solve the problems of poor thermal stability and heat and humidity resistance, poor processability, poor dielectric properties, etc., to achieve curing Effect of short temperature, good toughness, good thermal stability and heat and humidity resistance

Active Publication Date: 2014-04-30
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the first aspect of the embodiment of the present invention provides a thermosetting resin composition to solve the problem of poor dielectric properties, poor thermal stability and heat and humidity resistance, low curing efficiency, and technical problems of thermosetting resin compositions in the prior art. Problems such as poor processability

Method used

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  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0099] Add 3000g of water and 30g of sodium hydroxide into the four-neck flask, add 95g of diallyl bisphenol A after the temperature drops to room temperature, put the solution in an ice-salt bath, wait until the temperature drops below 20°C, start adding bromine dropwise Ethane 150g, control the temperature below 20°C, react at low temperature for 30min after the dropwise addition, raise the temperature to 50°C for 2h, stop the reaction, lower the temperature, separate phases, wash with water to obtain ethyl etherified diallyl bisphenol A .

[0100] Take 1 mol of ethyl etherified diallyl bisphenol A and 1 mol of diphenylmethane bismaleimide synthesized above, put them into a flask, heat to 145°C, stir for 30 minutes, pour out and cool to obtain ethyl ether A prepolymer of diallyl bisphenol A and diphenylmethane bismaleimide.

[0101] figure 1 It is the infrared spectrogram of the prepolymer of ethyl etherified diallyl bisphenol A and diphenylmethane bismaleimide synthesized...

Embodiment 2

[0105] Take 1 mol of ethyl etherified diallyl bisphenol A synthesized in Example 1, put 0.5 mol of diphenyl sulfone bismaleimide into a flask, heat to 140° C., stir for 90 minutes, pour it out and cool it down to obtain ethyl alcohol A prepolymer of etherified diallyl bisphenol A and diphenylsulfone bismaleimide.

[0106] Take 30 parts of the prepolymer of ethyl etherified diallyl bisphenol A and diphenylsulfone bismaleimide synthesized above, and 30 parts of polyphenylene ether resin (SA9000) with unsaturated double bonds at the molecular end , 16 parts of bisphenol A cyanate, 12 parts of decabromodiphenylethane, 25 parts of fused silica powder, 2 parts of 2,5-bis(2-ethylhexanoyl peroxy)-2,5-dimethyl Base-3-hexyne, use toluene to dissolve the above compound, and prepare a glue with a suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 135°C to obtain a B-stage prepreg sample with a resin content of 54%.

[0107] E...

Embodiment 3

[0109] Take 1 mol of ethyl etherified diallyl bisphenol A synthesized in Example 1, put 0.5 mol of diphenyl sulfone bismaleimide into a flask, heat to 140° C., stir for 90 minutes, pour it out and cool it down to obtain ethyl alcohol A prepolymer of etherified diallyl bisphenol A and diphenylsulfone bismaleimide.

[0110] Take 30 parts of the prepolymer of ethyl etherified diallyl bisphenol A and diphenylsulfone bismaleimide synthesized above, and 30 parts of polyphenylene ether resin (SA9000) with unsaturated double bonds at the molecular end, 12 parts of decabromodiphenylethane, 25 parts of fused silica powder, 2 parts of 2,5-bis(2-ethylhexanoyl peroxy)-2,5-dimethyl-3-hexyne, using toluene to dissolve the above The compound dissolves and makes a glue of the right viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 135°C to obtain a B-stage prepreg sample with a resin content of 54%.

[0111] Eight pieces of prepreg and tw...

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Abstract

The invention provides a thermosetting resin composition comprising a prepolymer of a diallyl compound and a maleimide compound, wherein the structural formula of the diallyl compound is shown as a formula (1) described in the specification; R1 is -C (CH3)2, -C (CF3)2, -SO2, -CH (CH3), -CH2 or an oxygen atom; R2 and R3 are same or different aliphatic hydrocarbon with the carbon number below 10 or aromatic hydrocarbon with the carbon number below 30; the R2 and the R3 contain no allyl group. The thermosetting resin composition has the advantages of good heat stability and heat and humidity resistance, low dielectric constant and dielectric loss angle tangent and excellent process machinability. The embodiment of the invention further provides applications of the thermosetting resin composition to resin sheets, resin composite metal foils, prepregs, laminated boards, metal foil clad laminates and printed circuit boards.

Description

technical field [0001] The present invention relates to a resin composition, in particular to a thermosetting resin composition and its application in resin sheets, resin composite metal foils, prepregs, laminates, metal foil-clad laminates and printed circuit boards . Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend requirements of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires the substrate material not only to have good dielectric properties (low dielectric constant and low dielectric loss tangent) to meet the needs of high-frequency signal transmission, but also requires It has goo...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L71/12C08G73/12C08G73/10C08K5/03C08K5/14B32B15/08B32B15/20B32B27/04H05K1/03
CPCC08L79/085B32B15/08B32B27/04B32B2260/046B32B2307/306B32B2379/08B32B2457/08C08G73/124C08L47/00C08L71/12C08L2201/08C08L2203/20H05K1/0366
Inventor 苏民社
Owner HONOR DEVICE CO LTD
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