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Photosensitive alkali-soluble silicone resin composition

A technology of resin composition and silicone, which is applied in the fields of optomechanical equipment, epoxy resin coating, optics, etc. It can solve the problems of reduced physical properties of cured film and inability to complete thermal imidization, etc.

Inactive Publication Date: 2014-04-30
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of the conventional polyimide resin precursor composition, when the curing temperature is lowered, the thermal imidization cannot be completed, and the physical properties of various cured films are lowered, so the lower limit of the curing temperature is around 300°C
[0005] In addition, Patent Document 2 discloses a photosensitive siloxane-based material that can be cured at low temperature. However, only the technology disclosed in Patent Document 2 cannot be developed with an alkaline developer when performing fine processing.

Method used

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  • Photosensitive alkali-soluble silicone resin composition
  • Photosensitive alkali-soluble silicone resin composition
  • Photosensitive alkali-soluble silicone resin composition

Examples

Experimental program
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Effect test

preparation example Construction

[0176] Examples of the compound (a) used in the production of carboxyl group-containing vinyl polymers include (meth)acrylic acid, (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate base) acrylate, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl hexahydrophthalic acid, 2-(meth)acryloyloxyethyl Phthalic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, and half esters of maleic acid. These can be used individually or in combination of 2 or more types, respectively.

[0177] Examples of the compound (b) used in the production of carboxyl group-containing vinyl polymers include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, (meth)acrylate, base) lauryl acrylate, cyclohexyl (meth)acrylate, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, (meth) ) 2-hydroxypropyl acrylate, 4-hydroxybutyl (meth)acrylate, caprolactone (meth)acrylate, nonylphenoxy polypropylene glycol...

Embodiment

[0359] Hereinafter, the method of the present invention will be described in detail based on examples. However, the present invention is not limited by the following examples.

Synthetic example 1

[0361] (Synthesis of Alkali-Soluble Silicone Resin P-1)

[0362] Add 0.67 moles (144.2 g) of DPD (diphenylsilanediol) as a silanediol compound, MEMO (3-methacryloyloxypropyl trimethylmethacrylate) as an alkoxysilane compound to a 500 ml eggplant-shaped flask. Oxysilane) 0.47 moles (116.7 g), (3-trimethoxysilylpropyl) succinic anhydride 0.20 moles (52.5 g) as an alkoxysilane compound containing a dicarboxylic acid anhydride structure, hydrogen oxidation as a catalyst Barium 0.0015 mole (0.28g). With the cooler attached to the eggplant-shaped flask, the temperature was gradually raised from room temperature to 100° C. using an oil bath, and after confirming that reflux of methanol occurred at 100° C., reflux was continued at that temperature for 1 hour. Then, the cooler was removed, connected to a cold trap and a vacuum pump, and methanol was removed without bumping while slowly depressurizing. After the degree of vacuum reaches 1 to 3 torr (torr), vacuumize continuously for 1...

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PUM

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Abstract

The present invention relates to a photosensitive alkali-soluble silicone resin composition comprising an alkali-soluble silicone resin (A) which comprises a carboxyl group or a dicarboxylic acid anhydride group in one molecule; an alkali-soluble resin (B) whose acid value is between 10 mgKOH / g and 200 mgKOH / g; and a photoinitiator (C). The (A) or (B) ingredient may comprise a photosensitive unsaturated double bond group, or the photosensitive alkali-soluble silicone resin composition may further comprise a compound (D) which comprises a photosensitive unsaturated double bond.

Description

technical field [0001] The present invention relates to the formation of insulating materials used in display devices, surface protection films, interlayer insulating films, α-ray shielding films, etc. A resin composition used in a device and the like, and a display device and the like manufactured using the resin composition. Background technique [0002] Polyimide, which has excellent heat resistance, electrical properties, and mechanical properties, can be widely used in applications such as insulating materials for electronic components, surface protection films, interlayer insulating films, and α-ray shielding films for semiconductor devices. resin. This resin has the following characteristics: It is usually provided in the form of a photosensitive polyimide precursor composition, which is applied to a substrate, prebaked, and irradiated with active light through a desired pattern mask (exposure), By developing and performing a thermal curing treatment, a cured relief...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075C08F230/08C08F290/08C08G77/14C08G77/20G03F7/033G03F7/038H01L21/027
CPCC08G77/14C08G77/20G03F7/0757C08F290/08G03F7/032G03F7/0388H01L21/027C08F230/08C08L83/06C09D167/00G03F7/027G03F7/038G03F7/035G03F7/033C09D183/06C09D163/04C09D175/04C08F230/085C08L33/00C08L63/00C08L75/00G03F7/075
Inventor 斋藤大和岩间珠莉胜又彻佐佐木由香木村正志松田治美
Owner ASAHI KASEI KK
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