Instant crispy pumpkin patches and preparation method thereof

A dough and pumpkin technology is applied in the field of instant pumpkin-flavored food and its production, which can solve problems such as the pumpkin-flavored instant dough that has not yet been found, and achieve the effects of improving immunity, facilitating absorption, and preventing mutual adhesion.

Inactive Publication Date: 2015-03-11
ANHUI SCI & TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After extensive searching, no relevant public records and reports on the development of pumpkin-flavored instant noodle products have been found

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The mass ratio of the raw materials used to make the noodles is: 500 parts of wheat flour, 50 parts of pumpkin with skin and pulp removed, 10 parts of pumpkin kernels, 40 parts of white sugar, 1 part of salt, and 5 parts of honey.

[0019] 1. Steam the pumpkin with the ratio weight removed from the skin and flesh, then mash and squeeze it through a 80-100 mesh filter screen for silk removal to obtain pumpkin puree, mix the pumpkin puree with water at a mass ratio of 1:3 and mix thoroughly Make pumpkin puree mixture and set aside;

[0020] 2. Bake the pumpkin seed kernels with proportioning weight until mature, crush them to the size of rice grains, and set aside;

[0021] 3. Add the proportioned weight of wheat flour, salt, sugar and processed cooked pumpkin seeds to the above pumpkin puree mixture and stir evenly to make a dough. Leave the dough for 20 minutes to wake up, and then press it into a 0.5-1mm thick Dough slices, and then processed into various small pieces...

Embodiment 2

[0025] The mass ratio of the raw materials used to make the noodles is: 500 parts of wheat flour, 80 parts of pumpkin with skin and flesh removed, 13 parts of pumpkin kernels, 50 parts of white sugar, 1.5 parts of table salt, and 7 parts of honey.

[0026] 1. Steam the pumpkin with the ratio weight removed from the skin and flesh, then mash and squeeze it through a 80-100 mesh filter screen for silk removal to obtain pumpkin puree, mix the pumpkin puree with water at a mass ratio of 1:3 and mix thoroughly Make pumpkin puree mixture and set aside;

[0027] 2. Bake the pumpkin seed kernels with proportioning weight until mature, crush them to the size of rice grains, and set aside;

[0028] 3. Add the proportioned weight of wheat flour, salt, sugar and processed cooked pumpkin seeds to the above pumpkin puree mixture and stir evenly to make a dough. Leave the dough for 20 minutes to wake up, and then press it into a 0.5-1mm thick Dough slices, and then processed into various sm...

Embodiment 3

[0032] The mass ratio of the raw materials used to make the noodles is: 500 parts of wheat flour, 100 parts of pumpkin with skin and flesh removed, 15 parts of pumpkin kernels, 60 parts of white sugar, 2 parts of table salt and 8 parts of honey.

[0033] 1. Steam the pumpkin with the ratio weight removed from the skin and flesh, then mash and squeeze it through a 80-100 mesh filter screen for silk removal to obtain pumpkin puree, mix the pumpkin puree with water at a mass ratio of 1:3 and mix thoroughly Make pumpkin puree mixture and set aside;

[0034] 2. Bake the pumpkin seed kernels with proportioning weight until mature, crush them to the size of rice grains, and set aside;

[0035] 3. Add the proportioned weight of wheat flour, salt, sugar and processed cooked pumpkin seeds to the above pumpkin puree mixture and stir evenly to make a dough. Leave the dough for 20 minutes to wake up, and then press it into a 0.5-1mm thick Dough slices, and then processed into various smal...

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PUM

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Abstract

The invention discloses instant crispy pumpkin patches and a preparation method thereof. The instant crispy pumpkin patches are prepared through the following raw materials in parts by mass: 500 parts of wheat powder, 50 to 100 parts of pumpkin without peel and flesh, 10 to 15 parts of pumpkin seeds, 40 to 60 parts of white sugar, 1 to 2 parts of table salt, and 5 to 8 parts of honey. The preparation method comprises the following steps: 1, steaming pumpkin, removing stalks with a filter screen to obtain pumpkin puree, adding water, and uniformly mixing to obtain a pumpkin puree mixed solution; 2, baking pumpkin seeds until ripping, and then crushing to reach the size like rice grains; 3, mixing and uniformly agitating raw materials, preparing paste, and then pressing into various small patches; 4, preparing iced flavored-water containing quality white sugar and table salt; 5, cooking the small patches, transferring to the iced flavored-water to completely cool, dipping in honey after completely cooling, then baking in a high-vacuum oven at temperature of 80 to 100 DEG C until showing faint yellow, and thus obtaining the crispy pumpkin patches. The instant crispy pumpkin patches have the advantages of being nutritional, healthy, instant to eat, and convenient.

Description

technical field [0001] The invention relates to the technical field of food processing, in particular to an instant pumpkin-flavored food and a preparation method thereof. Background technique [0002] Pumpkin is a plant of the genus Cucurbitaceae, also known as wheat melon, pumpkin, pumpkin, golden wax gourd, pumpkin, etc., native to Central and South America. Pumpkin is rich in nutrition, rich in starch, protein, carotene, vitamin B, vitamin C, calcium, phosphorus and other ingredients. Chinese medicine believes that pumpkin is warm in nature, sweet in taste and non-toxic, nourishes the middle and nourishes qi, lowers blood fat, lowers blood sugar, clears away heat and detoxifies, protects gastric mucosa, helps digestion, enters the spleen and stomach meridians, nourishes lungs and replenishes qi, reduces phlegm and expels pus , deworming and detoxification, curing cough and asthma, treating lung abscess and constipation, and has diuretic and cosmetic effects. After exte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A23L1/164A23L1/30A23L1/212A23L1/08A21D2/36A23L1/01A23L5/10A23L19/00A23L21/25
CPCA23L5/15A23L7/135A23L33/10
Inventor 吴晓伟李先保桑宏庆彭凌玲毛悦李雷张敏徐超超
Owner ANHUI SCI & TECH UNIV
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