Scaling powder for low-temperature halogen-free low-solid-content lead-free tin soldering

Abstract

The invention discloses scaling powder for low-temperature halogen-free low-solid-content lead-free tin soldering. The scaling powder comprises 12 percent to 16 percent of activating agents, 8-10 percent of colophony, 2-3 percent of surface active agents, 0.05-0.1 percent of antioxidants, 5-8 percent of organic amine and the balance organic solvents. The activating agents comprise compound components of 40-57 parts of anhydrous citric acid, 7-14 parts of salicylic acid, 0.6-3.6 parts of lactic acid and 36-43 parts of DL-malic acid, the surface active agents comprise compound component Tween 60 and a Span, the organic amine is one or more of monoethanolamine, diethanol amine and triethanolamine, the antioxidants are tertiary butylhydroquinone, and the organic solvents are mixed solvents of ethylene glycol, diethylene glycol diethyl ether, nitroethane, tetrahydrofurfuryl alcohol and propylene glycol by mass. According to the method, the scaling powder for low-temperature halogen-free low-solid-content lead-free tin soldering has the advantages of improving the coverage rate of the welding materials and reducing the cost.

Description

technical field [0001] The invention relates to the field of flux, in particular to a flux for low-temperature halogen-free low-solid-content lead-free solder. Background technique [0002] At present, in order to solve the problem of energy pollution, we need to invent non-polluting or less polluting flux in the lead-free solder industry. The current development direction of flux is progressing towards rosin-free, halogen-free, VOC-free, and no-cleaning. The alloy ratio needs to be matched with different fluxes. The fluxes should not only clean the oxides on the surface of the object to be welded and reduce the surface tension, but also need to meet the green environmental protection trend in terms of composition. [0003] In addition, as electronic components continue to become smaller and thinner, the working temperature set by the current lead-free solder products has already exceeded the range it can withstand. If you continue to solder under the current solder process,...

AI Technical Summary

Problems solved by technology

[0005] The main technical problem to be solved by the present invention is to provide a low-temperature, halogen-free, low-solid-content lead-free soldering flux, by selecting a mixed acid with a low decomposition temperature but a boiling point not exceeding the soldering temperature and a boiling point close to the soldering temperature to make up for the shortcomings of a single active agent , to enhance the spread rate effect of the active agent; by setting the component selection and content of antioxidants, surfactants, organic amines and organic solvents, the increase in spread rate can be effectively controlled