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Method for improving binding force of plating by adopting magnetron sputtering

A magnetron sputtering and bonding force technology, applied in sputtering plating, coating, ion implantation plating and other directions, can solve problems such as poor bonding force, achieve stable plating solution, simple plating solution composition, and no decomposition products Effect

Inactive Publication Date: 2014-05-21
WUXI XINSANZHOU STEEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] When the existing above-mentioned cyanide-free copper plating solution is used for copper plating of iron and steel parts, there is a problem of poor bonding force

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The present invention is used for the cyanide-free electroplating solution of iron and steel substrate copper plating, contains following material:

[0033] Copper sulfate 35g / L

[0034] Potassium carbonate 20g / L

[0035] Amino trimethylene phosphonic acid 100g / L

[0036] Nitrilotriacetic acid 13g / L

[0037] Phytic acid 13g / L

[0038] Sodium citrate 200g / L

[0039] The plasma cleaning process parameters are: discharge vacuum degree 10-100Pa, loading gas is Ar, processing power 100W, time 1min.

[0040] The operating conditions of the magnetron sputtering copper-nickel alloy intermediate layer are: basic vacuum degree -3 Pa, the sputtering pressure is 0.12Pa, the distance between the target and the substrate is 60mm, the sputtering power is 50W, the target diameter is 60mm, and the DC negative bias is 50V.

[0041] Preparation of electroplating solution: Accurately weigh 35g of copper sulfate and add 200ml of water to fully dissolve, dissolve 20g of potassium carbon...

Embodiment 2

[0044] The composition of cyanide-free electroplating solution:

[0045] Copper sulfate 40g / L

[0046] Potassium carbonate 60g / L

[0047] Hydroxyethylene-1,1 phosphonic acid 200g / L

[0048] Nitrilotriacetic acid 20g / L

[0049] Phytic acid 20g / L

[0050] Potassium thiocyanate 10g / L

[0051]The plasma cleaning process parameters are: discharge vacuum degree 10-100Pa, loading gas is Ar, processing power 200W, time 3min.

[0052] Among them, the operating conditions of the magnetron sputtering copper-nickel alloy intermediate layer are: basic vacuum degree -3 Pa, the sputtering pressure is 0.20Pa, the distance between the target and the substrate is 100mm, the sputtering power is 150W, the target diameter is 60mm, and the DC negative bias is 100V.

[0053] Preparation of electroplating solution: Accurately weigh 40g of copper sulfate and add 500ml of water to fully dissolve, dissolve 60g of potassium carbonate, 200g of hydroxyethylidene-1,1 phosphonic acid, 20g of nitrilotria...

Embodiment 3

[0056] The composition of cyanide-free electroplating solution:

[0057] Copper sulfate 60g / L

[0058] Potassium carbonate 60g / L

[0059] Ethylenediamine tetramethylene phosphonic acid 100g / L

[0060] Nitrilotriacetic acid 1g / L

[0061] Phytic acid 1g / L

[0062] Potassium thiocyanate 10g / L

[0063] Sodium Potassium Tartrate 20g / L

[0064] The plasma cleaning process parameters are: discharge vacuum degree 10-100Pa, loading gas is Ar, processing power 150W, time 1-3min.

[0065] Among them, the operating conditions of the magnetron sputtering copper-nickel alloy intermediate layer are: basic vacuum degree -3 Pa, the sputtering pressure is 0.15Pa, the distance between the target and the substrate is 80mm, the sputtering power is 100W, the target diameter is 60mm, and the DC negative bias is 60V.

[0066] Preparation of electroplating solution: Accurately weigh 60g of copper sulfate and add 500ml of water to fully dissolve, mix 60g of potassium carbonate, 100g of ethylenedi...

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Abstract

A method for improving the binding force of a plating by adopting magnetron sputtering comprises the processes of plasma cleaning, magnetron sputtering of a copper-nickel alloy interlayer, and non-cyanide copper plating. The adoption of the plasma cleaning in the method can fully remove oil stains and oxides on the surface of the substrate in order to improve the combination of a preplating, and the adoption of the magnetron sputtering of the copper-nickel alloy interlayer can simply and greatly improve the binding force of the plating and the substrate.

Description

technical field [0001] The invention relates to a cyanide-free electroplating solution, in particular to a cyanide-free electroplating solution for copper plating of iron and steel parts. Background technique [0002] Cyanide copper plating has been used for more than a century. Cyanide is an ideal complexing agent and a good activator. Therefore, cyanide copper plating has the advantage of combining well with steel substrates and can be used on steel substrates. Plating directly on the parts. However, the cyanide electroplating copper solution contains cyanide ions, which is highly toxic, difficult to handle waste water and liquid waste, seriously pollutes the environment, and endangers human health. In recent years, with the continuous promotion of cleaner production, some polluting processes in the electroplating industry will be eliminated. Therefore, people have been looking for a cyanide-free copper plating process that can replace cyanide electroplating copper. [0...

Claims

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Application Information

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IPC IPC(8): C23C28/02C23C14/35C23C14/16C23C14/02C25D3/38C25D5/36
Inventor 林永峰
Owner WUXI XINSANZHOU STEEL
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