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Nanometer micropore heat insulation board and manufacturing method thereof

A technology of heat insulation and nano-micropores, which is applied in the direction of heat preservation, heat exchange equipment, and pipeline protection through heat insulation, can solve the problems of inability to achieve heat preservation and heat insulation, achieve good heat preservation, improve refractoriness and surface mechanical strength, Strong high temperature resistance and mechanical properties

Active Publication Date: 2014-05-21
桐乡市中元建材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the multi-layer composite heat insulation structure in the prior art uses airgel composite materials as the inner heat insulation layer and the outer heat insulation layer respectively, which cannot achieve long-term and effective heat preservation and insulation under high temperature conditions. heat, so as to provide a nano-microporous thermal insulation board with good thermal insulation and thermal insulation performance under high temperature conditions and its preparation method

Method used

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  • Nanometer micropore heat insulation board and manufacturing method thereof

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Embodiment 1

[0030] This embodiment provides a nano-microporous thermal insulation board with a structure such as figure 1 As shown, from the cold side to the hot side (from top to bottom in the figure) are the thermal insulation layer, the anti-radiation layer and the reinforcement layer. The thickness of the thermal insulation layer, the anti-radiation layer and the reinforcement layer are 3mm, 1.5mm, and 1.5 respectively. mm; wherein the material composition of the thermal insulation layer is 550g fumed silica and 30g glass fiber; the material composition of the anti-radiation layer is 30g nanometer silicon carbide, 15g nanometer titanium dioxide; the material composition of the reinforcement layer It is 30g aluminum oxide and 6g zirconium oxide;

[0031] It is prepared by the following method:

[0032] (1) Weigh the material components of the reinforcement layer and inject it into the mold, and spread it flat on the bottom of the mold as the bottom layer;

[0033] (2) Weigh the material com...

Embodiment 2

[0038] This embodiment provides a nanoporous heat-insulating and heat-preserving board, which is composed of an insulation layer, an anti-radiation layer, and an enhanced layer from the cold side to the hot side. The thickness of the insulation layer, the anti-radiation layer and the enhanced layer are 15 mm and 0.5, respectively. mm, 0.5mm; wherein the material composition of the thermal insulation layer is 2400g of fumed silica and 150g of ceramic fiber; the material composition of the anti-radiation layer is 100g of nanometer silicon carbide and 30g of nanometer titanium dioxide; The material components are 100g aluminum oxide and 50g inorganic clay;

[0039] It is prepared by the following method:

[0040] (1) Weigh the material components of the reinforcement layer and inject it into the mold, and spread it flat on the bottom of the mold as the bottom layer;

[0041] (2) Weigh the material components of the thermal insulation layer into the mold, and spread them evenly on the b...

Embodiment 3

[0046] This embodiment provides a nanoporous thermal insulation board, which is composed of an insulation layer, an anti-radiation layer, and an enhanced layer from the cold side to the hot side. The thickness of the insulation layer, the anti-radiation layer and the enhanced layer are 4mm and 2mm, respectively. , 2mm; wherein the material composition of the thermal insulation layer is 650g fumed silica, 20g glass fiber, 10g ceramic fiber, 10g alumina fiber, 5g carbon fiber; the material composition of the anti-radiation layer is 60g nano silicon carbide The material component of the reinforcement layer is 60g aluminum oxide;

[0047] It is prepared by the following method:

[0048] (1) Weigh the material components of the reinforcement layer and inject it into the mold, and spread it flat on the bottom of the mold as the bottom layer;

[0049] (2) Weigh the material components of the thermal insulation layer into the mold, and spread them evenly on the bottom layer of step (1) to f...

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Abstract

The invention relates to a nanometer micropore heat insulation board. Structurally, an insulation layer, an anti-radiation layer and an enhancement layer are arranged from the cold face to the hot face in sequence. When the nanometer micropore heat insulation board is used, the enhancement layer close to the hot face has strong high-temperature resistance and a strong mechanical property, the insulation layer far away from the hot face has good insulation and heat insulation properties, furthermore, opacifying agent components are added into the anti-radiation layer serving as the middle layer, the radiative heat transferring of the anti-radiation layer is reduced by reducing the overall extinction coefficient, and the insulation and heat insulation properties of the insulation board are intensified. Due to the fact that different opacifying agents have different extinction coefficients and a wide anti-radiation temperature range can be shown, the nanometer micropore heat insulation board can keep the good insulation and heat insulation properties under the high-temperature condition.

Description

Technical field [0001] The invention relates to a nano-microporous thermal insulation board and a preparation method thereof, and belongs to the technical field of thermal insulation materials. Background technique [0002] The concept of superinsulation was put forward by American Hunt A J and others at the 1992 International Material Engineering Conference. It refers to an insulating material whose thermal conductivity is lower than that of "still air" under certain conditions of use. The structure of silica aerogel material has a large number of nano-pores, and more than 85% of the pores are less than 50nm in diameter. The average free path of oxygen and nitrogen molecules in the air is about 70nm. When the pore diameter is less than the average free path of gas At this time, air molecules can be regarded as "static", which effectively eliminates the convective heat transfer of the gas. At the same time, the ultra-high porosity limits the solid-phase heat transfer of the silic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16L59/02F16L59/08
CPCB32B33/00B32B2307/304B32B2307/306B32B2307/3065F16L59/029F16L59/08
Inventor 王璐
Owner 桐乡市中元建材科技有限公司
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