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Oxide semiconductor light-emitting diode epitaxial wafer, device and manufacturing method thereof

A nitride semiconductor, light-emitting diode technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the radiation recombination efficiency of quantum wells, easy diffusion into these wells, and unbalanced carrier concentration. The effect of radiation recombination efficiency, improving electro-optical conversion efficiency, and improving internal quantum efficiency

Inactive Publication Date: 2014-05-21
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Problems solved by technology

This leads to an obvious problem: the carrier concentration imbalance in the n-type layer and p-type layer in the corresponding LED structure
These Mg atoms lead to more non-radiative recombination centers in the quantum well, which reduces the radiative recombination efficiency in the quantum well, that is, reduces the luminous efficiency
In nitride LEDs, since the hole mobility is lower than the electron mobility, one or several quantum wells close to the p-type layer are the most important light-emitting layers, that is, one or several quantum wells close to the p-type layer are important for LEDs. The luminous efficiency of the LED is very important, and due to the proximity of the p-type carrier blocking layer, the Mg in the blocking layer is easy to diffuse into these wells, so the problem of Mg diffusion is very important for the quantum efficiency of the LED, and it is quite important. negative effect

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  • Oxide semiconductor light-emitting diode epitaxial wafer, device and manufacturing method thereof
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  • Oxide semiconductor light-emitting diode epitaxial wafer, device and manufacturing method thereof

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[0030]In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints. The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the ...

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Abstract

The invention provides an oxide semiconductor light-emitting diode (LED) epitaxial wafer, a device and a manufacturing method thereof. The oxide semiconductor light-emitting diode epitaxial wafer comprises a substrate, and a template layer, an n type layer, a quantum well active layer, a carrier blocking layer and a p type layer deposited in sequence on the substrate, wherein doping elements in the p type layer at least comprise Mg; the carrier blocking layer is an oxide material containing the element Al, and the element Mg is only permeated into the p type layer at a later period but is not doped in an early depositing process. The non-intentionally-doped carrier blocking layer of a proper thickness is inserted between the active region of a quantum well and the p type layer, thereby the effectively reducing the diffusion effect of a doping agent, namely Mg, in the p type layer in the active region of the quantum well, and increasing the radiation composite efficiency of the quantum well, namely, effectively increasing the internal quantum efficiency of an oxide LED.

Description

technical field [0001] The invention relates to the technical field of semiconductor light-emitting diodes (hereinafter referred to as LEDs), in particular to a nitride semiconductor light-emitting diode epitaxial wafer, a device and a preparation method thereof. Background technique [0002] III-V nitride semiconductor materials mainly include compound materials such as gallium nitride (GaN), aluminum nitride (AlN), indium nitride (In) and aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), Aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN) and other alloy materials. Since the Japanese scientist Nakamura Shuji invented GaN-based blue light-emitting diodes in the 1990s, nitride materials and light-emitting devices have attracted more and more attention. The material growth and device preparation technologies of GaN-based blue-light LEDs have developed rapidly. Nitrogen The luminous efficiency of compound white LEDs has been continuously...

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Application Information

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IPC IPC(8): H01L33/14H01L33/00
CPCH01L33/145H01L33/0075H01L33/06H01L33/32
Inventor 闫建昌王军喜张韵丛培沛孙莉莉董鹏田迎冬李晋闽
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI