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Preparation method for infrared heat-light modulator adopting sandwich composite structure

A thermo-optical modulator and composite structure technology, applied in the field of optoelectronics, can solve the problems of increasing manufacturing cost and complexity, and achieve the effects of broad market application prospects, fast phase transition speed and simple manufacturing process

Inactive Publication Date: 2014-05-28
UNIV OF SHANGHAI FOR SCI & TECH
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Problems solved by technology

In order to extend the range of movement or precisely control the deflection angle, electrical feedback needs to be applied to the moving micromirror, and the added circuit will increase the manufacturing cost and complexity

Method used

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  • Preparation method for infrared heat-light modulator adopting sandwich composite structure

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Embodiment Construction

[0015] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. However, this embodiment cannot be used to limit the present invention, and all similar methods and similar changes of the present invention should be included in the protection scope of the present invention.

[0016] figure 1 It is a structural schematic diagram of the sandwich composite structure infrared thermo-optic modulator of the present invention. Wherein 1 is one of the upper sapphire substrate, sulfur-gallium silver substrate or zinc sulfide substrate, 2 is the upper FTO transparent conductive film layer, 3 is the nano vanadium dioxide film layer, 4 is the lower FTO transparent conductive film layer, 5 is one of the lower layer sapphire substrate, sulfur gallium silver substrate or zinc sulfide substrate.

[0017] The preparation method of the sandwich composite structure infrared light modulator in the present invention, its steps are as f...

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Abstract

An infrared heat-light modulator adopting a sandwich composite structure consists of two substrates, FTO transparent conductive film layers and a vanadium dioxide film layer. A preparation method of the infrared heat-light modulator comprises the following steps: adopting a sol-gel method, precipitating an FTO transparent conductive film layer on each substrate, then sputtering metal vanadium on one FTO transparent conductive film through direct current magnetic control, obtaining the nano vanadium dioxide film layer through medium temperature annealing, and finally encapsulating the nano vanadium dioxide film layer with the other substrate with precipitated FTO transparent conductive film so as to form the infrared heat-light modulator adopting the sandwich composite structure. The infrared heat-light modulator can realize infrared band heat-light modulation, is low in insertion loss, achieves femtosecond level in phase change speed, has the advantages of low power consumption, simple structure, high reliability, easiness in manufacture and the like, and can be applied to the technical field of photoelectrons.

Description

technical field [0001] The invention relates to a preparation method of an infrared thermo-optic modulator with a sandwich composite structure, which is used in the field of optoelectronic technology. Background technique [0002] Optical modulators are key devices in optical information acquisition and processing systems. In order to meet the requirements of the information society for high-speed transmission, people are currently focusing on research on micro-mechanical optical modulators. Patent Publication No. CN101963698B discloses a micromechanical spatial light modulator. The micromechanical spatial light modulator utilizes the twisting of a microtorsion mirror to select an optical path and modulate light. Because the modulator uses the twist of the micro-torsion mirror, its disadvantages are that it is difficult to meet the requirements of the information society for high-speed transmission due to the convenience of speed, high reliability, and manufacturability. R...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/18C23C14/58G02F1/01
Inventor 李毅郑鸿柱袁文瑞陈少娟陈建坤孙瑶唐佳茵郝如龙刘飞方宝英王小华佟国香肖寒
Owner UNIV OF SHANGHAI FOR SCI & TECH
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