Photosensitive resin composition and insulating layer made thereof
A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as residual rate reduction, pattern damage, film diffusion, etc., and achieve the effect of easy processing
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0139] The method for preparing an insulating layer according to the present invention may include: applying the photosensitive resin composition of the present invention to the top of a substrate for a display device or a source / drain electrode or a silicon nitride layer provided on the substrate pre-baking the photosensitive resin composition; selectively exposing and developing the photosensitive resin composition to form a pattern; and fully exposing and heating, or only heating the photosensitive resin composition.
[0140] The substrate can be prepared using glass or a transparent plastic resin as a main material, which is generally used in the manufacture of liquid crystal display devices or organic electroluminescent displays, and the like. However, such materials are not particularly limited, but may depend on the characteristics of a display device to be used. For example, a metal film may be provided to form a gate electrode on an insulating substrate such as a glas...
Embodiment 1-8
[0148] Embodiment 1-8 and comparative example
[0149] Spin coating compositions were prepared using the components listed in Table 1 at their respective levels (wt %).
[0150] [Table 1]
[0151]
[0152]
experiment example
[0154] For the resin compositions prepared according to Examples and Comparative Examples, the following evaluation experiments were performed, and the results are shown in Table 2 below.
[0155] (1) Sensitivity
[0156] Each photosensitive resin composition according to Examples 1-8 and Comparative Example was applied onto a glass substrate having a thickness of 0.7 mm (Corning 1737, manufactured by Corning co.), followed by heating it on a hot plate at 100° C. The solvent was volatilized for 125 seconds to form a photosensitive resin composition layer with a thickness of 4.0 μm.
[0157] Then, in order to obtain a contact hole pattern with a diameter of 10 μm, exposure was performed by means of an i-ray lithography machine (NSR-205i11D, manufactured by Nikon. Co.) using a mask having a square pattern opening with a size of 10 μm.
[0158] After exposure, the substrate was subjected to puddle development at 23°C for 40 seconds using a 2.38% tetramethylammonium hydroxide sol...
PUM
| Property | Measurement | Unit |
|---|---|---|
| size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



