Preparation method for gold-tin eutectic alloy foil having uniform structure

A technology of eutectic alloy and uniform structure, which is applied to the preparation of gold-tin eutectic alloy foil with uniform structure and the processing technology of difficult-to-deform alloy foil, and achieves reduction of production cost, uniform deformation and stress of welding piece, and good welding performance. Effect

Active Publication Date: 2014-07-23
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defects of the existing difficult-to-deform metal precision foil processing technology, and provide

Method used

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  • Preparation method for gold-tin eutectic alloy foil having uniform structure
  • Preparation method for gold-tin eutectic alloy foil having uniform structure
  • Preparation method for gold-tin eutectic alloy foil having uniform structure

Examples

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Example Embodiment

[0031] Example 1:

[0032] The precise composition is a gold-tin eutectic alloy with a mass percentage of 20% tin and 80% gold mass. The prepared raw materials are placed in a vacuum non-consumable arc melting furnace, and argon gas is introduced into the furnace to remove the furnace. air in the body, and then evacuated until the degree of vacuum reaches 10 -3 After Pa, arc smelting under a working current of 900A, and the peak melting temperature is 1300°C to obtain a gold-tin alloy melt, and the melt is electromagnetically stirred. The electromagnetic stirring speed is 1100r / min, and the stirring time is 1-2 minutes. The water-cooled copper crucible is cooled to room temperature, and the cooling rate is controlled to be 1.0-1.1*10 3 K / min; repeat the smelting, stirring and cooling process 4 times; take out the ingot and keep it at 240℃ for 2 hours, after homogenization annealing, the ingot is then hot compressed at 240℃, the hot compression pressure is 20MPa, the deformati...

Example Embodiment

[0034] Example 2:

[0035] The precise composition is a gold-tin eutectic alloy with a mass percentage of 20% tin and 80% gold mass. The prepared raw materials are placed in a vacuum non-consumable arc melting furnace, and argon gas is introduced into the furnace to remove the furnace. air in the body, and then evacuated until the degree of vacuum reaches 10 -3After Pa, arc smelting under a working current of 950A, and the melting peak temperature is 1300 ° C to obtain a gold-tin alloy melt, and the melt is electromagnetically stirred. The electromagnetic stirring speed is 1300r / min, and the stirring time is 1-2 minutes. The water-cooled copper crucible is cooled to room temperature, and the cooling rate is controlled to be 1.2-1.3*10 3 K / min; repeat the smelting, stirring and cooling process 5 times; take out the ingot and keep it at 250℃ for 3 hours, after homogenization annealing, the ingot is then hot compressed at 250℃, the hot compression pressure is 10MPa, the deformat...

Example Embodiment

[0037] Example 3:

[0038] The precise composition is a gold-tin eutectic alloy with a mass percentage of 20% tin and 80% gold mass. The prepared raw materials are placed in a vacuum non-consumable arc melting furnace, and argon gas is introduced into the furnace to remove the furnace. air in the body, and then evacuated until the degree of vacuum reaches 10 -3 After Pa, arc smelting under a working current of 1000A, and the peak melting temperature is 1300°C to obtain a gold-tin alloy melt. The melt is electromagnetically stirred. The electromagnetic stirring speed is 1500r / min, and the stirring time is 1-2 minutes. Then, use The water-cooled copper crucible is cooled to room temperature, and the cooling rate is controlled to be 1.4-1.5*10 3 K / min; repeat the smelting, stirring and cooling process 6 times; the solidified structure after smelting is as follows figure 1 As shown, it is a full lamellar eutectic structure without primary phase; take out the ingot and keep it at...

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Abstract

The invention relates to a preparation method for a gold-tin eutectic alloy foil having a uniform structure. The preparation method comprises: accurately preparing a gold-tin alloy raw material with a tin mass percentage of 20% and a gold mass percentage of 80%; in a non-consumable electrical arc smelting furnace, under a vacuum degree of 10<-3> Pa, repeatedly carrying out smelting, electromagnetic stirring and cooling at least three times to obtain a gold-tin alloy casting ingot; and carrying out homogenization annealing on the casting ingot, and then carrying out multi-pass thermal compression to obtain the gold-tin eutectic foil. According to the present invention, the vacuum electrical arc smelting, the circular electromagnetic stirring and the cyclic thermal compression to prepare the whole lamellar eutectic structure, wherein the eutectic point component does not have the primary phase; and compared with the preparation method in the prior art, the preparation method of the prevent invention has the following characteristics that: the complete alloying is achieved, the strength is high, the weldability is good, other components are not added or the gold-to-tin ratio is not adjusted, the welding temperature and the welding performance are stable, the welding piece deformation and the force on the welding piece are uniform, the welding piece cracking condition is not easily generated, the yield is high, the production efficiency is much higher than the production efficiency of the electroplating method for preparing the gold-tin welding piece, the production cost is reduced, and the preparation method is suitable for mass production.

Description

technical field [0001] The invention relates to a processing technology of a difficult-to-deform alloy foil, in particular to a preparation method of a gold-tin eutectic alloy foil with uniform structure. The invention belongs to the technical field of metal material preparation. Background technique [0002] For a long time, tin-lead solder has been widely used in electronic packaging. In recent years, due to the increasing health and environmental protection and the improvement of the reliability of solder joints in modern high-power electronic and optoelectronic devices, there is an urgent need for solder with high creep resistance and good thermal fatigue resistance. Au80Sn20 alloy solder with a melting point of 280°C has excellent properties such as high strength, high thermal conductivity, and flux-free. It is an ideal material to replace traditional tin-lead solder, especially in high-reliability circuit packaging and chip soldering. It has received extensive attenti...

Claims

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Application Information

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IPC IPC(8): C22C5/02C22F1/14C22C1/02B22D27/02
Inventor 马运柱黄宇峰刘文胜王依锴汤娅
Owner CENT SOUTH UNIV
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