Method for preparing low dielectric polyimide film by using electrodeposited polyamide acid
A technology of polyimide film and polyamide film, which is applied in the direction of electrolytic coating, electrophoretic plating, electrolytic organic material coating, etc., can solve the problem of difficulty in controlling the size, shape and porosity of pores, the reduction of film mechanical properties, and the cost of raw materials. Advanced problems, to achieve the effect of easy regulation of pore size, smooth and compact surface, and low dielectric constant
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[0038] A kind of preparation method of low dielectric polyetherimide film of the present invention, comprises the following steps:
[0039] (1) Prepare the template
[0040] Disperse the microspheres into the dispersant to prepare a uniform dispersion of the microspheres. Put the clean substrate into the culture bottle, inject an appropriate amount of dispersion liquid into the bottle, put the culture bottle into the incubator, and wait for the solvent to evaporate to prepare the template for electrodeposition. The selected microspheres are silicon dioxide or polystyrene microspheres, and the particle diameter of the microspheres is 5-2000nm. The selected substrates are ITO glass, metal plates (such as copper and aluminum plates), and silicon wafers. The optional temperature range in the incubator is 30-60°C.
[0041] (2) Preparation of polyamic acid emulsion
[0042] (2.1) Dissolve polyamic acid, the precursor of polyimide, in an appropriate organic polar solvent, or add ...
Embodiment 1
[0053] 1. Preparation of template
[0054] Disperse SiO2 microspheres into a solvent to prepare a uniform dispersion of microspheres. Put the clean glass piece into the culture bottle, inject a proper amount of dispersion liquid into the bottle, put the culture bottle into the incubator, wait for the solvent to volatilize to make the template. The selected microspheres are silicon dioxide or polystyrene, and the particle size of the microspheres is 200nm. The temperature in the incubator was 30°C.
[0055] 2. Preparation of Polyamic Acid Emulsion
[0056] 2.1 Add dianhydride and diamine monomers in proportion to dimethylformamide, and heat the stirring plate at 25°C for 10 hours to obtain a polyamic acid solution. The mass fraction of polyamic acid in the film-forming solution is 15%.
[0057] 2.2 Take the polyamic acid solution prepared in step 2.1, cool down to 1°C, add an appropriate amount of triethylamine, stir with a stirrer for 1 hour, and then heat to a temperature...
Embodiment 2
[0066] 1. Preparation of template
[0067] Disperse SiO2 microspheres into a solvent to prepare a uniform dispersion of microspheres. Put the clean glass piece into the culture bottle, inject a proper amount of dispersion liquid into the bottle, put the culture bottle into the incubator, wait for the solvent to volatilize to make the template. The selected microspheres are silicon dioxide or polystyrene, and the particle diameter of the microspheres is 1000 nm. The temperature of the incubator was 60°C.
[0068] 2. Preparation of Polyamic Acid Emulsion
[0069] 2.1 Dissolve polyamic acid, the precursor of polyimide, in an appropriate amount of dimethylacetamide, and heat a stirring plate at 50° C. for 3 hours to obtain a polyamic acid solution. The mass fraction of polyamic acid in the solution is 12%.
[0070] 2.2 Take the polyamic acid solution prepared in step 2.1, cool down to 5°C, add an appropriate amount of tripropylamine, stir for 3 hours, and then heat to a temper...
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