Easy-to-print circuit board silver paste and preparation method thereof

Abstract

An easy-to-print circuit board silver paste is made of the following raw materials by weight portion: 6-8 parts of saturated polyester resin, 3-5 parts of polyurethane resin, 0.1-0.2 parts of polytetrafluoroethylene wax, 3-5 parts of amyl acetate, 8-12 parts of silver-coated glass powder, 65-70 parts of ultrafine silver powder, 3-5 parts of glass powder, 4-6 parts of graphite, 7-10 parts of dimethylbenzene, 0.2-0.4 parts of rosin acid aluminum soap, 5-8 parts of propylene glycol, 1-2 parts of polyisobutene, 1-2 parts of aminopropyltriethoxysilane, 2-3 parts of dipropylene glycol butyl ether, 2-3 parts of capric acid, and 0.2-0.4 parts of fluorine-containing surfactant. Graphite is added to the silver paste of the invention, which increases the conductivity. The easy-to-print circuit board silver paste has good dispersion performance, good lubricity and good printing performance. Through the adding of the silver-coated glass powder, the silver paste has good wetting property and can be well combined with a circuit board, and the circuit board is durable and firm. An organic carrier of the silver paste is resistant to high temperature, the circuit can be kept in good condition before the glass powder is melt, and the yield of circuit board printing is high.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a silver paste for an easy-to-print circuit board and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide powder...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance