LED epitaxial wafer growing on Ag substrate and preparing method and application of LED epitaxial wafer
A technology of LED epitaxial wafers and substrates, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as difficulties in film epitaxy, affecting the quality of epitaxial film growth, and unstable chemical properties of metal Ag substrates. Achieve the effect of improving internal quantum efficiency, avoiding high temperature interface reaction, and uniform current distribution
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Embodiment 1
[0044] A method for preparing an LED epitaxial wafer grown on an Ag substrate, comprising the following steps:
[0045] 1) Selection of the substrate and its crystal orientation: Ag substrate is used, the (111) plane is used as the epitaxial plane, and the crystal epitaxial orientation relationship is: AlN[11-20] / / Ag[1-10];
[0046] 2) Polishing, cleaning and annealing of the substrate surface: first, the surface of the Ag substrate is polished with diamond slurry, and the surface of the substrate is observed with an optical microscope until there are no scratches, and then the chemical mechanical polishing method is used for polishing; Secondly, the Ag substrate was ultrasonically cleaned in deionized water at room temperature for 5 minutes to remove the sticky particles on the surface of the Ag substrate, then washed with acetone and ethanol in order to remove the surface organic matter, and dried with high-purity dry nitrogen; finally, the Ag substrate was The substrate is ...
Embodiment 2
[0060] A method for preparing an LED epitaxial wafer grown on an Ag substrate, comprising the following steps:
[0061] 1) Selection of the substrate and its crystal orientation: Ag substrate is used, the (111) plane is used as the epitaxial plane, and the crystal epitaxial orientation relationship is: AlN[11-20] / / Ag[1-10];
[0062] 2) Polishing, cleaning and annealing of the substrate surface: first, the surface of the Ag substrate is polished with diamond slurry, and the surface of the substrate is observed with an optical microscope until there are no scratches, and then the chemical mechanical polishing method is used for polishing; Secondly, the Ag substrate was ultrasonically cleaned in deionized water at room temperature for 4 minutes to remove the sticky particles on the surface of the Ag substrate, then washed with acetone and ethanol in sequence to remove surface organic matter, and dried with high-purity dry nitrogen; finally, the Ag substrate was The substrate is p...
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