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Cathodic electrophoresis resin diamond wire saw preparation and ultra-high pressure treatment method

A diamond wire saw and cathodic electrophoresis technology, applied in electrolytic coatings, coatings, etc., can solve the problems of difficult control of the surface roughness and surface shape accuracy of the processed crystal, high consumption of abrasive mortar, and low wire speed of the wire saw. Improve photoelectric conversion efficiency, high manufacturing efficiency, and resource saving effects

Active Publication Date: 2016-08-24
SHANDONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has the following disadvantages: high consumption of abrasive mortar and difficulty in processing and recycling, difficulty in controlling the surface roughness and surface shape accuracy of processed crystals, low wire speed of wire saw, and short service life of saw wire, etc.
It not only provides new means for scientific research, but also creates new process conditions for various fields and industries, such as ultra-high pressure polyethylene improves the electrical insulation, chemical resistance, flexibility, transparency and elongation of ordinary vinyl products and impact properties; materials that are brittle under normal pressure may have good plasticity under high pressure. Ultra-high pressure extrusion technology can process many new metal materials. At present, no scholars have studied the use of ultra-high pressure technology to process diamond wire saws.

Method used

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  • Cathodic electrophoresis resin diamond wire saw preparation and ultra-high pressure treatment method
  • Cathodic electrophoresis resin diamond wire saw preparation and ultra-high pressure treatment method
  • Cathodic electrophoresis resin diamond wire saw preparation and ultra-high pressure treatment method

Examples

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Effect test

Embodiment 1

[0051] In the present invention, the preparation method of cathodic electrophoresis resin diamond wire saw and its ultra-high pressure treatment method comprises the following steps:

[0052] Step 1. Preparation of cathodic electrophoresis resin emulsion with diamond suspended, i.e. electrophoretic fluid:

[0053] 1. Preparation of curing agent: In a three-necked flask equipped with 40g of TDI, add 1g of catalyst dibutyltin dilaurate, 30g of solvent ethylene glycol monobutyl ether and 22g of blocking agent methyl ethyl ketoxime, wherein the catalyst contains 10% Ethylene glycol monobutyl ether solution of dibutyltin dilaurate; then control the temperature at 40°C for 0.5h, 50°C for 2h, and 80°C for 4h;

[0054] 2. Prepare the main resin:

[0055] First, add 70g of epoxy resin and 20.9g of ethylene glycol monobutyl ether into the three-necked flask, raise the temperature to 80°C, keep stirring for 0.5h until the epoxy resin is completely dissolved;

[0056] Next, carry out ri...

Embodiment 2

[0071] The difference from Example 1 is that in step one, a certain amount of deionized water is used to dilute to a solid content of 19%; in step four, the ultra-high pressure treatment pressure is 700Mpa, and the treatment time is 3 minutes;

[0072] The diamond wire saw prepared in this example has a uniform diameter from the appearance. Randomly intercept a section of diamond wire saw with good appearance. Take a detection point every 5cm, and take ten points in total. The measured wire saw The average value of the outer diameter is 0.204mm, and the thickness of the resin layer is 12μm. The resin layer is smooth, without scratches, and without balling; under the ultra-depth microscope, it is found that the diamond embedded in the resin layer is about 1 / 2 to 2 / 3 ;Diamond particle density distribution is moderate and uniform;

[0073] The cutting times of the diamond wire saw prepared in this embodiment and the diamond wire saw after deep curing in this embodiment, that is, ...

Embodiment 3

[0075] The difference from Example 1 is that in step one, a certain amount of deionized water is used to dilute to a solid content of 20%; in step four, the ultra-high pressure treatment pressure is 650Mpa,

[0076] The diamond wire saw prepared in this example has a uniform diameter from the appearance; randomly intercept a section of diamond wire saw with good appearance, take a detection point every 5cm, take ten in total, and measure the diameter of the wire saw The average value of the outer diameter is 0.206mm, and the thickness of the resin layer is 13μm. The resin layer is flat, without scratches, and without balling; however, it is found that the diamond embedded in the resin layer is about 2 / 3 under the ultra-depth-of-field microscope; the diamond particle density evenly distributed;

[0077] The cutting times of the diamond wire saw prepared in this embodiment and the diamond wire saw after deep curing in this embodiment, that is, the diamond wire saw without ultra-...

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Abstract

The invention discloses a cathodic electrophoresis resin diamond wire saw preparation method and an ultra-high pressure treatment method thereof, belonging to the field of diamond wire saw preparation. It adopts the electrophoresis method to prepare the diamond wire saw. Firstly, the cathodic electrophoresis resin emulsion is prepared, and then the diamond is added to the prepared emulsion, and the diamond is evenly suspended in the emulsion by intermittent stirring; the pretreated saw The wire passes through the diamond-containing emulsion by electrophoresis, and then undergoes steps such as pre-curing, deep curing, and ultra-high pressure treatment, and finally the diamond wire saw is obtained. The diamond wire saw prepared by the present invention has the advantages of less diamond consumption, uniform sanding, easy control of resin layer thickness, uniform resin layer, abrasive grain holding force, wear resistance and the like, which are superior to resin bonded diamond wire saws.

Description

technical field [0001] The invention belongs to the field of preparation of diamond wire saws, in particular to a diamond wire saw prepared by mixing cathodic electrophoresis resin emulsion with treated diamond, and then preparing diamond wire saws by means of electrophoresis and ultra-high pressure treatment. Background technique [0002] With the rapid development of industries such as semiconductors and solar cells, hard and brittle materials such as silicon and quartz crystals are widely used. In order to reduce production costs, the diameter of processed crystals is gradually increasing, and the requirements for cutting technology are getting higher and higher. Therefore, ordinary processing methods are difficult to meet the cutting needs of precision substrates. [0003] Wire saw cutting has attracted people's attention because of its high quality, low loss, and unaffected by crystal size. Free abrasive wire saw cutting technology has become the first method that peopl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D5/48
Inventor 徐冬梅高军李慧敏张治山刘迪李敏刘建
Owner SHANDONG UNIV OF SCI & TECH
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