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Method for improving sound absorptivity of backing material on basis of graphene oxide (GO)

A graphene, backing technology, applied in the field of materials, to achieve uniform dispersion, not easy to agglomerate and coagulate, and acoustically stable

Active Publication Date: 2014-09-17
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem of high interfacial energy between W powder and epoxy resin (Epoxy), so that W powder and Epoxy can get a good compatibility effect, the present invention provides a new method for improving the sound absorption performance of the backing material based on graphene oxide. The method is to form a W / Epoxy / GO / Epoxy composite film or a W / GO / Epoxy composite film through the layer-by-layer assembly of W, Epoxy and GO, and improve the preparation process of the traditional backing material matrix W and Epoxy. Medium impedance, high attenuation composite film backing material

Method used

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  • Method for improving sound absorptivity of backing material on basis of graphene oxide (GO)
  • Method for improving sound absorptivity of backing material on basis of graphene oxide (GO)
  • Method for improving sound absorptivity of backing material on basis of graphene oxide (GO)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Prepare a composite film containing 60% W from a composite powder of 95% W / 5% Epoxy:

[0049] Epoxy is composed of 3:1 Epoxy A glue and Epoxy B glue. Assuming that the W powder taken out is 3g, take out 0.118g of Epoxy A glue and add it to a large-capacity centrifuge tube, add a small amount of ethanol solution, stir and dilute, then add 0.0394g of Epoxy B glue, and continue stirring. After stirring evenly, add 3g of W powder, and keep stirring at 30~45°C to make the mixture solidify after the ethanol evaporates. The cured product was taken out, ground and sieved through a 400-mesh sieve to obtain a composite powder of 95%W / 5%Epoxy. Weigh the mass of the powder, assuming it is X g, X·95%=Y·60%, Y is the mass of the actually prepared film. Calculate (Y-X) 0.75, which is the mass of Epoxy A glue added, (Y-X) 0.25 is the mass of Epoxy B glue added, pour 95%W / 5%Epoxy compound powder, stir evenly, and vacuum 5min to remove the mixed air bubbles. Cured under natural condi...

Embodiment 2

[0052] A film containing 3% GO was prepared from a composite powder of 95% GO / 5% Epoxy:

[0053] Preparation of GO: ① Mix 1~1.2g of expandable graphite and 1~1.2g of potassium nitrate evenly, put them into a beaker, place the beaker in an ice bath, and stir slowly at a speed of 400~800r / min , pour 20~25ml of concentrated sulfuric acid, stir and react for 10~15min, then slowly add 6~10g of potassium permanganate, then the whole mixture is stirred in an ice bath for 0.5~4h, and ice cubes are constantly added during the stirring process. ②Take the mixture out of the ice bath, heat to 30~40℃, and keep stirring for 2~5h. ③Continue heating the mixture to 85~100℃, and keep it for 0.5~1.5h, take 50~100ml of deionized water dropwise into the mixture, the color of the solution changes from brown to bright yellow; to neutralize excess permanganate Potassium, add a few drops of 30% hydrogen peroxide until the color of the solution no longer changes. ④Continue to add 200~500ml deionized ...

Embodiment 3

[0056] Preparation of 60% W / 3.5% GO / 1% Epoxy composite film: first take out a quantitative GO aqueous solution, dry it completely and then measure the mass to measure the concentration of the GO aqueous solution. The actual concentration is assumed to be 7mg / g. Take 3g of W powder, put it into (3 3.5) / (60 0.007)=25g GO aqueous solution, stir evenly, dry it, roll it into powder, and filter it through a 400-mesh sieve to get the W / GO composite Powder. Then the powder was obtained by the method of Example 1 to obtain a powder coated with 1% Epoxy on the surface, and its mass was weighed as X g. To make a film material containing 60% W, (X·60) / 63.5=Y·60%, where Y is the mass of the film. Add (Y-X) · 0.75 Epoxy A glue and (Y-X) · 0.25 Epoxy B glue, mix with W / GO / 1% Epoxy composite powder, stir evenly, and vacuumize for 5 minutes to remove the mixed air bubbles. Curing at lower temperature for 4 hours, and then sanding to a thickness of 1mm~2mm after complete curing.

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Abstract

The invention relates to a method for improving sound absorptivity of a backing material on the basis of graphene oxide (GO), belonging to the technical field of materials. The method aims to solve the problem of high interfacial energy between W powder and Epoxy, so that the W powder and Epoxy have favorable compatibility. The method 1 comprises the following steps: 1. preparing W / Epoxy compound powder; 2. preparing W / Epoxy / GO compound powder; 3. preparing W / Epoxy / GO / Epoxy compound powder; and 4. preparing a W / Epoxy / GO / Epoxy compound film. The method 2 comprises the following steps: 1. preparing W / GO compound powder; 2. preparing W / GO / Epoxy compound powder; and 3. preparing a W / GO / Epoxy compound film. The W, Epoxy and GO are assembled layer by layer to form the W / Epoxy / GO / Epoxy compound film or W / GO / Epoxy compound film; and the traditional preparation technique of the backing material matrixes W and Epoxy is improved to prepare the medium-impedance high-attenuation compound film backing material.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to a new method for improving the sound absorption performance of a backing material based on graphene oxide (GO). Background technique [0002] The backing material in the ultrasonic probe mainly has two purposes: 1. To match with the piezoelectric crystal material, reduce the vibration frequency of the chip, thereby increasing the frequency bandwidth of the probe; The impact of clutter on the probe can improve the reliability of detection. We know that the closer the acoustic impedance of the backing material and the piezoelectric ceramic is, the greater the sound attenuation will be. The ultrasonic waves excited by the piezoelectric ceramic can enter the backing material most effectively and then be absorbed. The wider the frequency band of the probe, the higher the resolution. the better. Therefore, many scholars at home and abroad are currently devoting themselves to preparin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/10C08K3/08C08K3/04C09C1/62C09C3/06C09C3/10
Inventor 胡平安刘晶晶邱云峰张锐杨慧慧卢越高峰曹文武杨斌
Owner HARBIN INST OF TECH
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