Copper wire nickel-plating electrolyte and preparation method thereof

An electrolyte and nickel-plating technology, applied in the field of copper wire nickel-plating, can solve the problems of low surface tension of chemical nickel-plating solution, high internal stress of nickel-plating layer, uneven nickel-plating layer, etc., and achieves high cathode efficiency and reasonable formula. , the effect of inhibiting the hydrogen evolution reaction

Inactive Publication Date: 2014-09-24
ANHUI NINGGUO TIANCHENG ELECTRICAL APPLIANCES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the surface tension of the electroless nickel plating liquid of this invention is relatively low, the nickel plating layer is uneven, the internal stress of the nickel plating layer is high, the ductility is poor, and the porosity is large

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Take nickel sulfate 350g / L by each component content, sodium hypophosphite 15g / L, boric acid 40g / L, mass fraction is 30% hydrogen peroxide 5g / L, gac 5g / L, lauryl sulfuric acid Sodium 0.15g / L, rare earth additive lanthanum carboxylate 0.5g / L, the balance is deionized water;

[0025] (2) Add the calculated amount of nickel sulfate and sodium hypophosphite into deionized water at 50°C, and fully stir to make them completely dissolve;

[0026] (3) Add the calculated amount of boric acid into deionized water at 50° C., fully stir to make it completely dissolve;

[0027] (4) After mixing the solutions obtained in step (2) and step (3), add a calculated amount of hydrogen peroxide with a mass fraction of 30%, stir for 1 hour, heat to 50°C, and maintain the temperature for 3 hours to drive off excess hydrogen peroxide;

[0028] (5) Adjust the pH value of the plating solution to 5.0 with 5% aqueous sodium hydroxide solution, then add the calculated amount of gac, stir for ...

Embodiment 2

[0032] (1) Take nickel sulfate 300g / L by each component content, sodium hypophosphite 10g / L, boric acid 32g / L, mass fraction is 30% hydrogen peroxide 3g / L, gac 3g / L, lauryl sulfuric acid Sodium 0.05g / L, rare earth additive lanthanum carboxylate 0.5g / L, the balance is deionized water;

[0033] (2) Add the calculated amount of nickel sulfate and sodium hypophosphite into deionized water at 40°C, and fully stir to make them completely dissolve;

[0034] (3) Add the calculated amount of boric acid into deionized water at 40° C., fully stir to make it completely dissolve;

[0035] (4) After mixing the solutions obtained in step (2) and step (3), add a calculated amount of hydrogen peroxide with a mass fraction of 30%, stir for 1 hour, heat to 50°C, and maintain the temperature for 3 hours to drive off excess hydrogen peroxide;

[0036] (5) Adjust the pH value of the plating solution to 5.1 with 5% aqueous sodium hydroxide solution, then add the calculated amount of activated carb...

Embodiment 3

[0040] (1) Take nickel sulfate 330g / L by each component content, sodium hypophosphite 13g / L, boric acid 36g / L, mass fraction is 30% hydrogen peroxide 4g / L, gac 4g / L, lauryl sulfuric acid Sodium 0.1g / L, rare earth additive lanthanum carboxylate 1g / L, the balance is deionized water;

[0041] (2) Add the calculated amount of nickel sulfate and sodium hypophosphite into deionized water at 45°C, and fully stir to make them completely dissolve;

[0042] (3) Add the calculated amount of boric acid into deionized water at 45° C., fully stir to make it completely dissolve;

[0043] (4) After mixing the solutions obtained in step (2) and step (3), add a calculated amount of hydrogen peroxide with a mass fraction of 30%, stir for 1.1 hours, heat to 53°C, and maintain the temperature for 3.5 hours to drive off excess hydrogen peroxide;

[0044] (5) Adjust the pH value of the plating solution to 5.0 with 5% aqueous sodium hydroxide solution, then add the calculated amount of activated ca...

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PUM

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Abstract

The invention relates to the technical field of copper wire nickel plating and discloses copper wire nickel-plating electrolyte and a preparation method thereof. The copper wire nickel-plating electrolyte comprises the following materials: 300-350 g/L of nickel sulfate, 10-15 g/L of sodium hypophosphite, 32-40 g/L of boric acid, 3-5 g/L of hydrogen peroxide, 3-5 g/L of active carbon, 0.05-0.15 g/L of a surfactant, 0.5-2 g/L of a rear-earth additive, and the balance of deionized water. The nickel plating electrolyte disclosed by the invention is reasonable in formula, not too low in pH value, capable of avoiding separating out much hydrogen on a cathode, high in cathode efficiency, and free of needle holes on the coating; the copper wire nickel-plating electrolyte disclosed by the invention is added with the rear-earth additive, so that dispersion capacity of the nickel-plating liquor is remarkably improved; the rear earth elements have a certain effect on inhibiting hydrogen evolution reaction and can improve current density of the nickel-plating liquor.

Description

technical field [0001] The invention relates to the technical field of nickel plating on copper wires, in particular to an electrolytic solution for nickel plating on copper wires and a preparation method thereof. Background technique [0002] Nickel-plated copper wire is widely used in the conductive cores of some rubber insulated wires and cables and the conductive cores of instrument installation wires. The former is to prevent the rubber from sticking and the copper core to become black and brittle after the direct contact between the insulating rubber and the copper wire, and the latter is to improve the solderability of the conductive core. Nickel has good corrosion resistance, is easy to passivate in the air, can withstand strong alkali, and reacts slowly with hydrochloric acid and sulfuric acid. The potential of nickel is negative than that of copper, and the nickel layer on the copper wire after nickel plating can act as an anodic protective layer for copper, so it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12
Inventor 汪洋陈启志
Owner ANHUI NINGGUO TIANCHENG ELECTRICAL APPLIANCES
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