Automatic balance control device and method for copper ion concentration

Abstract

The invention relates to an automatic balance control device and method for copper ion concentration. The device and method are used for automatically adjusting the balance of the copper ion concentration in the process of producing an electroplated copper clad aluminum wire. The device comprises one or more electroplating grooves, a specific groove and an exchanging groove in a sequential connection mode. The specific groove is connected with the electroplating groove through a pipeline, the electroplating groove is connected to a buffering groove through a pipeline, the buffering groove is connected to the specific groove through a pipeline, an automatic pump is further arranged on the pipeline between the specific groove and the buffering groove, a Cu2+ on-line monitor is connected to the buffering groove, a PLC controller is connected to the Cu2+ on-line monitor, a central control module is used for controlling a high-frequency power source to output variable voltage through detecting the concentration of Cu2+ in the buffering groove within a regulated time section, and namely working currents in the specific groove are controlled. In this way, the varying rate of the concentration of Cu2+ in the specific groove is controlled in an adjustable mode, the concentration of copper ions in the electroplating groove is kept at a stable value needed for the technology for a long time, the groove liquid does not need to be kept in a dilution mode, waste liquid is not generated, follow-up processing cost is reduced, and no discharging is generated.

Description

technical field [0001] The invention relates to a copper ion concentration automatic balance control device and a control method thereof, which are used for self-adjustment and balance of copper ion concentration in the production process of electroplating copper-clad aluminum wire rods. Background technique [0002] The copper-clad aluminum structure is a bimetallic composite wire formed by concentrically laminating a layer of copper on an aluminum rod. This composite material combines the functional advantages of aluminum's high-quality electrical conductivity, low cost, and copper's low contact resistance and high chemical stability. and the "third conductor material" after aluminum. The most commonly used copper-clad aluminum preparations are clad welding and electroplating methods, among which the electroplating method has the advantages of being able to produce products with various copper content ratios and low production costs. However, the rinsing water of the ele...

AI Technical Summary

Problems solved by technology

The method of dilution and addition has the following disadvantages: 1. Because of the copper sulfate solution that is diluted, it takes a higher cost to do secondary treatment as refining copper sulfate, and the sulfuric acid in the solution has no way to extract and cause waste. Post-discharge requires cost and will also cause environmental pollution

2. Manual adjustment can only work intermittently, that is, once a period of time, which will also make the bath solution not work at the optimal concentration for a long time. Alth

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