Lead wire frame copper plating method, lead wire frame, lead wire frame row

A lead frame and copper plating technology is applied in the field of lead frames, lead frames that are easier to manufacture and lead frame rows, which can solve the problems of high cost and complex structure, and achieve the effect of saving cost and being beneficial to miniaturization.
CN104112705AActive Publication Date: 2014-10-22NINGBO KANGQIANG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NINGBO KANGQIANG ELECTRONICS CO LTD
Publication Date
2014-10-22

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Abstract

The invention belongs to the field of semiconductor manufacturing, and provides a lead wire frame and a lead wire frame row, for solving the problem about how to miniaturize a package structure. The lead wire frame comprises a chip carrier and multiple lead wires distributed at one side of the chip carrier. The multiple lead wires comprise chip lead wires and pin lead wires. The chip lead wires are connected with the chip carrier. The pin lead wires are broken from the chip carrier. The multiple lead wires are sheet-shaped and are disposed at the same plane. The chip carrier is sheet-shaped and is parallel with yet not coplaner with a plane where the lead wires are located. According to the invention, a lead wire plane and a chip carrier plane are not coplanar, such that a chip can be placed on one surface, which is closer to the lead wire plane, of the chip carrier. The thickness of the chip does not additionally increase the thickness of the chip after overall packaging, and the miniaturization of a chip package structure is facilitated.
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Description

technical field

[0001] The invention belongs to the field of semiconductor manufacturing and relates to a lead frame, in particular to a lead frame and lead frame row which are easier to manufacture. Background technique

[0002] Semiconductor packaging technology is already a very mature process. The lead frame is used as the chip carrier of the integrated circuit. It is a kind of bonding material (gold wire, aluminum wire, copper wire) to realize the internal circuit of the chip and the outer lead. Electrical connection is a key structural component that forms an electrical circuit. It acts as a bridge to connect external wires. Most of the semiconductor integrated blocks require the use of lead frames.

[0003] At present, lead frames basically use copper-based alloys as the main material. However, with the rise of copper prices, the cost of lead frames has risen sharply, which has brought great pressure to enterprises. How to replace copper alloys with new materials ha...

Claims

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