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A kind of lead frame copper plating method, lead frame, lead frame row

A lead frame and copper plating technology, which is applied in the field of lead frames, lead frames and lead frame rows that are easier to manufacture, can solve the problems of high cost and complex structure, and achieve the effect of cost saving and miniaturization

Active Publication Date: 2017-06-13
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing technology provides various solutions to solve this problem. For example, the Chinese patent application number CN201010152911.8 "Aluminum Alloy Lead Frame Applied in Power Semiconductor Components" uses aluminum alloy as the base material, and electroplating more layer electroplating layer, the structure of this scheme is too complicated
Another example is the Chinese patent "Aluminum Lead Frame for Semiconductor QFN / SON Devices" with the application number CN200780011289.5, in which zinc and nickel layers are plated on the part of the lead segment that is not covered by the packaging material, and the cost is relatively high

Method used

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  • A kind of lead frame copper plating method, lead frame, lead frame row
  • A kind of lead frame copper plating method, lead frame, lead frame row
  • A kind of lead frame copper plating method, lead frame, lead frame row

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The lead frame aluminum alloy base is made of the following elements by weight percentage:

[0037] Magnesium: 0.4%, silicon: 0.02%, copper: 0.5%, manganese: 0.02%, chromium: 0.1%, zirconium: 0.05%, and the balance is aluminum and unavoidable impurities.

[0038] Silicon element can strengthen the corrosion resistance of aluminum alloy, improve yield strength and elasticity, but excessive silicon element will reduce the welding performance of alloy materials.

[0039] Manganese can promote grain growth and improve the rigidity of the alloy, but excessive manganese will reduce the corrosion resistance of the alloy.

[0040] Chromium can improve the strength, hardness and toughness of the alloy, so its content is relatively high, but the combination of chromium and aluminum will reduce the resistance of the alloy, which is not conducive to the electrical conductivity of the lead frame.

[0041] The zirconium element improves the thermal stability of the alloy and reduces...

Embodiment 2

[0058] The lead frame aluminum alloy base is made of the following elements by weight percentage:

[0059] Magnesium: 1.0%, silicon: 0.5%, copper: 0.2%, manganese: 0.04%, chromium: 0.3%, zirconium: 0.1%, and the balance is aluminum and unavoidable impurities.

[0060] Copper-plating the aluminum alloy lead frame substrate made according to the following steps:

[0061] Degreasing and degreasing, potion composition and content:

[0062] Sodium hydroxide: 38%, sodium metasilicate: 35%, degreasing agent: 40g / L, degrease and degrease at 50°C-70°C;

[0063] One-time zinc dipping: Put the degreased aluminum alloy substrate into a mixed solution with a concentration of zinc ions of 40g / L, a concentration of iron oxide of 65g / L, and a concentration of sodium hydroxide of 230g / L for zinc dipping, and the zinc dipping temperature is 57 °C; then wash with water at a temperature of 50 °C;

[0064] One-time pickling: put the aluminum alloy substrate after one-time zinc dipping into the ...

Embodiment 3

[0075] The lead frame aluminum alloy base is made of the following elements by weight percentage:

[0076] Magnesium: 1.5%, silicon: 0.8%, copper: 0.2%, manganese: 0.2%, chromium: 0.3%, zirconium: 0.25%, and the balance is aluminum and unavoidable impurities.

[0077] Copper-plating the aluminum alloy lead frame substrate made according to the following steps:

[0078] Degreasing and degreasing, potion composition and content:

[0079] Sodium hydroxide: 45%, sodium metasilicate: 40%, degreasing agent: 40g / L, degrease and degrease at 50°C-70°C;

[0080] One-time zinc dipping: Put the degreased aluminum alloy substrate into a mixed solution with a zinc ion concentration of 45g / L, an iron oxide concentration of 70g / L, and a sodium hydroxide concentration of 250g / L for zinc dipping, and the zinc dipping temperature is 60 °C; then wash with water at a temperature of 50 °C;

[0081] One-time pickling: put the aluminum alloy substrate after one-time galvanizing into a nitric acid ...

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Abstract

The invention provides a lead frame and a lead frame row, belongs to the field of semiconductor manufacturing, and solves the problem of how to miniaturize the packaging structure. The lead frame includes a chip seat and a plurality of leads distributed on one side of the chip seat, the plurality of leads include chip leads and pin leads, the chip leads are connected to the chip seat, and the pin leads are connected to the chip seat. The chip seat is disconnected, the plurality of leads are sheet-shaped and on the same plane, and the chip seat is sheet-shaped and parallel to the plane where the leads are located but not coplanar. With the non-coplanar lead plane and die paddle plane, the chip can be placed on a surface of the die paddle that is closer to the lead plane. Therefore, the thickness of the chip will not increase the thickness of the whole packaged chip, which is beneficial to the miniaturization of the chip packaging structure.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing and relates to a lead frame, in particular to a lead frame and lead frame row which are easier to manufacture. Background technique [0002] Semiconductor packaging technology is already a very mature process. The lead frame is used as the chip carrier of the integrated circuit. It is a kind of bonding material (gold wire, aluminum wire, copper wire) to realize the internal circuit of the chip and the outer lead. Electrical connection is a key structural component that forms an electrical circuit. It acts as a bridge to connect external wires. Most of the semiconductor integrated blocks require the use of lead frames. [0003] At present, lead frames basically use copper-based alloys as the main material. However, with the rise of copper prices, the cost of lead frames has risen sharply, which has brought great pressure to enterprises. How to replace copper alloys with new materials ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L23/495
CPCH01L24/97
Inventor 郑康定曹光伟冯小龙段华平马叶军
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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