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Manufacturing process of polycrystalline silicon cast ingot

A production process, polysilicon technology, applied in the direction of polycrystalline material growth, crystal growth, chemical instruments and methods, etc., can solve problems such as reducing the life of the interceptor, reduce the impurity concentration, improve the conversion efficiency of solar cells, and improve the quality and production. The effect of efficiency

Inactive Publication Date: 2014-10-29
无锡尚品太阳能电力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among these impurities, the diffusion coefficient of iron is relatively small, but most of them still form precipitates during slow cooling treatment. These elements form deep energy levels in the forbidden band of silicon, thus becoming recombination centers, which can significantly reduce the minority interception of materials. sub life

Method used

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  • Manufacturing process of polycrystalline silicon cast ingot
  • Manufacturing process of polycrystalline silicon cast ingot

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0053] Embodiment one: a kind of manufacturing process of polysilicon ingot, comprises following process step:

[0054] (1) Raw materials: primary polysilicon, polysilicon scraps, polysilicon tailings and broken silicon wafers;

[0055] (2) Cleaning of raw materials: Clean the polycrystalline edge skin and polycrystalline tailings with a mixed solution of nitric acid and hydrofluoric acid, the volume ratio of nitric acid and hydrofluoric acid is 11.8:2, the cleaning time is 2 minutes, and finally clean them with pure water Rinse until neutral; the broken silicon chips are cleaned with a mixed solution of nitric acid and hydrofluoric acid, the mass ratio of nitric acid and hydrofluoric acid is 11.8:1, the cleaning time is 1 minute, and finally rinsed with pure water under ultrasonic conditions to Neutral, ultrasonic power is 2.8KW; The mass percentage concentration of described nitric acid is 65%, and the mass percentage concentration of hydrofluoric acid is 45%;

[0056] (3) ...

Embodiment 2

[0093] Embodiment two: a kind of manufacturing process of polysilicon ingot, comprises following process step:

[0094] (1) Raw materials: primary polysilicon, polysilicon scraps, polysilicon tailings and broken silicon wafers;

[0095] (2) Cleaning of raw materials: Clean the polycrystalline edge skin and polycrystalline tailings with a mixed solution of nitric acid and hydrofluoric acid. The volume ratio of nitric acid and hydrofluoric acid is 12:2, and the cleaning time is 3 minutes. Finally, clean them with pure water Rinse until neutral; the broken silicon chips are cleaned with a mixed solution of nitric acid and hydrofluoric acid, the mass ratio of nitric acid and hydrofluoric acid is 12:1, the cleaning time is 3 minutes, and finally rinsed with pure water under ultrasonic conditions to Neutral, ultrasonic power is 3KW; The mass percent concentration of described nitric acid is 70%, and the mass percent concentration of hydrofluoric acid is 49%;

[0096] (3) Pack prima...

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Abstract

The invention relates to a manufacturing process of a polycrystalline silicon cast ingot. The manufacturing process is characterized by comprising the following processing steps: (1) preparing raw materials including primary polycrystalline silicon, polycrystalline flaw-pieces, polycrystalline tailings and smashed silicon wafers, after cleaning the raw materials, placing in a crucible and delivering the crucible into an ingot furnace; (2) vacuumizing the ingot furnace and detecting leakage when the vacuum degree of the furnace chamber is 0.006mbar, wherein qualification is acquired when the pressure recovery within 5 minutes is less than 0.015mbar; (3) after leakage detection, carrying out a four-step heating process; (4) carrying out a twelve-step melting process; (5) carrying out an eight-step crystal growing process; (6) carrying out a five-step cooling process; (7) after cooling, opening the ingot furnace when the temperature inside the furnace is lower than 40 DEG C and argon filled to the furnace reaches 980mbar, taking out the crucible with the ingot for naturally cooling, and disassembling the crucible when the crucible is cooled to room temperature to obtain the polycrystalline silicon cast ingot. The manufacturing process of the polycrystalline silicon cast ingot provided by the invention can reduce impurity concentration, improve the quality and production efficiency of the silicon ingot and improve the solar battery conversion efficiency of the silicon wafer.

Description

technical field [0001] The invention relates to a manufacturing process of a polycrystalline silicon ingot, in particular to a manufacturing process of a polycrystalline silicon ingot excluding impurities, and belongs to the field of photovoltaic technology. Background technique [0002] With the promotion of green energy worldwide and the rapid development of the semiconductor industry in recent years, ingot polysilicon has successfully replaced Czochralski monocrystalline silicon as the most important solar cell material. High-density impurities in cast polysilicon are important factors affecting the conversion efficiency of solar cells. In-depth research on the removal of impurities is conducive to the production of cast polysilicon ingots with high yields, reducing the production cost of polysilicon solar cells, and is also a prerequisite for manufacturing high-efficiency polysilicon solar cells. [0003] Cast polycrystalline silicon ingots are usually in the shape of a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B28/06C30B29/06
Inventor 杜正兴李靖张安国
Owner 无锡尚品太阳能电力科技有限公司
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