Manufacturing process of polycrystalline silicon cast ingot
A production process, polysilicon technology, applied in the direction of polycrystalline material growth, crystal growth, chemical instruments and methods, etc., can solve problems such as reducing the life of the interceptor, reduce the impurity concentration, improve the conversion efficiency of solar cells, and improve the quality and production. The effect of efficiency
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Embodiment 1
[0053] Embodiment one: a kind of manufacturing process of polysilicon ingot, comprises following process step:
[0054] (1) Raw materials: primary polysilicon, polysilicon scraps, polysilicon tailings and broken silicon wafers;
[0055] (2) Cleaning of raw materials: Clean the polycrystalline edge skin and polycrystalline tailings with a mixed solution of nitric acid and hydrofluoric acid, the volume ratio of nitric acid and hydrofluoric acid is 11.8:2, the cleaning time is 2 minutes, and finally clean them with pure water Rinse until neutral; the broken silicon chips are cleaned with a mixed solution of nitric acid and hydrofluoric acid, the mass ratio of nitric acid and hydrofluoric acid is 11.8:1, the cleaning time is 1 minute, and finally rinsed with pure water under ultrasonic conditions to Neutral, ultrasonic power is 2.8KW; The mass percentage concentration of described nitric acid is 65%, and the mass percentage concentration of hydrofluoric acid is 45%;
[0056] (3) ...
Embodiment 2
[0093] Embodiment two: a kind of manufacturing process of polysilicon ingot, comprises following process step:
[0094] (1) Raw materials: primary polysilicon, polysilicon scraps, polysilicon tailings and broken silicon wafers;
[0095] (2) Cleaning of raw materials: Clean the polycrystalline edge skin and polycrystalline tailings with a mixed solution of nitric acid and hydrofluoric acid. The volume ratio of nitric acid and hydrofluoric acid is 12:2, and the cleaning time is 3 minutes. Finally, clean them with pure water Rinse until neutral; the broken silicon chips are cleaned with a mixed solution of nitric acid and hydrofluoric acid, the mass ratio of nitric acid and hydrofluoric acid is 12:1, the cleaning time is 3 minutes, and finally rinsed with pure water under ultrasonic conditions to Neutral, ultrasonic power is 3KW; The mass percent concentration of described nitric acid is 70%, and the mass percent concentration of hydrofluoric acid is 49%;
[0096] (3) Pack prima...
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